Filter device
Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.
1 . A filter device comprising:
a substrate including a base and an intermediate layer;
a piezoelectric layer attached to a surface of the substrate, portions of the piezoelectric layer forming one or more diaphragms that are over respective cavities in the intermediate layer;
a conductor pattern on a surface of the piezoelectric layer, the conductor pattern including a plurality of interdigital transducers (IDTs) of a plurality of resonators, interleaved fingers of each of the plurality of IDTs disposed on a respective diaphragm of the one or more diaphragms;
a first dielectric layer having a first thickness disposed on and between the interleaved fingers of the IDTs of a first subset of the plurality of resonators; and
a second dielectric layer having a second thickness greater than the first thickness disposed on and between the interleaved fingers of the IDTs of a second subset of the plurality of resonators, wherein the first subset and the second subset are not identical to each other,
wherein each IDT comprises a first busbar, a second busbar, and interleaved fingers extending alternately from the first and second busbars, wherein overlapping portions of the interleaved fingers are disposed on the respective diaphragm, and at least portions of both the first and second busbars are disposed on a supported portion of the piezoelectric layer that does not form part of the diaphragm.
2 . The filter device of claim 1 , wherein the piezoelectric layer and all of the IDTs are configured such that a respective radio frequency signal applied to each IDT excites a respective primarily shear acoustic mode within the respective diaphragm, wherein shear deformation is introduced by a lateral electric field in a substantially lateral direction of atomic motion, while propagation of a bulk shear wave of the shear acoustic mode is normal to the substantially lateral direction of atomic motion and also substantially normal to the surface of the piezoelectric layer.
3 . The filter device of claim 1 , wherein the plurality of resonators includes two or more shunt resonators and two or more series resonators connected to form a ladder filter circuit, and the second subset is all of the shunt resonators.
4 . The filter device of claim 3 , wherein the first subset includes at least one of the two or more series resonator.
5 . The filter device of claim 1 , further comprising a back-side dielectric layer on the surface of the piezoelectric layer facing the substrate, wherein the back-side dielectric layer for each subset is a different thickness than the either the first frequency setting dielectric layer or the second frequency setting dielectric layer.
6 . The filter device of claim 1 , further comprising a passivation layer disposed over all of the plurality of resonators.
7 . The filter device of claim 1 , wherein the plurality of resonators includes two or more series resonators, and the second dielectric layer is on the surface of the piezoelectric layer between the interleaved fingers of all of the two or more series resonators.
8 . A filter device, comprising:
a substrate including a base and an intermediate layer;
a piezoelectric layer having front and back surfaces, the back surface attached either directly or via one or more intermediate layers to a surface of a substrate, portions of the piezoelectric layer forming one or more diaphragms that are over respective cavities in the intermediate layer;
a conductor pattern on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of acoustic resonators including a shunt resonator and a series resonator, interleaved fingers of each of the plurality of IDTs on a diaphragm of the one or more diaphragms;
a first dielectric layer having a first thickness over the IDT of the shunt resonator, and
a second dielectric layer having a second thickness over the IDT of the series resonator,
wherein:
the piezoelectric layer and all of the plurality of IDTs are configured such that radio frequency signals applied to the plurality of IDTs excite respective primarily shear acoustic modes within the one or more diaphragms, and
the first thickness is greater than the second thickness;
wherein each IDT comprises a first busbar, a second busbar, and interleaved fingers extending alternately from the first and second busbars, and
wherein overlapping portions of the interleaved fingers are disposed on the respective diaphragm, and at least portions of both the first and second busbars are disposed on a supported portion of the piezoelectric layer that does not form part of the diaphragm.
9 . The filter device of claim 8 , wherein the conductor pattern comprises one of aluminum, an aluminum alloy, copper, a copper alloy, beryllium, and gold.
10 . The filter device of claim 8 , wherein:
the plurality of resonators includes two or more shunt resonators, and the first dielectric layer is over the IDTs of all of the two or more shunt resonators, and
the plurality of resonators includes two or more series resonators, and the second dielectric layer is over the IDTs of all of the two or more series resonators.
11 . The filter device of claim 1 , wherein:
the plurality of resonators comprises a third subset of the plurality of resonators, and
a third dielectric layer is disposed over the interleaved fingers of the IDTs of the third subset of the plurality of resonators and has a different thickness than either of the first thickness and the second thickness.
12 . The filter device of claim 8 , wherein a difference between a resonance frequency of the series resonator and a resonance frequency of the shunt resonator is determined, in part, by a difference between the first thickness and the second thickness.
13 . The filter device of claim 8 , wherein the first thickness is less than or equal to 500 nm, and the second thickness is greater than or equal to zero.
14 . The filter device of claim 8 , wherein respective directions of acoustic energy flow of each of the excited primary shear acoustic modes are substantially normal to the surfaces of the piezoelectric layer, and substantially normal to a lateral direction of an electric field of the primary shear acoustic mode.
15 . The filter device of claim 8 , wherein a thickness between the front and back surfaces of the piezoelectric layer is greater than or equal to 200 nm and less than or equal to 1000 nm.
16 . The filter device of claim 15 , wherein each of the plurality of IDTs has a respective pitch greater than or equal to 2 times the thickness of the piezoelectric layer and less than or equal to 25 times the thickness of the piezoelectric layer.
17 . The filter device of claim 8 , wherein the first and second dielectric layers comprise at least one of silicon dioxide and silicon nitride.
18 . A filter device comprising:
a substrate;
a piezoelectric layer attached either directly or via one or more intermediate layers to the substrate, the piezoelectric layer including one or more diaphragms that are over respective cavities of the filter device; and
a conductor pattern on a surface of the piezoelectric layer, the conductor pattern including a plurality of interdigital transducers (IDTs) of a plurality of resonators, each IDT of the plurality of IDTs including a first busbar, a second busbar, and interleaved fingers extending alternately from the first and second busbars,
wherein overlapping portions of the interleaved fingers of each IDT are disposed on a respective diaphragm of the one or more diaphragms;
wherein a first subset of the plurality of resonators comprises a first frequency setting dielectric layer having a first thickness,
wherein a second subset of the plurality of resonators includes a second frequency setting dielectric layer having a second thickness greater than the first thickness, and
wherein the plurality of resonators comprises a third subset of the plurality of resonators, and a third frequency setting layer is disposed over interleaved fingers of the IDTs of the third subset of the plurality of resonators and has a combined thickness of both the first thickness and the second thickness.
19 . The filter device of claim 18 , wherein at least portions of both the first and second busbars of each IDT are disposed on a supported portion of the piezoelectric layer that does not include part of the one or more diaphragms.