IP Library › Granted Patent US 12,353,139
Granted Patent B2
US 12,353,139 · App. 18/453,594 · Granted Jul 8, 2025

Substrate holder and method of manufacturing a substrate holder

Inventors: Raymond Wilhelmus Louis Lafarre (Helmond, NL); Sjoerd Nicolaas Lambertus Donders (Vught, NL); Nicolaas Ten Kate (Almkerk, NL); Nina Vladimirovna Dziomkina (Eindhoven, NL); Yogesh Pramod Karade (Eindhoven, NL); Elisabeth Corinne Rodenburg (Heeze, NL)
Assignee: ASML NETHERLANDS B.V.
G03F7/70341B05D3/06B05D5/00B22F7/062B22F10/00B22F10/20B23K26/342B23K26/354B23Q3/18B33Y10/00B33Y80/00G03F7/20G03F7/70416G03F7/707G03F7/70708G03F7/70716G03F7/70733G03F7/708B22F10/25B22F10/28B22F10/66
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Quick Facts
Patent No.
US 12,353,139
App. No.
18/453,594
Granted
Jul 8, 2025
Kind
B2
Abstract

An object holder for a lithographic apparatus has a main body having a surface. A plurality of burls to support an object are formed on the surface or in apertures of a thin-film stack. At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.

Claims (31)

1. A holder for use in a lithographic apparatus, the holder comprising:

a main body comprising at least one material selected from: Zerodur ceramic, cordierite, SiC, AlN, SiSiC, ceramic or glass-ceramic;

a plurality of first burls at a first side of the main body and having end surfaces to support an object, wherein the first burls each comprise a first body portion protruding from the main body and a second body portion located further from the main body than the first body portion, wherein the first body portions are made of the same material as the material of the main body and the second body portions comprise a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TiN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride;

a plurality of second burls at a second side of the main body, the second side being opposite of the first side;

a heat transfer element located between the first and second sides of the main body; and

an electric or electrical component on an external surface of the main body at a side other than the first side.

2. The holder according to claim 1 , wherein the main body has a thickness in a range of 1 mm to 50 mm.

3. The holder according to claim 1 , wherein each of the first burls and/or second burls has a height in a range of about 5 μm to about 250 μm.

4. The holder according to claim 1 , wherein a total area of all the burls on one side of the main body is less than 3% of the total surface area of the main body.

5. The holder according to claim 1 , further comprising a heater provided to the main body and configured to control a temperature of the object and/or the main body.

6. The holder according to claim 1 , wherein the first body portions comprise a different material than the second body portions.

7. A lithographic apparatus comprising the holder of claim 1 .

8. A holder for use in a lithographic apparatus, the holder comprising:

a main body;

a recess in or on the main body, the recess having one or more openings therein, the one or more openings configured to exhaust fluid; and

a plurality of burls surrounding the recess and having end surfaces to support an object, wherein the burls each comprise a first body protruding portion and a second body protruding portion located further from the main body than the first body protruding portion, wherein the first body portions comprise a different material than the second body portions and wherein the recess is recessed relative to a surface from which the burls extend.

9. The holder according to claim 8 , further comprising a further recess having a plurality of further openings therein, the further opening configured to exhaust fluid and a plurality of further burls surrounding the further recess and having end surfaces to support the object, wherein the further burls each comprise a first body protruding portion and a second body protruding portion located further from the main body than the first body protruding portion, and the first body portions of the further burls comprise a different material than the second body portions of the further burls.

10. The holder according to claim 8 , wherein the main body comprises an aperture extending all the way through the main body and configured to allow radiation to pass from one side of the main body to an opposite of the main body.

11. The holder according to claim 8 , further comprising a flexible element configured to allow movement of the recess primarily in a plane of the main body across which the object is arranged to be supported.

12. The holder according to claim 8 , wherein the main body is formed of a different material from the burls.

13. The holder according to claim 8 , wherein the second body portions comprise a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TiN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride.

