Patent Assignment
Reel/Frame 076136/0019
Assignment of Assignor's Interest
Recorded: 2026-08-04
Pages: 43
Assignor
ASM AMERICA, INC.
Executed: 2026-03-16
Assignee
ASM IP HOLDING B.V.
VERSTERKERSTRAAT 8, ALMERE, 1322 AP, NETHERLANDS
Covered Properties
(54)
Atmospheric Plasma in Cmp Pad Optimization
Application:
62/476,041 →
Planarized Membrane and Methods for Substrate Processing Systems
Planarized Membrane and Methods for Substrate Processing Systems
Application:
62/582,187 →
Cmp Machine with Improved Throughput and Process Flexibility
Application:
15/947,510 →
Publication:
US US20180311784A1
Cmp Machine with Improved Throughput and Process Flexibility
Application:
17/457,871 →
Publication:
US US20220088744A1
CMP machine with improved throughput and process flexibility and offline consumables preparation
Application:
62/602,538 →
Substrate Carrier Head and Processing System
Application:
62/805,643 →
Temperature Controlled Substrate Carrier and Polishing Components
Application:
18/985,761 →
Publication:
US US20250329556A1
Temperature Controlled Substrate Carrier
Application:
62/869,427 →
Temperature Controlled Polishing Components
Application:
62/912,523 →
Method and Apparatus for Insitu Adjustment of Wafer Slip Detection During Work Piece Polishing
Application:
62/882,417 →
Method and Apparatus for in-Situ Monitoring of Chemical Mechanical Planarization (Cmp) Processes
Application:
17/838,829 →
Publication:
US US20220395956A1
Method and Apparatus for in-Situ Monitoring of Chemical Mechanical Planarization (Cmp) Processes
Application:
63/202,533 →
Containment and Exhaust System for Substrate Polishing Components
Application:
18/942,031 →
Publication:
US US20250065473A1
Containment and Exhaust System for Substrate Polishing Components
Application:
63/154,175 →
Containment and Exhaust System for Substrate Polishing Components
Application:
63/165,652 →
Carrier for Polishing Workpieces with Flats or Voids
Application:
18/995,709 →
Publication:
US US20260014667A1
Carrier for Polishing Workpieces with Flats or Voids
Application:
63/369,490 →
Carrier for Polishing Workpieces with Flats or Voids
Application:
63/369,917 →
Apparatus and Method for Closed Loop Controlled Cooling in a Wafer Processing System
Application:
63/514,629 →
Apparatus and Method for in-Situ Chemical Separation and Recirculation in a Chemical Mechanical Processing System
Application:
18/970,666 →
Publication:
US US20250187141A1
Apparatus and Method for in-Situ Chemical Separation and Recirculation in a Chemical Mechanical Processing System
Application:
63/608,749 →
Thermally Conductive Chemical Mechanical Polishing (Cmp) Pad
Application:
19/321,742 →
Publication:
US US20260070183A1
Thermally Conductive Chemical Mechanical Polishing (Cmp) Pad
Application:
63/693,549 →
Chemical Mechanical Planarization (Cmp) Machine with Improved Architecture
Application:
63/776,786 →
Method and Apparatus for Wafer Backgrinding and Edge Trimming On One Machine
Application:
61/440,920 →
Method and Apparatus for Wafer Backgrinding and Edge Trimming on One Machine
Application:
61/697,950 →
Chemical Mechanical Planarization Carrier
Application:
62/350,109 →
Planarized Membrane and Methods for Substrate Processing Systems
Application:
19/462,638 →
Publication:
US US20260166672A1
Chemical Mechanical Planarization (Cmp) Machine with Improved Architecture
Application:
19/573,241 →
Publication:
US US20260293579A1
Planarized Membrane and Methods for Substrate Processing Systems
Temperature Controlled Substrate Carrier and Polishing Components
Method and Apparatus for Insitu Adjustment of Wafer Slip Detection During Work Piece Polishing
Method and Apparatus for Insitu Adjustment of Wafer Slip Detection During Work Piece Polishing
Containment and Exhaust System for Substrate Polishing Components
Apparatus and Method for Surface Grinding and Edge Trimming Workpieces
Method and Apparatus for Wafer Backgrinding and Edge Trimming on One Machine
Chemical Mechanical Planarization Carrier System
Chemical Mechanical Planarization Carrier System
Atmospheric Plasma in Wafer Processing System Optimization
Substrate Carrier Head and Processing System
Atmospheric Plasma in Wafer Processing System Optimization
PCT:
PCT/US2018/023820 ↗
Planarized Membrane and Methods for Substrate Processing Systems
PCT:
PCT/US2018/058024 ↗
Cmp Machine with Improved Throughput and Process Flexibility
PCT:
PCT/US2018/026590 ↗
Substrate Carrier Head and Processing System
PCT:
PCT/US2020/015837 ↗
Temperature Controlled Substrate Carrier and Polishing Components
PCT:
PCT/US2020/039767 ↗
Method and Apparatus for Insitu Adjustment of Wafer Slip Detection During Work Piece Polishing
PCT:
PCT/US2020/044109 ↗
Method and Apparatus for in-Situ Monitoring of Chemical Mechanical Planarization (Cmp) Processes
PCT:
PCT/US2022/033204 ↗
Containment and Exhaust System for Substrate Polishing Components
PCT:
PCT/US2022/017711 ↗
Carrier for Polishing Workpieces with Flats or Voids
PCT:
PCT/US2023/028499 ↗
Apparatus and Method for Closed Loop Controlled Cooling in a Wafer Processing System
PCT:
PCT/US2024/038411 ↗
Apparatus and Method for in-Situ Chemical Separation and Recirculation in a Chemical Mechanical Processing System
PCT:
PCT/US2024/058714 ↗
Thermally Conductive Chemical Mechanical Polishing (Cmp) Pad
PCT:
PCT/US2025/045607 ↗
Method and Apparatus for Wafer Backgrinding and Edge Trimming on One Machine
PCT:
PCT/US2013/058824 ↗
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Reel/Frame 073490/0025 →