Patent Assignment
Reel/Frame 041304/0483
Assignment of Assignor's Interest
Recorded: 2017-01-09
Pages: 90
Assignor
FUJITSU AMD SEMICONDUCTOR LIMITED
Executed: 2010-03-29
Assignee
NIHON CYPRESS K.K.
1200 SHINMARUKO HIGASHI 3-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAWAGA, JAPAN
Covered Properties
(13)
Semiconductor Device Having Interlayer Insulator and Method for Fabricating Thereof
Patent:
6,232,663 →
Application:
08/904,630 →
Method for Removing Contaminate Nitrogen from the Peripheral Gate Region of a Non-Volatile Memory Device During Production of Such Device
Patent:
6,177,312 →
Application:
09/048,459 →
Process for Fabricating an Integrated Circuit with a Self-Aligned Contact
Patent:
5,907,781 →
Application:
09/049,517 →
Elimination of Poly Cap for Easy POLY1 Contact for Nand Product
Patent:
6,057,193 →
Application:
09/061,515 →
Semiconductor Device Manufacturing Method Including Various Oxidation Steps with Different Concentration of Chlorine to Form a Field Oxide
Patent:
6,187,640 →
Application:
09/193,252 →
Elimination of poly cap for easy poly 1 contact for nand product
Patent:
6,312,991 →
Application:
09/531,582 →
Method and System for Reducing Charge Gain and Charge Loss When Using an Arc Layer in Interlayer Dielectric Formation
Patent:
6,727,143 →
Application:
09/533,619 →
Decoded source lines to tighten erase Vt distribution
Patent:
6,285,599 →
Application:
09/562,747 →
Ultraviolet-Light Irradiation Apparatus
Method of Fabricating Semiconductor Memory Device and Semiconductor Memory Device Driver
Semiconductor Memory Device
Semiconductor Memory Device
Semiconductor Memory Device
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Release of Security Interest
Dec 17, 2015
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC; SPANSION TECHNOLOGY INC.
Reel/Frame 037315/0700 →
Partial Release of Security Interest in Patents
Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
Security Interest
Aug 15, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039676/0237 →
Assignment of Assignor's Interest
Oct 18, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040415/0100 →
Assignment of Assignor's Interest
Oct 18, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040415/0478 →
Assignment of Assignor's Interest
Oct 18, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040415/0593 →
Assignment of Assignor's Interest
Oct 18, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040415/0001 →
Assignment of Assignor's Interest
Oct 19, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040417/0522 →
Assignment of Assignor's Interest
Oct 19, 2016
From: FUJITSU AMD SEMICONDUCTOR LIMITED
To: NIHON CYPRESS K.K.
Reel/Frame 040419/0254 →
Assignment of Assignor's Interest
Mar 10, 2017
From: NIHON CYPRESS K.K.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 041537/0732 →
Assignment of Assignor's Interest
Mar 10, 2017
From: NIHON CYPRESS K.K.
To: SPANSION LLC
Reel/Frame 041537/0737 →
Assignment of Assignor's Interest
Mar 29, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 042108/0880 →
Release of Security Interest
May 17, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042486/0315 →
Assignment of Assignor's Interest
May 17, 2017
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION LLC
Reel/Frame 042416/0448 →
Release of Security Interest
Jun 12, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042769/0227 →
Assignment of Assignor's Interest
Jun 14, 2017
From: SPANSION LLC
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 042702/0460 →
Corrective Assignment to Correct the Following Numbers 6272046,7277824,7282374,7286384,7299106,7337032,7460920,7519447 Previously Recorded on Reel 039676 Frame 0237. Assignor(S) Hereby Confirms the Security Interest.
Oct 16, 2018
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING
Reel/Frame 047797/0854 →
Assignment and Assumption of Security Interest in Intellectual Property
Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
Release of Security Interest
Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →