Patent Assignment
Reel/Frame 005404/0482
Change of Name 10-11-89 Ca
Recorded: 1990-08-09
Pages: 9
Assignor
ANICON, INC.,
Executed: 1989-07-26
Assignee
Covered Properties
(30)
Method and Apparatus for Removal of by-Products of Chemical Vapor Deposition from Oil for Vacuum Pump
Patent:
4,228,004 →
Application:
06/029,525 →
Closure for Thermal Reactor
Patent:
4,253,417 →
Application:
06/123,243 →
Mass Flow Controller
Patent:
4,658,855 →
Application:
06/193,876 →
Gas Control System for Chemical Vapor Deposition System
Patent:
4,369,031 →
Application:
06/302,003 →
Improvement in Processing Silicon Wafers Employing Processing Gas Atmospheres of Similar Molecular Weight
Patent:
4,376,796 →
Application:
06/315,572 →
Chemical Vapor Deposition Apparatus
Patent:
4,545,327 →
Application:
06/412,237 →
Apparatus and Process for Sputter Deposition of Reached Thin Films
Patent:
4,420,385 →
Application:
06/485,556 →
Process and Apparatus for Low Pressure Chemical Vapor Deposition of Refractory Metal
Patent:
4,619,840 →
Application:
06/497,321 →
Chemical Vapor Deposition Apparatus
Patent:
4,539,933 →
Application:
06/528,193 →
Substrate Loading Means for a Chemical Vapor Deposition Apparatus
Patent:
4,524,719 →
Application:
06/529,415 →
Chemical Vapor Deposition Wafer Boat
Patent:
4,582,020 →
Application:
06/607,065 →
Process for Deposition of Borophosphosilicate Glass
Patent:
4,557,950 →
Application:
06/611,793 →
Chemical Vapor Deposition Wafer Boat
Patent:
4,548,159 →
Application:
06/628,542 →
Hemical Vapor Deposition Process
Patent:
4,547,404 →
Application:
06/657,313 →
Method of Loading and Unloading a Furnace
Patent:
4,636,140 →
Application:
06/719,409 →
Chemical Vapor Deposition Wafer Boat
Patent:
4,641,604 →
Application:
06/804,954 →
Pulsewidth Modulated Pressure Control System for Chemical Vapor Deposition Apparatus
Patent:
4,728,869 →
Application:
06/845,212 →
Semiconductor Wafer Carrier Input/Output Drawer
Patent:
4,934,767 →
Application:
06/863,960 →
Semiconductor Wafer Carrier Transport Apparatus
Patent:
4,722,659 →
Application:
06/863,961 →
Wafer Boat Transfer Tool
Patent:
4,728,246 →
Application:
06/863,963 →
Diffusion Furnace Multizone Temperature Control
Patent:
4,711,989 →
Application:
06/864,676 →
Process for Low Pressure Chemical Vapor Deposition of Refractory Metal
Patent:
4,726,961 →
Application:
06/874,754 →
Semiconductor Wafer Furnace Door
Patent:
4,692,115 →
Application:
06/880,422 →
Semiconductor Wafer Boat Loader Control System
Patent:
4,684,863 →
Application:
06/880,423 →
Semiconductor Wafer Boat Loader Releasable Mounting
Patent:
4,721,424 →
Application:
06/880,460 →
Low Temperature Silicon Nitride Cvd Process
Patent:
4,720,395 →
Application:
06/899,923 →
Gas Scavenger
Patent:
4,711,197 →
Application:
06/919,736 →
Wafer Transfer Stand
Patent:
4,721,427 →
Application:
07/048,868 →
Process and Apparatus for Low Pressure Chemical Vapor Deposition of Refractory Metal
Patent:
4,817,557 →
Application:
07/092,967 →
Hot Wall Diffusion Furnace and Method for Operating the Furnace
Patent:
4,886,954 →
Application:
07/181,787 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Oct 27, 1981
From: ARRASMITH, ROBERT D.; BARNHART, THOMAS R.; GOLDMAN, JON C.
To: THEMO PRODUCTS CORPORATION, ORANGE CA. A CORP. OF
Reel/Frame 003941/0591 →
Assignment of Assignors Interest.
Jun 23, 1982
From: GOLDMAN, JON C.; RAPPAPORT, ROBERT E.
To: THERMCO PRODUCTS CORPORATION, A CORP. OF CA.
Reel/Frame 004008/0915 →
Assignment of Assignors Interest.
Oct 7, 1982
From: CAMPBELL, BRYANT A.; MILLER, NICHOLAS E.
To: ANICON, INC., A CORP. OF CA.
Reel/Frame 004053/0824 →
Assignment of Assignors Interest.
Apr 15, 1983
From: HARTSOUGH, LARRY D.
To: GRYPHON PRODUCTS
Reel/Frame 004118/0361 →
Assignment of Assignors Interest.
May 23, 1983
From: DIEM, MICHAEL; FISK, MICHAEL A.; GOLDMAN, JON C.
