IP Library › Assignment 074326/0426
Patent Assignment
Reel/Frame 074326/0426

Quitclaim Assignment

Recorded: 2026-04-09 Received: 2026-04-09 Pages: 18
Assignor
EDISON INNOVATIONS LLC
Executed: 2025-09-18
Assignee
RUSHMORE TECHNOLOGIES, LLC
812 W. MCDERMITT DR, SUITE # 1151, ALLEN, TX, 75012, UNITED STATES
Covered Properties (100)
Miller Transition Control Gate Drive Circuit
Application: 17/148,340 →
Miller Transition Control Gate Drive Circuit
Application: 16/238,348 →
Electronics Package Having a Self-Aligning Interconnect Assembly and Method of Making Same
Application: 16/229,049 →
Non-Magnetic Package and Method of Manufacture
Application: 16/205,451 →
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Electronics Package for Light Emitting Semiconductor Devices and Method of Manufacturing Thereof
Application: 16/166,313 →
Device Almost Last Embedded Device Structure and Method of Manufacturing Thereof
Application: 16/153,892 →
Multilayer Interconnect Structure with Buried Conductive via Connections and Method of Manufacturing Thereof
Application: 16/153,905 →
Electronics Package Having a Self-Aligning Interconnect Assembly and Method of Making Same
Electronics Package Having a Multi-Thickness Conductor Layer and Method of Manufacturing Thereof
Application: 15/962,570 →
Stackable Electronic Package and Method of Fabricating Same
Application: 15/956,231 →
Interconnect Devices for Electronic Packaging Assemblies
Application: 15/886,478 →
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Application: 15/816,396 →
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Application: 15/816,312 →
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Application: 15/816,360 →
Semiconductor Logic Device and System and Method of Embedded Packaging of Same
Application: 15/816,254 →
Electronics Package Having a Multi-Thickness Conductor Layer and Method of Manufacturing Thereof
High Impedance Rf Mems Transmission Devices and Method of Making the Same
Application: 15/786,696 →
True Time Delay Beam Former and Method of Operation
Application: 15/782,969 →
True Time Delay Beam Former Module and Method of Making the Same
Application: 15/782,991 →
System and Method for Rapid Current Sensing and Transistor Timing Control
Application: 15/682,940 →
Electronics Package Having a Self-Aligning Interconnect Assembly and Method of Making Same
Application: 15/675,144 →
Method for Making a Seam-Sealable Non-Magnetic Lid and Package
Application: 15/465,172 →
Radio Frequency Die Package with Inverted Ground Plane and Method of Making Same
Application: 15/429,227 →
True Time Delay Module and Beam Former Having Plural Delay Lines Selectively Connected by Plural Swiching Elements Including One or More Intermediate Switching Element
Application: 15/421,915 →
Stackable Electronic Package and Method of Fabricating Same
Application: 15/415,549 →
Heat Spreader with Flexible Tolerance Mechanism
Application: 15/345,778 →
Electronics Package Having a Multi-Thickness Conductor Layer and Method of Manufacturing Thereof
Application: 15/343,248 →
Three-Dimensional Stacked Integrated Circuit Devices and Methods of Assembling the Same
Application: 15/269,576 →
Rf Micro-Electromechanical Systems Having Inverted Microstrip Transmission Lines and Method of Making
Embedded Dry Film Battery Module and Method of Manufacturing Thereof
Application: 15/209,244 →
System and Method for Fault Interruption with Mems Switches
Application: 15/197,221 →
Low Capacitance Surge Suppression Device
Application: 14/982,735 →
System and Method of Electrostatic Carouseling for Gyrocompassing
Application: 14/954,108 →
Lid and Method for Sealing a Non-Magnetic Package
Non-Magnetic Package and Method of Manufacture
Micro-Electromechanical System Relay Circuit
Application: 14/919,797 →
Isolated Control Circuit and Driver for Micro-Electromechanical System Switch
Application: 14/919,833 →
Auxiliary Circuit for Micro-Electromechanical System Relay Circuit
Application: 14/919,769 →
Refractory Seed Metal for Electroplated Mems Structures
Application: 14/844,132 →
Radio Frequency Micro-Electromechanical Systems Having Inverted Microstrip Transmission Lines and Method of Making the Same
Application: 14/839,464 →
Radio Frequency Micro-Electromechanical Systems Having Inverted Microstrip Transmission Lines and Method of Making the Same
Application: 14/839,402 →
Encapsulated Beam and Method of Forming
Application: 14/798,837 →
Electromechanical System Substrate Attachment for Reduced Thermal Deformation
