3D semiconductor device and structure with metal layers
A 3D semiconductor device including: a first level with first transistors, a single-crystal layer and at least one metal layer which includes interconnects between the first transistors forming first control circuits with a plurality of sense amplifiers; the first metal layer(s) overlaid by a second metal layer which is overlaid by a second level which includes first memory-cells which include second transistors with a metal-gate, overlaid by a third level which includes second memory cells which include third transistors which control the data written to second memory cells; a fourth metal layer overlaying a third metal layer which overlays the third level; where third transistor gate locations are aligned to second transistor gate locations within greater than 0.2 nm error, the first transistors or the second transistors comprise at least two FinFet transistors, and two of the FinFet transistors each have different threshold voltages.
1 . A 3D semiconductor device, the device comprising:
a first level comprising a first single crystal layer, said first level comprising a plurality of first transistors and at least one first metal layer,
wherein said at least one first metal layer comprises interconnects between said first transistors thus comprising formation of first control circuits;
a second metal layer connected to said first metal layer and comprising formation of first control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a plurality of sense amplifiers,
wherein said second level comprises a plurality of first memory cells, said plurality of first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said plurality of second memory cells each comprising at least one of said plurality of third transistors,
wherein at least one of said plurality of second memory cells is at least partially disposed atop of said first control circuits, and
wherein said first control circuits are connected to control data written to at least one of said plurality of second memory cells;
a third metal layer disposed above said third level; and
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors comprises second transistor gate locations,
wherein said plurality of third transistors comprises third transistor gate locations,
wherein said third transistor gate locations are aligned to said second transistor gate locations with a greater than 0.2 nm alignment error, being formed following two independently aligned lithography steps,
wherein at least one of said second transistors comprises a metal gate, and
wherein said plurality of first transistors or said plurality of second transistors comprise at least two FinFet transistors, and
wherein two of said at least two FinFet transistors each have different threshold voltages (Vt).
2 . The 3D semiconductor device according to claim 1 , further comprising:
a conductive path from said fourth metal layer to said second metal layer,
wherein said conductive path comprises a via disposed through said third level.
3 . The 3D semiconductor device according to claim 1 , further comprising:
a plurality of decoupling capacitors.
4 . The 3D semiconductor device according to claim 1 ,
wherein said second metal layer has an average thickness which is at least twice that of an average thickness of said third metal layer, and
wherein said second metal layer comprises a global power distribution grid.
5 . The 3D semiconductor device according to claim 1 , further comprising:
a fourth level disposed atop of said fourth metal layer,
wherein said fourth level comprises single crystal silicon, and
wherein said fourth level comprises a plurality of fourth transistors.
6 . The 3D semiconductor device according to claim 1 , further comprising:
a heat removal path from at least one of said plurality of second transistors to an external surface of said device.
7 . The 3D semiconductor device according to claim 1 ,
wherein at least one of said plurality of second transistors comprises a portion being processed by a first lithography step, and
wherein at least one of said plurality of third transistors comprises a portion being processed by a second lithography step.
8 . A 3D semiconductor device, the device comprising:
a first level comprising a first single crystal layer, said first level comprising a plurality of first transistors and at least one first metal layer,
wherein said at least one first metal layer comprises interconnects between said plurality of first transistors thus comprising formation of first control circuits;
a second metal layer connected to said first metal layer and comprising formation of first control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a plurality of sense amplifiers,
wherein said second level comprises a plurality of first memory cells, said plurality of first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said plurality of second memory cells each comprising at least one of said third transistors,
wherein at least one of said plurality of second memory cells is at least partially disposed atop of said first control circuits, and
wherein said first control circuits are connected to control data written to at least one of said plurality of second memory cells;
a third metal layer disposed above said third level;
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors comprises second transistor gate locations,
wherein said plurality of third transistors comprises third transistor gate locations,
wherein said third transistor gate locations are aligned to said second transistor gate locations with a greater than 0.2 nm alignment error, being formed following two independently aligned lithography steps,
wherein at least one of said plurality of second transistors comprises a metal gate; and
a plurality of vias disposed through said first single crystal layer.
9 . The 3D semiconductor device according to claim 8 , further comprising:
a conductive path from said fourth metal layer to said second metal layer,
wherein said conductive path comprises a via disposed through said third level.
10 . The 3D semiconductor device according to claim 8 , further comprising:
a plurality of decoupling capacitors.
11 . The 3D semiconductor device according to claim 8 ,
wherein said second metal layer has an average thickness which is at least twice that of an average thickness of said third metal layer, and
wherein said second metal layer comprises a global power distribution grid.
12 . The 3D semiconductor device according to claim 8 , further comprising:
a fourth level disposed atop of said fourth metal layer,
wherein said fourth level comprises single crystal silicon, and
wherein said fourth level comprises a plurality of fourth transistors.
13 . The 3D semiconductor device according to claim 8 , further comprising:
a heat removal path from at least one of said plurality of second transistors to an external surface of said device.
14 . The 3D semiconductor device according to claim 8 ,
wherein said plurality of first transistors or said plurality of second transistors comprise at least two FinFet transistors, and
wherein two of said at least two FinFet transistors each have different threshold voltages (Vt).
15 . A 3D semiconductor device, the device comprising:
a first level comprising a first single crystal layer, said first level comprising a plurality of first transistors and at least one first metal layer,
wherein said at least one first metal layer comprises interconnects between said plurality of first transistors thus comprising formation of first control circuits;
a second metal layer connected to said first metal layer and comprising formation of first control circuits;
a second level overlaying said first level, said second level comprising a plurality of second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors;
a plurality of sense amplifiers,
wherein said second level comprises a plurality of first memory cells, said plurality of first memory cells each comprising at least one of said plurality of second transistors,
wherein said third level comprises a plurality of second memory cells, said plurality of second memory cells each comprising at least one of said plurality of third transistors,
wherein at least one of said second memory cells is at least partially disposed atop of said first control circuits, and
wherein said first control circuits are connected to control data written to at least one of said plurality of second memory cells;
a third metal layer disposed above said third level;
a fourth metal layer disposed above said third metal layer,
wherein said plurality of second transistors comprises second transistor gate locations,
wherein said plurality of third transistors comprises third transistor gate locations,
wherein said third transistor gate locations are aligned to said second transistor gate locations with a greater than 0.2 nm alignment error, being formed following two independently aligned lithography steps,
wherein at least one of said plurality of second transistors comprises a metal gate; and
a heat removal path from at least one of said plurality of second transistors to an external surface of said device.
16 . The 3D semiconductor device according to claim 15 , further comprising:
a conductive path from said fourth metal layer to said second metal layer,
wherein said conductive path comprises a via disposed through said third level.
17 . The 3D semiconductor device according to claim 15 , further comprising:
a plurality of decoupling capacitors.
18 . The 3D semiconductor device according to claim 15 ,
wherein said second metal layer has an average thickness which is at least twice that of an average thickness of said third metal layer, and
wherein said second metal layer comprises a global power distribution grid.
19 . The 3D semiconductor device according to claim 15 , further comprising:
a fourth level disposed atop of said fourth metal layer,
wherein said fourth level comprises single crystal silicon, and
wherein said fourth level comprises a plurality of fourth transistors.
20 . The 3D semiconductor device according to claim 15 , further comprising:
a plurality of vias disposed through said first single crystal layer.