Non-planar I/O and logic semiconductor devices having different workfunction on common substrate
Non-planar I/O and logic semiconductor devices having different workfunctions on common substrates and methods of fabricating non-planar I/O and logic semiconductor devices having different workfunctions on common substrates are described. For example, a semiconductor structure includes a first semiconductor device disposed above a substrate. The first semiconductor device has a conductivity type and includes a gate electrode having a first workfunction. The semiconductor structure also includes a second semiconductor device disposed above the substrate. The second semiconductor device has the conductivity type and includes a gate electrode having a second, different, workfunction.
1. An integrated circuit structure, comprising:
a first N-type device having a three-dimensional architecture, the first N-type device having a first three-dimensional body, the first three-dimensional body having a sidewall at an end of the three-dimensional body, and the first N-type device comprising a first gate electrode over the end of the first three-dimensional body and adjacent to the sidewall of the first three-dimensional body, and a second gate electrode over the first three-dimensional body and spaced apart from the first gate electrode, wherein the second gate electrode has a first gate length; and
a second N-type device having a three-dimensional architecture, the second N-type device having a second three-dimensional body, and the second N-type device comprising a third gate electrode over the second three-dimensional body, wherein the third gate electrode has a second gate length different than the first gate length, and wherein the third gate electrode has a workfunction layer having a thickness different than a thickness of a workfunction layer of the second gate electrode.
2. The integrated circuit structure of claim 1 , wherein the second gate length is less than the first gate length.
3. The integrated circuit structure of claim 1 , wherein the thickness of the workfunction layer of the third gate electrode is less than the thickness of the workfunction layer of the second gate electrode.
4. The integrated circuit structure of claim 1 , wherein the first N-type device is a logic transistor, and the second N-type device is an I/O transistor.
5. The integrated circuit structure of claim 1 , further comprising:
a first gate dielectric between the first three-dimensional body and the first gate electrode;
a second gate dielectric between the first three-dimensional body and the second gate electrode; and
a third gate dielectric between the second three-dimensional body and the third gate electrode.
6. The integrated circuit structure of claim 1 , further comprising a fourth gate electrode over an end of the second three-dimensional body and adjacent to a sidewall of the second three-dimensional body.
7. An integrated circuit structure, comprising:
a first P-type device having a three-dimensional architecture, the first P-type device having a first three-dimensional body, the first three-dimensional body having a sidewall at an end of the three-dimensional body, and the first P-type device comprising a first gate electrode over the end of the first three-dimensional body and adjacent to the sidewall of the first three-dimensional body, and a second gate electrode over the first three-dimensional body and spaced apart from the first gate electrode, wherein the second gate electrode has a first gate length; and
a second P-type device having a three-dimensional architecture, the second P-type device having a second three-dimensional body, and the second P-type device comprising a third gate electrode over the second three-dimensional body, wherein the third gate electrode has a second gate length different than the first gate length, and wherein the third gate electrode has a workfunction layer having a thickness different than a thickness of a workfunction layer of the second gate electrode.
8. The integrated circuit structure of claim 7 , wherein the second gate length is less than the first gate length.
9. The integrated circuit structure of claim 7 , wherein the thickness of the workfunction layer of the third gate electrode is less than the thickness of the workfunction layer of the second gate electrode.
10. The integrated circuit structure of claim 7 , wherein the first P-type device is a logic transistor, and the second P-type device is an I/O transistor.
11. The integrated circuit structure of claim 7 , further comprising:
a first gate dielectric between the first three-dimensional body and the first gate electrode;
a second gate dielectric between the first three-dimensional body and the second gate electrode; and
a third gate dielectric between the second three-dimensional body and the third gate electrode.
12. The integrated circuit structure of claim 7 , further comprising a fourth gate electrode over an end of the second three-dimensional body and adjacent to a sidewall of the second three-dimensional body.
13. A computing system, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a first device having a three-dimensional architecture, the first device of a conductivity type, the first device having a first three-dimensional body, the first three-dimensional body having a sidewall at an end of the three-dimensional body, and the first device comprising a first gate electrode over the end of the first three-dimensional body and adjacent to the sidewall of the first three-dimensional body, and a second gate electrode over the first three-dimensional body and spaced apart from the first gate electrode, wherein the second gate electrode has a first gate length; and
a second device having a three-dimensional architecture, the second device of the conductivity type, the second device having a second three-dimensional body, and the second device comprising a third gate electrode over the second three-dimensional body, wherein the third gate electrode has a second gate length different than the first gate length, and wherein the third gate electrode has a workfunction layer having a thickness different than a thickness of a workfunction layer of the second gate electrode.
14. The computing system of claim 13 , wherein the conductivity type is N-type.
15. The computing system of claim 13 , wherein the conductivity type is P-type.
16. The computing system of claim 13 , further comprising:
a memory coupled to the board.
17. The computing system of claim 13 , further comprising:
a communication chip coupled to the board.
18. The computing system of claim 13 , further comprising:
a camera coupled to the board.
19. The computing system of claim 13 , further comprising:
a battery coupled to the board.
20. The computing system of claim 13 , wherein the component is selected from the group consisting of a processor, a communications chip, and a digital signal processor.