Methods of depositing metal films using metal oxyhalide precursors
Processing methods comprising exposing a substrate to an optional nucleation promoter followed by sequential exposure of a first reactive gas comprising a metal oxyhalide compound and a second reactive gas to form a metal film on the substrate.
1. A processing method comprising exposing a substrate to a first reactive gas and a second reactive gas to deposit a metal film on the substrate, the substrate maintained at a temperature in the range of about 400° C. to about 600° C., the first reactive gas comprising a metal oxyhalide, the metal film having a thickness greater than or equal to about 10 Å, a resistivity less than 200 μΩ-cm and a metal content greater than 50 atomic percent.
2. The method of claim 1 , wherein the metal oxyhalide comprises one or more of a tungsten, molybdenum, niobium, vanadium and/or chromium.
3. The method of claim 1 , wherein the metal oxyhalide comprises substantially no fluorine.
4. The method of claim 1 , wherein the metal oxyhalide comprises a metal oxychloride.
5. The method of claim 4 , wherein the metal oxychloride comprises tungsten oxychloride.
6. The method of claim 1 , wherein second reactive gas comprises a hydrogen-containing compound and the metal film is a metal film.
7. The method of claim 6 , wherein the hydrogen-containing compound consists essentially of molecular hydrogen.
8. The method of claim 1 , wherein the second reactive gas comprises a nitrogen-containing compound and the metal film comprises a metal nitride.
9. The method of claim 8 , wherein the second reactive gas comprises ammonia.
10. The method of claim 1 , further comprising exposing the substrate to a nucleation promoter before or during exposing the substrate to the first reactive gas.
11. The method of claim 10 , wherein the nucleation promoter is selected from the group consisting of trialkylaluminum, trialkylgallium, trialkylindium, disilane, trisilane, tetrasilane, diethylsilane, derivatives thereof and combinations thereof.
12. The method of claim 10 , wherein the substrate comprises a dielectric.
13. The method of claim 12 , wherein the first reactive gas comprises a metal that does not nucleate on the dielectric without the nucleation promoter.
14. The method of claim 12 , wherein the nucleation promotor acts like a seed layer for formation of the metal film, the seed layer having an average thickness less than or equal to about 1.5 Å.
15. The method of claim 10 , wherein exposure to the nucleation promoter occurs substantially simultaneously with a first exposure to the metal oxyhalide.
16. A processing method comprising
positioning a substrate having a dielectric surface in a processing chamber; and
sequentially exposing at least a portion of the substrate to a first reactive gas and a second reactive gas to form a tungsten film on the substrate, the substrate maintained at a temperature in the range of about 400° C. to about 600° C., the tungsten film having a thickness of greater than or equal to about 10 Å, the first reactive gas comprising a tungsten oxyhalide and the second reactive gas comprising hydrogen.
17. The processing method of claim 16 , wherein the tungsten oxyhalide comprises tungsten oxychloride.
18. The method of any of claim 16 , further comprising exposing the substrate to a nucleation promoter selected from the group consisting of trimalkylaluminum, trialkylgallium, trialkylindium, disilane, trisilane, tetrasilane, diethylsilane, derivatives thereof and combinations thereof.
19. The method of claim 18 , wherein the tungsten oxyhalide comprises substantially no fluorine.
20. A processing method comprising
positioning a substrate having a dielectric surface in a processing chamber;
treating the dielectric surface with a nucleation promoter selected from the group consisting of trialkylaluminum, trialkylgallium, trialkylindium, disilane, trisilane, tetrasilane, diethylsilane, derivatives thereof and combinations thereof; and
sequentially exposing at least a portion of the treated dielectric surface to a first reactive gas and a second reactive gas to form a tungsten film on the substrate, the substrate maintained at a temperature in the range of about 400° C. to about 600° C., the first reactive gas comprising tungsten oxychloride and substantially no fluorine and the second reactive gas comprises hydrogen, and the tungsten film having a thickness greater than or equal to about 10 Å.