Application: 14/634,981 →
Multichannel Relay Assembly with in Line Mems Switches
Application: 14/558,990 →
Non-Magnetic Package and Method of Manufacture
Application: 14/529,311 →
Lid and Method for Sealing a Non-Magnetic Package
Application: 14/529,410 →
Integrated Micro-Electromechanical Switches and a Related Method Thereof
Application: 14/314,344 →
Interconnect Devices for Electronic Packaging Assemblies
Application: 14/287,237 →
Optically Controlled Mems Switch and Method of Using the Same
Application: 14/196,235 →
Ultrathin Buried Die Module and Method of Manufacturing Thereof
Application: 14/188,093 →
Method of Fabricating a 3D Integrated Electronic Device Structure Including Increased Thermal Dissipation Capabilities
Application: 14/186,362 →
Heat Spreader with Flexible Tolerance Mechanism
Application: 14/093,768 →
Stackable Electronic Package and Method of Fabricating Same
Application: 13/969,965 →
Heat Spreader with Flexible Tolerance Mechanism
Application: 61/733,138 →
Switching Apparatus Including Gating Circuitry for Actuating Micro-Electromechanical System (Mems) Switches
Application: 13/630,122 →
Encapsulated Beam and Method of Forming
Application: 13/533,192 →
Ultrathin Buried Die Module and Method of Manufacturing Thereof
Application: 13/431,168 →
Integrated Circuit Package and Method of Making Same
Application: 13/327,333 →
Micro-Electromechanical Switch and a Related Method Thereof
Application: 13/307,262 →
System and Method of Forming a Patterned Conformal Structure
Application: 13/301,941 →
3D Integrated Electronic Device Structure Including Increased Thermal Dissipation Capabilities
Application: 13/249,492 →
Interconnect Structure
Application: 13/136,736 →
Electrical Distribution System
Application: 13/194,002 →
Stackable Electronic Package and Method of Fabricating Same
Application: 13/101,249 →
Switching Array Having Circuitry to Adjust a Temporal Distribution of a Gating Signal Applied to the Array
Application: 13/096,071 →
Systems and Methods for Enhancing Reliability of Mems Devices
Application: 13/077,704 →
Optically Controlled Mems Switch and Method of Using the Same
Application: 13/004,757 →
Power Switching System Including a Micro-Electromechanical System (Mems) Array
Application: 12/984,338 →
Method of Forming a Micro-Electromechanical System Device
Application: 12/975,090 →
Micro-Electromechanical System Based Arc-Less Switching with Circuitry for Absorbing Electrical Energy During a Fault Condition
Application: 12/967,526 →
Mems-Based Switching Systems
Application: 12/940,027 →
Contact Material, Device Including Contact Material, and Method of Making
Application: 12/893,444 →
Article Including Thermal Interface Element and Method of Preparation
Application: 12/826,337 →
Mems Switching Array Having a Substrate Arranged to Conduct Switching Current
Application: 12/817,578 →
Switch Structure and Associated Circuit
Application: 12/639,060 →
Method and Apparatus for Switching Electrical Power
Application: 12/629,309 →
Switch Structures
Application: 12/627,476 →
System and Method for Magnetic Resonance Coil Actuation
Application: 12/565,236 →
Switch Structure and Method
Application: 12/565,127 →
Power Supply with a Piezoelectric Transformer and Method for Power Conversion
Application: 12/550,029 →
Switch Structures
Application: 12/541,321 →
Transformer on-Load Tap Changer Using Mems Technology
Application: 12/500,212 →
System and Method of Forming Isolated Conformal Shielding Areas
Application: 12/488,639 →
Method and System to Enhance Reliability of Switch Array
Application: 12/474,299 →
Integrated Circuit Package and Method of Making Same
Application: 12/467,748 →
Stackable Electronic Package and Method of Fabricating Same
Application: 12/463,090 →
High Voltage Switch and Method of Making
Application: 12/416,292 →
Stackable Electronic Package
Application: 12/410,237 →
Integrated Circuit Package and Method of Making Same
Application: 12/410,255 →
System and Method for Stacked Die Embedded Chip Build-Up
Application: 12/399,083 →
Micro-Electromechanical System Switch
Application: 12/340,775 →
System and Method of Forming a Patterned Conformal Structure
Application: 12/263,874 →
System and Method for Pre-Patterned Embedded Chip Build-Up
Application: 12/241,236 →
Micro-Electromechanical Switch Protection in Series Parallel Topology
Application: 12/209,064 →
Ultra Thin Die Electronic Package
Application: 12/138,553 →
Interconnect Structure Including Hybrid Frame Panel
Application: 12/102,429 →