14. A lithographic apparatus comprising the substrate holder of claim 8 .

15. A holder for use in a lithographic apparatus, the holder comprising:

a main body;

a support member supported by a flexible element, that is separate from the support member, on the main body, the support member having one or more openings, the one or more openings configured to exhaust fluid; and

a plurality of burls surrounding the one or more openings and having end surfaces to support an object, wherein the burls each comprise a first body protruding portion and a second body protruding portion located further from the main body than the first body protruding portion, and the first body portions of the burls comprise a different material than the second body portions of the burls.

16. The holder according to claim 15 , wherein the support member forms a recess in which is located the one or more openings.

17. The holder according to claim 15 , wherein the flexible element is configured to allow movement of the support member primarily in a plane of the main body across which the object is arranged to be supported.

18. The holder according to claim 15 , wherein the main body is formed of a different material from the burls.

19. The holder according to claim 15 , wherein the second body portions comprise a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TIN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride.

20. A lithographic apparatus comprising the substrate holder of claim 15 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2023
From: LAFARRE, RAYMOND WILHLMUS LOUIS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 064691/0373 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2023
From: LAFARRE, RAYMOND WILHLMUS LOUIS; DONDERS, SJOERD NICOLAAS LAMBERTUS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 064691/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2023
From: LAFARRE, RAYMOND WILHLMUS LOUIS; DONDERS, SJOERD NICOLAAS LAMBERTUS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 064691/0482 →
Continuity (9)
Continuation 17856520 · Jul 1, 2022
Continuation 17132084 · Dec 23, 2020
Continuation 15654413 · Jul 19, 2017
Continuation 15296968 · Oct 18, 2016
Continuation 14373291
Provisional Application 61621648 · Apr 9, 2012
Provisional Application 61621660 · Apr 9, 2012
Provisional Application 61594857 · Feb 3, 2012
Related Publication 20240027915A1 · Jan 25, 2024
References Cited (246)
US 4480284A · Tojo et al. · 1984 [cited by applicant]
US 5182170A · Marcus et al. · 1993 [cited by applicant]
US 5368947A · Denney · 1994 [cited by applicant]
US 5583736A · Anderson et al. · 1996 [cited by applicant]
US 5663865A · Kawada et al. · 1997 [cited by applicant]
US 5838529A · Shufflebotham et al. · 1998 [cited by applicant]
US 5885654A · Hagiwara et al. · 1999 [cited by applicant]
US 6033475A · Hasebe et al. · 2000 [cited by applicant]
US 6046426A · Jeantette et al. · 2000 [cited by applicant]
US 6307620B1 · Takabayashi et al. · 2001 [cited by applicant]
US 6413701B1 · Van Empel et al. · 2002 [cited by applicant]
US 6709747B1 · Gordeev · 2004 [cited by applicant]
US 6864957B2 · Van Elp et al. · 2005 [cited by applicant]
US 7050147B2 · Compen · 2006 [cited by applicant]
US 7078715B2 · Vink et al. · 2006 [cited by applicant]
US 7092231B2 · Hoeks et al. · 2006 [cited by applicant]
US 7110085B2 · Zaal et al. · 2006 [cited by applicant]
US 7119885B2 · Ottens et al. · 2006 [cited by applicant]
US 7327439B2 · Zaal et al. · 2008 [cited by applicant]
US 7524735B1 · Gauri et al. · 2009 [cited by applicant]
US 7816022B2 · Ekstein et al. · 2010 [cited by applicant]