To: THERMCO PRODUCTS CORPORATION, A CORP. OF CA.
Reel/Frame 004133/0345 →
Assignment of Assignors Interest.
Oct 17, 1983
From: CAMPBELL, BRYANT A.; DU BOIS, DALE R.; MANRIQUEZ, RALPH F.; MILLER, NICHOLAS E.
To: ANICON, INC.
Reel/Frame 004177/0935 →
Assignment of Assignors Interest.
Oct 17, 1983
From: CAMPBELL, BRYANT A.; DUBOIS, DALE R.; MANRIQUEZ, RALPH F.; MILLER, NICHOLAS E.
To: ANICON, INC., A CA CORP.
Reel/Frame 004179/0140 →
Assignment of Assignors Interest.
May 18, 1984
From: FOSTER, THOMAS C.; GOLDMAN, JON C.; HOEYE, GARY W.
To: THERMCO PRODUCTS CORPORATION
Reel/Frame 004263/0647 →
Change of Name Effective July 10, 1984
Feb 8, 1985
From: THERMCO PRODUCTS CORPORATION
To: THERMCO SYSTEMS, INC.
Reel/Frame 004359/0602 →
Assignment of Assignors Interest.
Jul 5, 1985
From: FOSTER, DERRICK W.; HERRING, ROBERT B.
To: ANICON INC.
Reel/Frame 004422/0636 →
Assignment of Assignors Interest.
Sep 27, 1985
From: ALDRIDGE, ROBERT E.; ELLOWAY, RUSSELL; FRITZ, WILLIAM O.; GOFF, RALPH D.
To: THERMCO SYSTEMS, INC., 1465 NORTH BATAVIA AVENUE, ORANGE, CALIFORNIA, 92668, A CORP OF CA.
Reel/Frame 004465/0155 →
Assignment of Assignors Interest.
Nov 25, 1985
From: LEARN, ARTHUR J.; DUBOIS, DALE R.
To: ANICON, INC., A CORP OF CA.
Reel/Frame 004480/0488 →
Assignment of Assignors Interest.
Mar 27, 1986
From: JOHNSON, NOEL H.; ELLIOTT, GARY C.
To: ANCION, INC, A CORP. OF CA.
Reel/Frame 004533/0167 →
Assignment of Assignors Interest.
May 16, 1986
From: HOYT, HAZEN L. III; SANDERS, JOHN D.; GOLDMAN, JON C.; MELLO, WILLIAM R.
To: THERMCO SYSTEMS, INC.
Reel/Frame 004557/0397 →
Assignment of Assignors Interest.
May 16, 1986
From: MELLO, WILLIAM R.
To: THERMCO SYSTEMS, INC.
Reel/Frame 004556/0336 →
Assignment of Assignors Interest.
May 16, 1986
From: HOYT, HAZEN L. III; GOLDMAN, JON C.; MELLO, WILLIAM R.
To: THERMCO SYSTEMS, INC.; THERMCO SYSTEMS, INC
Reel/Frame 004557/0399 →
Assignment of Assignors Interest.
May 19, 1986
From: YU, CHORNG-TAO
To: THERMCO SYSTEMS, INC.
Reel/Frame 004556/0852 →
Assignment of Assignors Interest.
Jan 17, 1989
From: THERMCO SYSTEMS, INC.
To: ANICON, INC., A CORP. OF CA.
Reel/Frame 005009/0076 →
Assignment of Assignors Interest.
Nov 6, 1989
From: GRYPHON PRODUCTS, INC.
To: SILICON VALLEY GROUP, INC.
Reel/Frame 005178/0933 →
Assignment of Assignors Interest.
Nov 6, 1989
From: THERMCO SYSTEMS, INC.
To: ANICON, INC.
Reel/Frame 005178/0909 →
Assignment of Assignors Interest.
Jun 25, 1990
From: SILICON VALLEY GROUP, INC.
To: RYAN TECHNICAL SERVICES, INC., A CORP. OF CA
Reel/Frame 005362/0750 →
Assignment of Assignors Interest.
Jun 25, 1990
From: RYAN TECHNICAL SERVICES, INC.
To: DEPOSITION SCIENCES, INC., A CORP. OF CA
Reel/Frame 005362/0756 →
Security Interest
Jul 17, 1990
From: SILICON VALLEY GROUP, INC.
To: BANK OF AMERICA NATIONAL TRUST AND SAVINGS ASSOCIATION, A NATIONAL BANKING ASSOCIATION
Reel/Frame 005443/0382 →
Merger 3-23-90 Delaware
Aug 9, 1990
From: THERMCO SYSTEMS, INC., A CORP OF CA
To: SILICON VALLEY GROUP, INC.
Reel/Frame 005404/0469 →
Merger 3-23-90 Delaware
Aug 9, 1990
From: THERMCO SYSTEMS, INC., A CORP OF CA
To: SILICON VALLEY GROUP, INC.
Reel/Frame 005404/0458 →