Patent Assignment
Reel/Frame 011014/0462
Merger
Recorded: 2000-07-19
Pages: 82
Assignor
LG SEMICON CO., LTD.
Executed: 2000-06-21
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Properties
(85)
Method of and Circuit for Instruction/Data Prefetching Using Non-Referenced Prefetch Cache
Patent:
6,272,622 →
Application:
08/522,222 →
Self Burn-in Circuit for Semiconductor Memory
Patent:
6,473,346 →
Application:
08/587,746 →
Method for Fabricating Mos Field Effect Transistor
Patent:
6,541,341 →
Application:
08/675,865 →
High Speed Parallel Adder
Patent:
6,505,226 →
Application:
08/921,701 →
Receive Squelch Circuit Having Function of Detecting Pulse Width
Patent:
6,108,528 →
Application:
08/958,929 →
Parallel Multiplier
Patent:
6,470,371 →
Application:
08/976,596 →
Noise Gate Apparatus for Digital Audio Processor
Patent:
6,094,490 →
Application:
08/978,474 →
Cmos Analog Semiconductor Apparatus and Fabrication Method Thereof
Patent:
6,166,416 →
Application:
09/002,242 →
Driving Voltage Supply Circuit for Liquid Crystal Display (Lcd) Panel
Patent:
6,256,005 →
Application:
09/018,307 →
Method of Fabricating a Flash Memory Device
Patent:
6,187,636 →
Application:
09/020,503 →
Frequency Multiplier Using Delayed Lock Loop (Dll)
Patent:
6,295,328 →
Application:
09/025,112 →
Metal Oxide Semiconductor Field Effect Transistor (Mosfet) and Method for Making Thereof
Patent:
6,169,315 →
Application:
09/025,504 →
Data Access Circuit for Central Processing Unit and Method
Application:
09/026,554 →
Error Data Correction Circuit
Patent:
6,105,161 →
Application:
09/026,555 →
Metal Oxide Silicon Field Effect Transistor (Mosfet) and Fabrication Method of Same
Patent:
6,093,612 →
Application:
09/027,810 →
Insulative Guard Ring for a Semiconductor Device
Patent:
6,150,701 →
Application:
09/056,618 →
Dry Etching Method of Multilayer Film
Patent:
6,146,542 →
Application:
09/071,743 →
Plug Forming Method for Semiconductor Device
Patent:
6,225,220 →
Application:
09/071,745 →
Low Power Gate Driver Circuit for Thin Film Transistor-Liquid Crystal Display (Tft-Lcd) Using Electric Charge Recycling Technique
Patent:
6,124,840 →
Application:
09/082,058 →
Hard Disk Equipped with a Memory for Storing File Allocation Table (Fat) Information
Patent:
6,195,217 →
Application:
09/083,052 →
Chip Size Semiconductor Package and Fabrication Method Thereof
Patent:
6,225,558 →
Application:
09/093,724 →
Semiconductor Substrate and Land Grid Array Semiconductor Package Using Same
Patent:
6,441,498 →
Application:
09/095,570 →
Application Specific Integrated Circuit (Asic) for Driving an External Display Device
Patent:
6,246,398 →
Application:
09/103,575 →
Semiconductor Chip Package Having Clip-Type Outlead and Fabrication Method of Same
Patent:
6,516,516 →
Application:
09/121,036 →
Letter-Box Filtering Circuit and Method Using the Same
Patent:
6,384,864 →
Application:
09/121,864 →
Resurf Edmos Transistor and High-Voltage Analog Multiplexer Circuit Using the Same
Patent:
6,559,683 →
Application:
09/124,091 →
Input Buffer
Patent:
6,191,617 →
Application:
09/132,530 →
Active Pixel Sensor with Electronic Shutter
Patent:
6,556,244 →
Application:
09/140,328 →
Power Noise Preventing Circuit for Microcontroller Unit (Mcu)
Patent:
6,097,226 →
Application:
09/141,422 →
Serial/Parallel Selective Converter
Patent:
6,121,906 →
Application:
09/145,301 →
Method for Patterning a Photoresist
Patent:
6,218,082 →
Application:
09/146,257 →
Back Bias Voltage Level Detector
Patent:
6,169,426 →
Application:
09/148,866 →
Analog/Digital Converting Circuit
Patent:
6,127,958 →
Application:
09/150,906 →
Variable Length Code Decoder for Mpeg
Patent:
6,285,789 →
Application:
09/154,094 →
Semiconductor Wafer and Fabrication Method of a Semiconductor Chip
Patent:
6,159,826 →
Application:
09/154,579 →
Video Signal Processing Apparatus
Patent:
6,288,755 →
Application:
09/157,411 →
Level Shifter Circuit
Patent:
6,222,384 →
Application:
09/166,224 →
Output Buffer Circuit for Semiconductor Device
Patent:
6,194,922 →
Application:
09/166,959 →
Multithreaded Data Processing Method with Long Latency Subinstructions