US 7940511B2 · Sijben · 2011 [cited by applicant]
US 8228487B2 · Rijpma et al. · 2012 [cited by applicant]
US 8810777B2 · Cadee et al. · 2014 [cited by applicant]
US 9442395B2 · Lafarre et al. · 2016 [cited by applicant]
US 9507274B2 · Lafarre et al. · 2016 [cited by applicant]
US 10245641B2 · Lafarre et al. · 2019 [cited by applicant]
US 10761433B2 · Zaal et al. · 2020 [cited by applicant]
US 10898955B2 · Lafarre · 2021 [cited by applicant]
US 11235388B2 · Lafarre · 2022 [cited by applicant]
US 11376663B2 · Lafarre · 2022 [cited by applicant]
US 11628498B2 · Lafarre · 2023 [cited by applicant]
US 11754929B2 · Lafarre · 2023 [cited by examiner]
US 11960213B2 · Lafarre · 2024 [cited by applicant]
US 20010033369A1 · Matsui · 2001 [cited by applicant]
US 20020004105A1 · Kunze et al. · 2002 [cited by applicant]
US 20020159217A1 · Tsuruta · 2002 [cited by examiner]
US 20040012767A1 · Van Elp et al. · 2004 [cited by applicant]
US 20040055709A1 · Boyd, Jr. et al. · 2004 [cited by applicant]
US 20040114124A1 · Hoeks et al. · 2004 [cited by applicant]
US 20040160021A1 · Tatsumi et al. · 2004 [cited by applicant]
US 20040207824A1 · Lof et al. · 2004 [cited by applicant]
US 20040217095A1 · Herzog · 2004 [cited by applicant]
US 20040247361A1 · Zaal et al. · 2004 [cited by applicant]
US 20050024620A1 · Van Empel · 2005 [cited by applicant]
US 20050030512A1 · Zaal et al. · 2005 [cited by applicant]
US 20050030515A1 · Ottens et al. · 2005 [cited by applicant]
US 20050041364A1 · Kellerman et al. · 2005 [cited by applicant]
US 20050045106A1 · Boyd et al. · 2005 [cited by applicant]
US 20050061995A1 · Vink et al. · 2005 [cited by applicant]
US 20050095776A1 · Usuami · 2005 [cited by applicant]
US 20050117141A1 · Ottens et al. · 2005 [cited by applicant]
US 20050128444A1 · Ottens et al. · 2005 [cited by applicant]
US 20050128459A1 · Zwet et al. · 2005 [cited by applicant]
US 20050146694A1 · Tokita · 2005 [cited by applicant]
US 20050183669A1 · Parkhe et al. · 2005 [cited by applicant]
US 20050195382A1 · Ottens et al. · 2005 [cited by applicant]
US 20050248746A1 · Zaal et al. · 2005 [cited by applicant]
US 20060006340A1 · Compen · 2006 [cited by applicant]
US 20060033898A1 · Cadee et al. · 2006 [cited by applicant]
US 20060038968A1 · Kemper et al. · 2006 [cited by applicant]
US 20060075969A1 · Fischer · 2006 [cited by applicant]
US 20060102277A1 · Zaal et al. · 2006 [cited by applicant]
US 20060102849A1 · Mertens et al. · 2006 [cited by applicant]
US 20060130750A1 · Ishikawa · 2006 [cited by applicant]
US 20060130767A1 · Herchen · 2006 [cited by applicant]
US 20060139614A1 · Owa et al. · 2006 [cited by applicant]
US 20070017160A1 · Caldwell · 2007 [cited by applicant]
US 20070070319A1 · Nakamura et al. · 2007 [cited by applicant]
US 20070097346A1 · Zaal et al. · 2007 [cited by applicant]
US 20070139855A1 · Van Mierlo et al. · 2007 [cited by applicant]
US 20070146679A1 · Sutedja et al. · 2007 [cited by applicant]
US 20070217114A1 · Sasaki et al. · 2007 [cited by applicant]
US 20070252970A1 · Shibazaki · 2007 [cited by examiner]
US 20070285647A1 · Kwan et al. · 2007 [cited by applicant]
US 20080011737A1 · Fukuoka et al. · 2008 [cited by applicant]
US 20080024743A1 · Kruit et al. · 2008 [cited by applicant]
US 20080043210A1 · Shibuta · 2008 [cited by applicant]
US 20080138504A1 · Williams · 2008 [cited by applicant]
US 20080158538A1 · Puyt et al. · 2008 [cited by applicant]
US 20080212046A1 · Riepen et al. · 2008 [cited by applicant]
US 20080276865A1 · Nishimizu et al. · 2008 [cited by applicant]
US 20080280536A1 · Sasaki et al. · 2008 [cited by applicant]
US 20090012245A1 · Glockner et al. · 2009 [cited by applicant]
