Patent Assignment
Reel/Frame 032765/0312
Assignment of Assignor's Interest
Recorded: 2014-04-28
Pages: 11
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2014-04-22
Assignee
ROUND ROCK RESEARCH, LLC
101 HUDSON STREET, SUITE 2100, JERSEY CITY, NEW JERSEY, 07302
Covered Properties
(42)
In Situ Plasma Pre-Deposition Wafer Treatment in Chemical Vapor Deposition Technology for Semiconductor Integrated Circuit Applications
Patent:
6,136,690 →
Application:
09/023,523 →
Methods and Structures for Metal Interconnections in Integrated Circuits
Patent:
6,121,126 →
Application:
09/030,430 →
Simplified Switching Hub for Data Communication Networks
Patent:
6,763,030 →
Application:
09/129,108 →
Small Outline Rambus in-Line Memory Module
Patent:
6,061,263 →
Application:
09/221,804 →
Bus Arbitration
Patent:
6,654,833 →
Application:
09/363,547 →
In Situ Plasma Pre-Deposition Wafer Treatment in Chemical Vapor Deposition Technology for Semiconductor Integrated Circuit Applications
Small Outline Memory Module
Patent:
6,137,709 →
Application:
09/499,084 →
In Situ Plasma Pre-Deposition Wafer Treatment in Chemical Vapor Deposition Technology for Semiconductor Integrated Circuit Applications
Patent:
6,472,309 →
Application:
09/505,608 →
Print Head for Ejecting Liquid Droplets
Patent:
6,435,396 →
Application:
09/546,084 →
Methods and Structures for Metal Interconnections in Integrated Circuits
Patent:
6,504,224 →
Application:
09/651,471 →
Etch Stop in Damascene Interconnect Structure and Method of Making
Patent:
6,395,632 →
Application:
09/653,562 →
Link Bus for a Hub Based Computer Architecture
Micro C-4 Semiconductor Die and Method for Depositing Connection Sites Thereon
Methods for Insitu Plasma Pre-Deposition Wafer Treatment in Chemical Vapor Deposition Technology for Semiconductor Integrated Circuit Applications
Etch Stop in Damascene Interconnect Structure and Method of Making
Print Head for Ejecting Liquid Droplets and Associated Methods
Transparent Sdram in an Embedded Environment
In Situ Plasma Pre-Deposition Wafer Treatment in Chemical Vapor Deposition Technology for Semiconductor Integrated Circuit Applications and Structures Fabricated Using the Treatment
Etch Stop in Damascene Interconnect Structure and Method of Making
Mode Selection in a Flash Memory Device
Distributed Configuration Storage
Methods and Structures for Metal Interconnections in Integrated Circuits
Electronic Systems, Constructions for Detecting Properties of Objects, and Assemblies for Identifying Persons
Micro C-4 Semiconductor Die
System for Depositing Connection Sites on Micro C-4 Semiconductor Die
Etch Stop in Damascene Interconnect Structure and Method of Making
Bus Arbitration Using Monitored Windows of Time
Atomic Layer Deposition of Cmos Gates with Variable Work Functions
Passivation Processes for Use with Metallization Techniques
Apparatus and Methods for Transmitting Data to a Device Having Distributed Configuration Storage
Apparatus and Methods for the Automated Creation of Distributed Configuration Storage
Mode Selection in a Flash Memory Device
Methods for Machine Detection of Al Least One Aspect of an Object, Methods for Machine Identification of a Person, and Methods of Forming Electronic Systems
Methods and Structures for Metal Interconnections in Integrated Circuits
Etch Stop in a Damascene Interconnect Structure
Transparent Sdram in an Embedded Environment
Distributed Configuration Storage
Mode Selection in a Flash Memory Device
Sata Mass Storage Device Emulation on a Pcie Interface
Data Integrity in Memory Controllers and Methods
Sata Mass Storage Device Emulation on a Pcie Interface
Data Integrity in Memory Controllers and Methods
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 13, 1998
From: LI, WEIMIN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 008988/0598 →
Assignment of Assignor's Interest
Feb 25, 1998
From: AHN, KIE Y.; FORBES, LEONARD; FARRAR, PAUL A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 009024/0862 →
Assignment of Assignor's Interest
Feb 23, 1999
From: BOAZ, TED L.; MOORE, CHRISTOPHER S.; NAGARAJ, RAVIPRAKASH
To: INTEL CORPORATION
Reel/Frame 009804/0941 →
Assignment of Assignor's Interest
Jul 29, 1999
From: LABERGE, PAUL A.
To: MICRON ELECTRONICS, INC.
Reel/Frame 010139/0676 →
Assignment of Assignor's Interest
Apr 10, 2000
From: ELDRIDGE, JEROME M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 010732/0785 →
Assignment of Assignor's Interest
May 2, 2000
From: MICRON ELECTRONICS, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 010763/0572 →
Assignment of Assignor's Interest
Dec 7, 2000
From: PORTERFIELD, A. KENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 011348/0182 →
Assignment of Assignor's Interest
Dec 18, 2000
From: FARRAR, PAUL A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 011381/0653 →
Assignment of Assignor's Interest
Feb 2, 2001
From: FARRAR, PAUL A.; ELDRIDGE, JEROME
To: MICRON TECHNOLOGY, INC.
Reel/Frame 011512/0608 →
Assignment of Assignor's Interest
Oct 28, 2002
From: MUSIC SEMICONDUCTORS, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 013484/0302 →
Assignment of Assignor's Interest
Jan 15, 2003
From: REGEV, ALON; REGEV, ZVI
To: INNOVATIVE TECHNOLOGY, LLC
Reel/Frame 013657/0511 →
Assignment of Assignor's Interest
Sep 22, 2008
From: ASNAASHARI, MEHDI
To: MICRON TECHNOLOGY, INC.
Reel/Frame 021565/0990 →
Assignment of Assignor's Interest
Feb 18, 2009
From: ASNAASHARI, MEHDI; YAMADA, RONALD; NEMAZIE, SIAMACK; YANG, JUI-YAO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 022278/0005 →
Assignment of Assignor's Interest
Oct 18, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027075/0682 →
Assignment of Assignor's Interest
Apr 17, 2012
From: INTEL CORPORATION
To: NUMONYX B.V.
Reel/Frame 028055/0625 →
Corrective Assignment to Correct the Names of the Assignors Previously Recorded on Reel 013484 Frame 0302. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2012
From: MUSIC SEMICONDUCTORS, INC.; MUSIC CORPORATION; INNOVATIVE TECHNOLOGY, LLC; MUSIC SEMICONDUCTORS PHILIPPINES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 028608/0064 →
Assignment of Assignor's Interest
Jun 18, 2013
From: ASNAASHARI, MEHDI; YAMADA, RONALD; NEMAZIE, SIAMACK; YANG, JUI-YAO ("RAY")
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030634/0671 →