Patent:
6,216,220 →
Application:
09/168,068 →
Negative Delay Circuit Operable in Wide Band Frequency
Patent:
6,154,079 →
Application:
09/177,818 →
Layer-Type Ball Grid Array Semiconductor Package and Fabrication Method Thereof
Patent:
6,172,423 →
Application:
09/182,195 →
Method of Making Stackable Semiconductor Chips to Build a Stacked Chip Module
Patent:
6,124,149 →
Application:
09/184,514 →
Data Buffer for Programmable Memory
Patent:
6,256,681 →
Application:
09/185,088 →
Semiconductor Memory Test Apparatus
Patent:
6,144,596 →
Application:
09/188,410 →
Adjusable Substrate Voltage Applying Circuit of a Semiconductor Device
Patent:
6,150,870 →
Application:
09/195,202 →
Insulation Layer Structure and Method for Making the Same
Patent:
6,150,220 →
Application:
09/195,550 →
Charge Pump Circuit for a Semiconductor Memory Device
Patent:
6,177,828 →
Application:
09/195,551 →
Interpolation Digital Filter for Audio Codec
Patent:
6,160,502 →
Application:
09/197,471 →
Semiconductor Chip Package and Fabrication Method Therefor
Application:
09/198,270 →
Publication:
US 2001/0045632
Area Array Type Semiconductor Package and Fabrication Method
Patent:
6,316,837 →
Application:
09/200,937 →
Digital Delay-Locked Loop
Patent:
6,150,859 →
Application:
09/201,716 →
Digital/Analog Converter and Method Using Voltage Distribution
Patent:
6,166,672 →
Application:
09/209,247 →
Hold/Reset Mode Selection Counter and Operation Method Thereof
Patent:
6,219,798 →
Application:
09/210,784 →
Self-Timed Latch Circuit for High-Speed Very Large Scale Integration (Vlsi)
Patent:
6,163,193 →
Application:
09/217,201 →
Method for Isolating Semiconductor Device
Patent:
6,274,455 →
Application:
09/219,529 →
Circuit for Controlling Equalization Pulse Width
Patent:
6,366,611 →
Application:
09/219,531 →
Method of Fabricating Capacitor for Semiconductor Device
Patent:
6,190,993 →
Application:
09/223,750 →
Driving Method for an Alternating-Current Plasma Display Panel Device
Patent:
6,337,674 →
Application:
09/229,969 →
Method of Forming a Perovskite Structure Semiconductor Capacitor
Patent:
6,194,753 →
Application:
09/233,420 →
Reference Voltage Generation Circuit for Comparator
Patent:
6,124,743 →
Application:
09/235,748 →
Integrator Input Circuit
Patent:
6,160,435 →
Application:
09/237,227 →
Integrated Device Package and Fabrication Methods Thereof
Patent:
6,278,178 →
Application:
09/237,228 →
Stackable Ball Grid Array Semiconductor Package and Fabrication Method Thereof
Patent:
6,291,259 →
Application:
09/239,152 →
Refresh Control Circuit
Patent:
6,141,279 →
Application:
09/249,786 →
Semiconductor Device with Data Line Arrangement for Preventing Noise Interference
Patent:
6,108,230 →
Application:
09/251,323 →
Radio Frequency Sputtering Apparatus and Film Formation Method Using Same
Patent:
6,248,220 →
Application:
09/270,826 →
Test Mode Setup Circuit for Microcontroller Unit
Patent:
6,408,415 →
Application:
09/281,973 →
Charge Gain Stress Test Circuit for Nonvolatile Memory and Test Method Using the Same
Patent:
6,323,671 →
Application:
09/291,309 →
Cell Structure for Low Electric Power Static Ram
Patent:
6,111,779 →
Application:
09/304,643 →
Hot Carrier Measuring Circuit
Patent:
6,242,937 →
Application:
09/306,441 →
Apparatus for Reducing Pattern Jitter by Using Locally Symmetry Forcing Wave Generating Unit and Method Using the Same
Patent:
6,560,304 →
Application:
09/307,794 →
Low Frequency Detection Circuit
Patent:
6,177,813 →
Application:
09/311,588 →
Semiconductor Chip Package and Fabrication Method Thereof
Patent:
6,492,200 →
Application:
09/317,137 →
Convultion Code Generator and Digital Signal Processor Which Includes the Same
Patent:
6,442,729 →
Application:
09/323,223 →
Member for Semiconductor Package and Semiconductor Package Using the Same, and Fabrication Method Thereof
Patent:
6,521,979 →
Application:
09/324,780 →
Semiconductor Device and Fabrication Method Thereof
Patent:
6,177,321 →
Application:
09/326,218 →
Synchronous Sram Circuit
Patent:
6,484,231 →
Application:
09/337,664 →