US 20090079525A1 · Sijben · 2009 [cited by applicant]
US 20090097009A1 · Okumura · 2009 [cited by examiner]
US 20090207392A1 · Rijpma et al. · 2009 [cited by applicant]
US 20090262318A1 · Van Den Dungen et al. · 2009 [cited by applicant]
US 20090279060A1 · Direcks et al. · 2009 [cited by applicant]
US 20090279062A1 · Direcks et al. · 2009 [cited by applicant]
US 20090284894A1 · Cooke · 2009 [cited by applicant]
US 20100039747A1 · Sansoni et al. · 2010 [cited by applicant]
US 20100193501A1 · Zucker et al. · 2010 [cited by applicant]
US 20100200901A1 · Kim · 2010 [cited by applicant]
US 20100214549A1 · Cadee et al. · 2010 [cited by applicant]
US 20110036990A1 · Stone et al. · 2011 [cited by applicant]
US 20110222032A1 · Ten Kate et al. · 2011 [cited by applicant]
US 20110222033A1 · Ten Kate et al. · 2011 [cited by applicant]
US 20110292561A1 · Kamimura et al. · 2011 [cited by applicant]
US 20120013865A1 · Laurent et al. · 2012 [cited by applicant]
US 20120044609A1 · Cooke et al. · 2012 [cited by applicant]
US 20120147353A1 · Lafarre et al. · 2012 [cited by applicant]
US 20120177942A1 · Chang et al. · 2012 [cited by applicant]
US 20120212725A1 · Lafarre et al. · 2012 [cited by applicant]
US 20120242271A1 · Van Der Toorn et al. · 2012 [cited by applicant]
US 20120274920A1 · Bex et al. · 2012 [cited by applicant]
US 20130094009A1 · Lafarre et al. · 2013 [cited by applicant]
US 20130164688A1 · Cadee et al. · 2013 [cited by applicant]
US 20130189802A1 · Tromp et al. · 2013 [cited by applicant]
US 20130301028A1 · Albert · 2013 [cited by applicant]
US 20140368804A1 · Lafarre et al. · 2014 [cited by applicant]
US 20150311108A1 · Horiuchi · 2015 [cited by applicant]
US 20160111318A1 · Ichinose · 2016 [cited by applicant]
US 20170036272A1 · Lafarre et al. · 2017 [cited by applicant]
US 20180130692A1 · Ishino · 2018 [cited by applicant]
US 20210114101A1 · Lafarre · 2021 [cited by applicant]
CN 1315022 · 2001 [cited by applicant]
CN 1320108 · 2001 [cited by applicant]
CN 1456933 · 2003 [cited by applicant]
CN 1487360 · 2004 [cited by applicant]
CN 1580956 · 2005 [cited by applicant]
CN 1922724 · 2007 [cited by applicant]
CN 101030041 · 2007 [cited by applicant]
CN 101599453 · 2009 [cited by applicant]
CN 101803001 · 2010 [cited by applicant]
CN 102067302 · 2011 [cited by applicant]
CN 102160167 · 2011 [cited by applicant]
CN 102193331 · 2011 [cited by applicant]
EP 0134438 · 1992 [cited by applicant]
EP 1106859 · 2001 [cited by applicant]
EP 1510868 · 2005 [cited by applicant]
EP 1650604 · 2006 [cited by applicant]
EP 2317456 · 2011 [cited by applicant]
EP 2317546 · 2011 [cited by applicant]
EP 2365390 · 2011 [cited by applicant]
EP 2490073 · 2012 [cited by applicant]
EP 3882700 · 2021 [cited by applicant]
JP H03187240 · 1991 [cited by applicant]
JP H04103750 · 1992 [cited by applicant]
JP 5047909 · 1993 [cited by applicant]
JP H05205997 · 1993 [cited by applicant]
JP 6204324 · 1994 [cited by applicant]
JP H0719831 · 1995 [cited by applicant]
JP 0992703 · 1997 [cited by applicant]
JP H09148379 · 1997 [cited by applicant]
JP H09199574 · 1997 [cited by applicant]
JP 09270327 · 1997 [cited by applicant]
JP 09270445 · 1997 [cited by applicant]
JP 09283605 · 1997 [cited by applicant]
JP H09283605 · 1997 [cited by applicant]
JP 1064987 · 1998 [cited by applicant]
JP 2000174105 · 2000 [cited by applicant]
JP 2000202626 · 2000 [cited by applicant]
JP 2000311933 · 2000 [cited by applicant]
JP 2001028333 · 2001 [cited by applicant]
JP 2001237303 · 2001 [cited by applicant]
JP 3250290 · 2001 [cited by applicant]
JP 2003518193 · 2003 [cited by applicant]
JP 2004022889 · 2004 [cited by applicant]
