IP Library › Assignment 030172/0092
Patent Assignment
Reel/Frame 030172/0092

Assignment of Assignor's Interest

Recorded: 2013-04-08 Pages: 7
Assignor
SOLID STATE MEASUREMENTS, INC.
Executed: 2013-03-04
Assignee
SEMICONDUCTOR PHYSICS LABORATORY, INC.
PRIELLE KORNELIA U. 2., BUDAPEST, 1117, HUNGARY
Covered Properties (15)
Spreading Resistance Profiling System
Patent: 6,052,653 →
Application: 08/890,775 →
Noncontact Capacitance Measuring Device
Patent: 6,150,832 →
Application: 09/273,190 →
Apparatus for Localized Measurements of Complex Permittivity of a Material
Patent: 6,597,185 →
Application: 09/665,370 →
Non-Invasive Electrical Measurement of Semiconductor Wafers
Patent: 6,492,827 →
Application: 09/692,659 →
High Speed Threshold Voltage and Average Surface Doping Measurements
Patent: 6,657,454 →
Application: 10/099,207 →
Publication: US 2003/0173988
Method of Detecting Carrier Dose of a Semiconductor Wafer
Patent: 6,741,093 →
Application: 10/100,437 →
Publication: US 2002/0180474
Non-Invasive Electrical Measurement of Semiconductor Wafers
Patent: 6,842,029 →
Application: 10/120,661 →
Publication: US 2003/0227292
Apparatus and Method for Determining Doping Concentration of a Semiconductor Wafer
Patent: 6,632,691 →
Application: 10/120,734 →
System and Method for Quantitative Measurements of a Material's Complex Permittivity with Use of Near-Field Microwave Probes
Patent: 6,856,140 →
Application: 10/412,295 →
Publication: US 2004/0004484
Semiconductor Substrate Surface Preparation Using High Temperature Convection Heating
Patent: 7,063,992 →
Application: 10/637,447 →
Publication: US 2005/0028836
Method of Electrical Characterization of a Silicon-on-Insulator ( Soi) Wafer
Patent: 6,991,948 →
Application: 10/701,841 →
Publication: US 2005/0095728
Method of Measuring Semiconductor Wafers with an Oxide Enhanced Probe
Patent: 7,282,941 →
Application: 11/099,114 →
Publication: US 2006/0219658
Method and System for Measurement of Dielectric Constant of Thin Films Using a Near Field Microwave Probe
Patent: 7,285,963 →
Application: 11/101,517 →
Publication: US 2005/0230619
Method and System for Non-Contact Measurement of Microwave Capacitance of Miniature Structures of Integrated Circuits
Patent: 7,102,363 →
Application: 11/137,550 →
Publication: US 2005/0225333
Method and System for Measurement of Sidewall Damage in Etched Dielectric Structures Using a Near Field Microwave Probe
Patent: 7,362,108 →
Application: 11/249,705 →
Publication: US 2006/0087305
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 1998
From: MAZUR, ROBERT G.; STEPHENSON, ROBERT C.; ANDY, MARK J.; HARTFORD, CATHERINE L.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 008940/0711 →
Assignment of Assignor's Interest Jun 14, 1999
From: MAZUR, ROBERT G.; HILLARD, ROBERT J.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 010022/0299 →
Assignment of Assignor's Interest Sep 20, 2000
From: TALANOV, VLADIMIR VLADIMIROVICH; CHRISTEN, HANS M.; MORELAND, ROBERT
To: NEOCERA, INC.
Reel/Frame 011132/0881 →
Assignment of Assignor's Interest Mar 15, 2002
From: HOWLAND, WILLIAM H.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 012703/0479 →
Assignment of Assignor's Interest Mar 18, 2002
From: HOWLAND, WILLIAM H.; HILLARD, ROBERT J.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 012716/0132 →
Assignment of Assignor's Interest Apr 11, 2002
From: HOWLAND, WILLIAM H.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 012794/0073 →
Assignment of Assignor's Interest Apr 11, 2002
From: HOWLAND, WILLIAM H.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 012796/0095 →
Assignment of Assignor's Interest Sep 9, 2002
From: MAZUR, ROBERT G.; HILLARD, ROBERT J.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 013273/0088 →
Assignment of Assignor's Interest Apr 14, 2003
From: TALANOV, VLADIMIR V.; MORELAND, ROBERT L.; SCHWARTZ, ANDREW R.; CHRISTEN, HANS M.
To: NEOCERA, INC.
Reel/Frame 013976/0104 →
Assignment of Assignor's Interest Aug 8, 2003
From: ADAMS, MICHAEL J.; HEALY, JAMES JR.; HOWLAND, WILLIAM H. JR.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 014388/0765 →
Assignment of Assignor's Interest Nov 5, 2003
From: HILLARD, ROBERT J.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 014684/0399 →
Assignment of Assignor's Interest Apr 5, 2005
From: HOWLAND, JR., WILLIAM H.
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 016455/0510 →
Assignment of Assignor's Interest Apr 20, 2005
From: TALANOV, VLADIMIR V.; SCHWARTZ, ANDREW R.; SCHERZ, ANDRE; MORELAND, ROBERT L.
To: NEOCERA, INC.
Reel/Frame 016114/0071 →
Assignment of Assignor's Interest Jun 15, 2005
From: TALANOV, VLADIMIR V.; SCHWARTZ, ANDREW R.
To: NEOCERA, INC.
Reel/Frame 016335/0640 →
Assignment of Assignor's Interest Oct 25, 2005
From: TALANOV, VLADIMIR V.; SCHWARTZ, ANDREW R.; SCHERZ, ANDRE
To: NEOCERA, INC.
Reel/Frame 016936/0691 →
Assignment of Assignor's Interest Nov 17, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018545/0376 →
Assignment of Assignor's Interest Nov 17, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018548/0542 →
Assignment of Assignor's Interest Nov 17, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018545/0387 →
Assignment of Assignor's Interest Nov 17, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018545/0356 →
Assignment of Assignor's Interest Nov 17, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018549/0045 →
Record the Correct Serial Number 11/294705 of the for the Application, Previously Recorded on Reel 18548/Frame 542. Dec 7, 2006
From: NEOCERA, INC.
To: NEOCERA, LLC
Reel/Frame 018614/0708 →
Assignment of Assignor's Interest Jan 24, 2007
From: NEOCERA, LLC
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 018787/0978 →
Assignment of Assignor's Interest Mar 13, 2007
From: NEOCERA, LLC
To: SOLID STATE MEASUREMENTS, INC.
Reel/Frame 019002/0317 →