Patent Assignment
Reel/Frame 030065/0001
Assignment of Assignor's Interest
Recorded: 2013-03-22
Received: 2013-03-22
Pages: 7
Assignor
CONTINENTAL AKTIENGESELLSCHAFT
Executed: 2013-03-08
Assignee
CONTINENTAL REIFEN DEUTSCHLAND GMBH
VAHRENWALDER STRASSE 9, HANNOVER, DEX, D-30165, GERMANY
Covered Properties
(43)
Method for Purifying Active Polypeptides or Immunoconjugates
Application:
13/813,083 →
Handling Mismatch of Cryptographic Keys and Related Battery Drain and Communication Exchange Failures
Application:
13/848,757 →
Location Aggregation System
Application:
13/848,777 →
Query Suggestions for a Document Based on User History
Application:
13/773,893 →
Boot from Modified Image
Application:
13/724,193 →
Traversing Time of Arrival Probe
Application:
13/719,575 →
Techniques For Redirecting Input/Output
Application:
13/718,805 →
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application:
13/672,067 →
Semiconductor Packaging Process Using Through Silicon Vias
Application:
13/488,930 →
Remote Controlled Studio Camera System
Application:
13/397,619 →
Tire Vulcanizing Mold and Tire Produced with the Tire Vulcanizing Mold
Application:
12/842,232 →
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application:
12/784,841 →
Pneumatic Vehicle Tire with Protected Sidewall Markings
Application:
12/706,090 →
Vehicle Tires Having Coated Tread
Application:
12/505,707 →
Candle Bowl
Application:
29/327,015 →
Candle Jar
Application:
29/327,014 →
Method for Producing a Tread Rubber for a Vehicle Tire, in Particular a Pneumatic Vehicle Tire
Application:
12/258,882 →
Pneumatic Vehicle Tire with Reinforced Tread
Application:
12/188,484 →
Semiconductor Packaging Process Using Through Silicon Vias
Application:
12/221,204 →
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application:
12/072,508 →
Pneumatic Vehicle Tire with Reinforced Bead Construction
Application:
11/968,397 →
Method and Apparatus That Can Be Used in the Automated Construction of a Vehicle Tire
Application:
11/915,068 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
11/894,473 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
11/891,867 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application:
11/789,694 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
11/699,852 →
Wafer Level Chip Packaging
Application:
11/655,777 →
Microelectronic Assembly with Multi-Layer Support Structure
Application:
11/650,356 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application:
11/590,616 →
Integrated Circuit Device
Application:
11/588,439 →
Chip Packages with Covers
Application:
11/588,489 →
Integrated circuit device
Application:
11/588,490 →
Jar
Application:
29/239,395 →
Jar
Application:
29/239,374 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
11/125,624 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
10/884,058 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application:
10/451,564 →
Filled/Containerized Candle Lid and Burn Control Device
Application:
10/813,364 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application:
10/462,576 →
Integrated Circuit Device
Application:
10/385,555 →
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Application:
10/277,498 →
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Application:
09/922,770 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application:
09/758,906 →