JP 2004022859 · 2004 [cited by applicant]
JP 2004221323 · 2004 [cited by applicant]
JP 2004531067 · 2004 [cited by applicant]
JP 2005029401 · 2005 [cited by applicant]
JP 2005079586 · 2005 [cited by applicant]
JP 2005328045 · 2005 [cited by applicant]
JP 2006024954 · 2006 [cited by applicant]
JP 2006148101 · 2006 [cited by applicant]
JP 2007503123 · 2007 [cited by applicant]
JP 2007158309 · 2007 [cited by applicant]
JP 2007194618 · 2007 [cited by applicant]
JP 2007201068 · 2007 [cited by applicant]
JP 2007527625 · 2007 [cited by applicant]
JP 2007266611 · 2007 [cited by applicant]
JP 2008028052 · 2008 [cited by applicant]
JP 2008085129 · 2008 [cited by applicant]
JP 2008135736 · 2008 [cited by applicant]
JP 2008160093 · 2008 [cited by applicant]
JP 2008189956 · 2008 [cited by applicant]
JP 2009179507 · 2009 [cited by applicant]
JP 2009200486 · 2009 [cited by applicant]
JP 2009246302 · 2009 [cited by applicant]
JP 4378053 · 2009 [cited by applicant]
JP 2010161319 · 2010 [cited by applicant]
JP 2010165776 · 2010 [cited by applicant]
JP 2010199581 · 2010 [cited by applicant]
JP 2011081040 · 2011 [cited by applicant]
JP 2011521470 · 2011 [cited by applicant]
JP 2011167768 · 2011 [cited by applicant]
JP 2011176275 · 2011 [cited by applicant]
JP 2011192991 · 2011 [cited by applicant]
JP 2011192992 · 2011 [cited by applicant]
JP 2011199303 · 2011 [cited by applicant]
JP 2011530833 · 2011 [cited by applicant]
JP 2012129524 · 2012 [cited by applicant]
JP 2012235095 · 2012 [cited by applicant]
KR 20090008658 · 2009 [cited by applicant]
WO 9949504 · 1999 [cited by applicant]
WO 00000921 · 2000 [cited by applicant]
WO 01045882 · 2001 [cited by applicant]
WO 0145882 · 2001 [cited by applicant]
WO 2008047886 · 2008 [cited by applicant]
WO 2008057483 · 2008 [cited by applicant]
WO 2010095540 · 2010 [cited by applicant]
WO 2011053145 · 2011 [cited by applicant]
WO 2011093451 · 2011 [cited by applicant]
WO 2012005294 · 2012 [cited by applicant]
WO 2013113568 · 2013 [cited by applicant]
WO 2013156236 · 2013 [cited by applicant]
WO 2016164498 · 2016 [cited by applicant]
Robby Ebert et al., “Rapid Microtooling With laser-based procedure,” Laserinstitut der Hochschule Mittweida, Rapid Micro, pp. 1-223 (2006-2011). [cited by applicant]
International Search Report mailed Apr. 24, 2013 in corresponding International Patent Application No. PCT/EP2013/050826. [cited by applicant]
A. Streek et al., “Laser micro sintering—a quality leap through improvement of powder packing,” Laserapplikationszentrum, Fachbereich MPI, Hochschule Mittweida, 12 pages (2008). [cited by applicant]
S. Kloetzer et al., “Micro-Cladding Using a Pulsed Fibre Laser and Scanner,” Proceedings of LPM2010—the 11th International Symposium on Laser Precision Microfabrication, pp. 1-5 (Jun. 2010). [cited by applicant]
H. Exner et al., “Lasermikrosintern von keramischen Materialien” Laserinstitut Mittelsachsen e.V./Hochschule Mittweida, RTejournal, vol. 3, pp. 1-18, Aug. 3, 2006. [cited by applicant]
International Preliminary Report on Patentability mailed Aug. 14, 2014 in corresponding International Patent Application No. PCT/EP2013/050826. [cited by applicant]
Japanese Office Action mailed Aug. 28, 2015 in corresponding Japanese Patent Application No. 2014-555139. [cited by applicant]
Japanese Office Action mailed Sep. 2, 2015 in corresponding Japanese Patent Application No. 2014-555140. [cited by applicant]
U.S. Office Action dated Nov. 25, 2015 in corresponding U.S. Appl. No. 14/374,197. [cited by applicant]
U.S. Office Action dated Feb. 22, 2016 in corresponding U.S. Appl. No. 14/374,197. [cited by applicant]
