Package structure having line connected via portions
A package structure and method for forming the same are provided. The package structure includes a substrate having a front surface and a back surface, and a die formed on the back surface of the substrate. The package structure includes a first through via structure formed in the substrate, a conductive structure formed in a passivation layer) over the front surface of the substrate. The conductive structure includes a via portion in direct contact with the substrate. The package structure includes a connector (formed over the via portion, wherein the connector includes an extending portion directly on a recessed top surface of the via portion.
1 . A package structure, comprising:
a substrate having a front surface and a back surface;
a die formed on the front surface of the substrate;
a first through via structure formed in the substrate;
a conductive structure formed in a passivation layer over the back surface of the substrate, wherein the conductive structure comprises a via portion in direct contact with the substrate; and
a connector formed over the via portion, wherein the connector comprises a protruding portion directly on a recessed top surface of the via portion.
2 . The package structure as claimed in claim 1 , wherein a bottom surface of the via portion is leveled with a bottom surface of the passivation layer.
3 . The package structure as claimed in claim 1 , wherein a bottom surface of the via portion is in direct contact with an insulating layer.
4 . The package structure as claimed in claim 1 , wherein the protruding portion of the connector is directly over the via portion.
5 . The package structure as claimed in claim 1 , further comprising:
a second through via structure formed in the substrate, wherein the via portion is between the first through via structure and the second through via structure.
6 . The package structure as claimed in claim 1 , wherein the conductive structure further comprises a metal portion over the via portion, and the metal portion has a recessed top surface.
7 . The package structure as claimed in claim 6 , further comprising:
an under-bump-metallurgy (UBM) layer formed on the metal portion, wherein the UBM layer is in direct contact with the metal portion.
8 . The package structure as claimed in claim 1 , wherein the via portion has a circular shape when seen from a top view.
9 . The package structure as claimed in claim 1 , further comprising:
an interconnect structure formed below the first through via structure, wherein the interconnect structure is between the first through via structure and the die.
10 . A package structure, comprising:
a first through via structure formed in a substrate;
a passivation layer formed over the substrate; and
a conductive structure formed in the passivation layer, wherein the conductive structure comprises a first via portion and a second via portion, the first via portion is in direct contact with the first through via structure, and a bottom surface of the second via portion is in direct contact with the substrate, wherein the second via portion has a ring shape when seen from a top view.
11 . The package structure as claimed in claim 10 , wherein the conductive structure further comprises a first metal portion over the first via portion and a second metal portion over the second via portion.
12 . The package structure as claimed in claim 11 , further comprising:
an under-bump-metallurgy (UBM) layer directly over the second via portion, wherein a bottommost surface of the UBM layer is lower than a topmost surface of the second metal portion.
13 . The package structure as claimed in claim 10 , further comprising:
a connector formed over the second via portion, wherein the connector comprises a protruding portion in the passivation layer, and the second via portion is directly below the protruding portion of the connector.
14 . The package structure as claimed in claim 13 , wherein a sidewall surface of the connector extends beyond a sidewall surface of the second via portion.
15 . The package structure as claimed in claim 10 , further comprising:
a second through via structure adjacent to the second via portion;
a third via portion is formed on the second through via structure; and
a fourth via portion is adjacent to the third via portion, wherein the fourth via portion is electrically connected to the third via portion.
16 . A package structure, comprising:
a first through via structure formed in a substrate;
a conductive structure formed on first through via structure, wherein the conductive structure comprises a first via portion and a second via portion, a first metal portion on the first via portion, a second metal portion on the second via portion, and the second metal portion has a recessed top surface; and
an under-bump-metallurgy (UBM) layer formed on the second via portion.
17 . The package structure as claimed in claim 16 , wherein a sidewall surface of the UBM layer extends beyond a sidewall surface of the second metal portion, and an interface is between the UBM layer and the recessed top surface.
18 . The package structure as claimed in claim 16 , wherein the second via portion has a bottom surface in direct contact with the substrate, and a first diameter of a bottom surface of the first via portion is smaller than a second diameter of the bottom surface of the second via portion.
19 . The package structure as claimed in claim 16 , further comprising:
a second through via structure adjacent to the second via portion, wherein the second via portion is between the first through via structure and the second through via structure; and
a die directly below the first through via structure, the second via portion and the second through via structure.
20 . The package structure as claimed in claim 16 , wherein the second via portion has a ring shape when seen from a top view.