Method for Forming an Interconnection in a Semiconductor Device
Patent:
6,242,340 →
Application:
09/362,898 →
Fabrication Method of Capacitor
Patent:
6,159,791 →
Application:
09/366,553 →
Capacitor Using High Dielectric Constant Film for Semiconductor Memory Device and Fabrication Method Therefor
Patent:
6,344,965 →
Application:
09/369,255 →
Random Number Generator Using Lehmer Algorithm
Patent:
6,480,870 →
Application:
09/369,398 →
Etching and Growth Simulation Method Using a Modified Cell Model
Patent:
6,718,293 →
Application:
09/372,595 →
Mosfet and Method of Controlling Channel Length
Patent:
6,278,161 →
Application:
09/373,705 →
Semiconductor Package Substrate and Semiconductor Package
Patent:
6,181,560 →
Application:
09/412,646 →
Semiconductor Chip Package and Fabrication Method Thereof
Patent:
6,277,670 →
Application:
09/416,272 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 1997
From: AHN, YOUNG-JUN
To: LG SEMICON CO., LTD.
Reel/Frame 008701/0778 →
Assignment of Assignor's Interest
Oct 28, 1997
From: LYU, HYUNG LYUL
To: LG SEMICON CO., LTD.
Reel/Frame 008806/0317 →
Assignment of Assignor's Interest
Aug 11, 1998
From: FEIGE, REINHARD; MERKER, GERHARD
To: SEGL LUNEN SALZSCHLACKE-ENTSORGUNGSGESELLSCHAFT LUNEN MBH
Reel/Frame 010202/0980 →
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Change of Name
Oct 12, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015246/0634 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Corrective Assignment to Correct the Conveyance Type, Receiving Party and Execution Date Previously Recorded on Reel 011014 Frame 0462. Assignor(S) Hereby Confirms the Conveyance Type Should Be Name Change, Receiving Party Is Hyundai Microelectronics Co., Ltd. and Date Is 07/26/1999.
May 19, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD.
Reel/Frame 022703/0662 →
Corrective Assignment to Correct the Receiving Party Data Previously Recorded on Reel 015246 Frame 0634. Assignor(S) Hereby Confirms the Assignee Should Be Hyundai Micro Electronics Co., Ltd (Branch Office).
May 19, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICRO ELECTRONICS CO., LTD. (BRANCH OFFICE)
Reel/Frame 022703/0582 →
Corrective Assignment to Correct the Conveying Party and Execution Date Previously Recorded on Reel 011014 Frame 0462. Assignor(S) Hereby Confirms the Conveying Party Should Be Hyundai Microelectronics Co., Ltd. and Execution Date Should Be 10/14/1999.
May 22, 2009
From: HYUNDAI MICROELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022722/0804 →
Merger
May 27, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022742/0478 →
Change of Name
May 27, 2009
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022742/0555 →
Corrective Assignment to Correct the Country in the Address of the Receiving Party Previously Recorded on Reel 022742 Frame 0478. Assignor(S) Hereby Confirms the Country Should Be Republic of Korea.
May 28, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022746/0279 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Corrective Assignment to Correct the Insertion of Corresponding Application/Patent No. Information Recorded on 08/12/1998. Previously Recorded on Reel 009390 Frame 0433. Assignor(S) Hereby Confirms the Insertion of Corresponding U.S. Patent No. 6,195,217 (Serial No. 09/083,052) in the Assignment Document..
Aug 5, 2009
From: PARK, JEONG JOO
To: LG SEMICON CO., LTD.
Reel/Frame 023057/0012 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHIAO TUNG HOLDINGS, LLC
Reel/Frame 023085/0864 →
Corrective Assignment to Correct the Identification of Application Number from Appl'n No. 08/958,929 to Appl'n No. 07/958,929 Previously Recorded on Reel 006757 Frame 749. Assignor(S) Hereby Confirms the Assignment to Assignee of All Right, Title and Interest in and to the Invention and All Appl'ns and Patents Granter Therefor.
Aug 13, 2009
From: SMALLEY, RICHARD E.
To: WILLIAM MARSH RICE UNIVERSITY
Reel/Frame 023095/0585 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 1, 2020
From: CHIAO TUNG HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0081 →