Japanese Office Action dated May 17, 2016 in corresponding Japanese Patent Application No. 2014-555139. [cited by applicant]
English Translation of Notice of Reasons for Rejection issued in corresponding Japanese Patent Application No. 2016-121468, dated May 1, 2017. [cited by applicant]
Non-Final Office Action issued in corresponding U.S. Appl. No. 15/261,553, dated Mar. 14, 2017. [cited by applicant]
Office Action dated Nov. 2, 2020 issued in corresponding Chinese Patent Application No. 201811326560.0 with English translation. [cited by applicant]
Notice of Allowance dated Sep. 23, 2020 issued in corresponding U.S. Appl. No. 16/369,368. [cited by applicant]
Office Action dated Oct. 6, 2020 issued in corresponding Japanese Patent Application No. 2019-194121 with English translation. [cited by applicant]
European Office Action and Search Report issued in corresponding European Application No. 20160382.6 dated Jun. 23, 2020. [cited by applicant]
Office Action dated May 7, 2020 issued in corresponding Chinese Patent Application No. 201811326560.0 with English translation. [cited by applicant]
Office Action dated Apr. 1, 2020 issued in corresponding Chinese Patent Application No. 201811239416.3. [cited by applicant]
Office Action dated Nov. 26, 2019 issued in corresponding U.S. Appl. No. 16/369,368. [cited by applicant]
Non-final Office Action dated Jun. 27, 2019 issued in corresponding U.S. Appl. No. 16/369,368. [cited by applicant]
Extended European Search Report dated Sep. 9, 2019 issued in corresponding European Patent Application No. 19174953.0. [cited by applicant]
Office Action dated Aug. 21, 2018 issued in corresponding EP Patent Application No. 13 700 893.4. [cited by applicant]
Notice of Reasons for Rejection dated Jan. 30, 2019 issued in corresponding Japanese Patent Application No. 2018-068277 with English translation. [cited by applicant]
European Office Action issued in corresponding European Patent Application No. 13700401.6, dated Nov. 7, 2018. [cited by applicant]
Non-Final Office Action dated Apr. 16, 2018 issued in corresponding U.S. Appl. No. 15/261,553. [cited by applicant]
Final Office Action dated Jun. 13, 2018 issued in corresponding U.S. Appl. No. 15/261,553. [cited by applicant]
Notice of Reasons for Rejection issued in corresponding Japanese Patent Application No. 2016-121468 dated Oct. 3, 2017 with English translation. [cited by applicant]
U.S. Office Action issued Aug. 4, 2017 issued in corresponding U.S. Appl. No. 15/261,553. [cited by applicant]
Office Action dated Jan. 29, 2021, issued in corresponding Chinese Patent Application No. 2018112394163 with English translation. [cited by applicant]
Office Action dated Feb. 2, 2021, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (9 pgs.). [cited by applicant]
Non-Final Office Action dated Jun. 8, 2021, issued in corresponding U.S. Appl. No. 17/138,480. [cited by applicant]
Office Action dated Jul. 1, 2021, issued in corresponding Chinese Patent Application No. 2018113259120 with English translation (18 pgs.). [cited by applicant]
Office Action dated Dec. 23, 2021, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (19 pgs.). [cited by applicant]
Notice of Reasons for Rejection dated Apr. 19, 2022, issued in corresponding Japanese Patent Application No. 2021-078268 with English translation (4 pgs.). [cited by applicant]
Communication pursuant to Article 94(3) EPC dated Sep. 15, 2022, issued in corresponding European Patent Application No. 20160382.6 (8 pgs.). [cited by applicant]
Office Action dated Jun. 20, 2022, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (21 pgs.). [cited by applicant]