Cooling channel shape with substantially constant cross sectional area
Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly comprises a semiconductor device and a cold plate directly bonded to a backside of the semiconductor device. The first side of the cold plate includes coolant channels, and a second side of the cold plate comprises at least two openings, defined by opening sidewalls extending away from the second side and towards the first side. The cavity sidewalls and the coolant channels of the first side run in a first direction, the at least two openings on the second side run in a second direction different from the first direction and overlap with portions of the coolant channels on the first side to form a continuous aperture between the second side and the first side of the cold plate.
1 . An integrated cooling assembly comprising:
a semiconductor device and a cold plate directly bonded to a backside of the semiconductor device, wherein the cold plate is formed from a single substrate and comprises:
a perimeter sidewall which extends downwardly from a top side of the cold plate to the backside of the semiconductor device to define a perimeter of the cold plate;
a bottom side of the cold plate opposite the top side comprises a cavity divider comprising cavity sidewalls, and wherein:
the cavity divider extends downwardly from the top side towards the backside;
the bottom side, the cavity sidewalls, the perimeter sidewall and the backside of the semiconductor device collectively define coolant channels therebetween;
the coolant channels are exposed to the backside of the semiconductor device; and
the top side of the cold plate comprises at least two openings, the at least two openings defined by opening sidewalls extending away from the top side and towards the bottom side, wherein:
the cavity sidewalls and the coolant channels of the bottom side extend in a first direction;
the at least two openings on the top side extend in a second direction different from the first direction and overlap with portions of the coolant channels on the bottom side to form separate apertures between each of the coolant channels on the bottom side and the at least two openings on the top side; and
one of the at least two openings comprises an inlet and one of the at least two openings comprises an outlet.
2 . The integrated cooling assembly of claim 1 , wherein the at least two openings allow ingress into and egress out of each of the coolant channels on the bottom side of the cold plate.
3 . The integrated cooling assembly of claim 1 , wherein each coolant channel has a triangular cross-section defined by respective pairs of opposing cavity sidewalls and the backside of the semiconductor device.
4 . The integrated cooling assembly of claim 1 , wherein each pair of opposing cavity sidewalls extend downwardly from the top side to a depth of 100 μm-1000 μm.
5 . The integrated cooling assembly of claim 1 , wherein the bottom side of the cold plate is attached to the semiconductor device by direct dielectric bonds.
6 . The integrated cooling assembly of claim 1 , wherein the bottom side of the cold plate is attached to the semiconductor device by direct hybrid bonds.
7 . The integrated cooling assembly of claim 1 , wherein the second direction is substantially perpendicular to the first direction so that the at least two openings on the top side of the cold plate are substantially perpendicular to the coolant channels of the bottom side.
8 . The integrated cooling assembly of claim 1 , wherein:
the at least two openings on the top side comprise two openings;
the coolant channels comprise a first end and a second end; and
the two openings are disposed vertically in line with the first and second ends of the coolant channels.
9 . The integrated cooling assembly of claim 1 , wherein;
the at least two openings on the top side comprise three openings;
the coolant channels comprise a first end and a second end; and
two of the three openings are disposed vertically in line with the first and second ends of the coolant channels and a third opening is disposed vertically in line with a midpoint of the coolant channels.
10 . The integrated cooling assembly of claim 1 , wherein surfaces of the cavity sidewalls are sloped away from the bottom side at an angle less than 90 degrees.
11 . The integrated cooling assembly of claim 1 , wherein a portion of each coolant channel adjacent to a corresponding aperture from among the apertures in the cold plate includes a tapered section.
12 . The integrated cooling assembly of claim 11 , wherein the tapered section has a substantially triangular shape.
13 . The integrated cooling assembly of claim 1 , wherein:
each coolant channel of the plurality of coolant channels comprises a coolant channel inlet opening on a first end and a coolant channel outlet opening on a second end;
a first coolant channel of the plurality of coolant channels comprises a first coolant channel inlet and a first coolant channel outlet;
coolant is only able to enter into the first coolant channel via the first coolant channel inlet; and
the first coolant channel inlet is tapered.
14 . The integrated cooling assembly of claim 1 , further comprising:
a package substrate upon which the integrated cooling assembly is disposed;
a package cover extending over the integrated cooling assembly so that the integrated cooling assembly is disposed between the package substrate and the package cover, wherein:
the package cover comprises an inlet opening and an outlet opening disposed therethrough; and
each coolant channel is in fluid communication with the inlet opening and the outlet opening.
15 . The integrated cooling assembly of claim 14 , wherein the integrated cooling assembly further comprises a sealing material layer that surrounds an interface between the semiconductor device and the package substrate.
16 . The integrated cooling assembly of claim 1 , wherein the integrated cooling assembly comprises plural semiconductor devices and the cold plate is attached to the plural semiconductor devices.
17 . The integrated cooling assembly of claim 13 , wherein a tapered section of the first coolant channel inlet has a substantially triangular shape.
18 . The integrated cooling assembly of claim 1 , wherein the at least two openings are etched from the top side of the cold plate, the coolant channels being etched from the bottom side of the cold plate.
19 . An integrated cooling assembly comprising:
a semiconductor device; and
a cold plate formed from a single substrate, wherein the cold plate is directly bonded to a backside of the semiconductor device, the cold plate comprising:
a top surface;
a bottom surface, opposite the top surface;
an inlet opening in the top surface forming an inlet channel, wherein the inlet channel extends in a first direction;
an outlet opening in the top surface forming an outlet channel, wherein the outlet channel extends in the first direction; and
a plurality of coolant channels extending in a second direction substantially perpendicular to the first direction, each of the coolant channels being exposed to the backside of the semiconductor device;
wherein each of the coolant channels comprises:
an inlet aperture between a bottom surface of the inlet channel and an upper surface of the coolant channel, the inlet aperture being positioned at a first end portion of the coolant channel; and
an outlet aperture between a bottom surface of the outlet channel and the upper surface of the coolant channel, the outlet aperture being positioned at a second end portion of the coolant channel, the second end portion being opposite to the first end portion, the inlet and outlet apertures being the only fluid pathways between the inlet and outlet channels and the coolant channel.
20 . An integrated cooling assembly comprising:
a semiconductor device; and
a cold plate formed from a single substrate, wherein the cold plate is directly bonded to a backside of the semiconductor device, the cold plate comprising:
a top surface;
a bottom surface, opposite the top surface;
an inlet opening in the top surface forming an inlet channel, wherein the inlet channel extends in a first direction;
a first outlet opening in the top surface forming a first outlet channel, wherein the first outlet channel extends in the first direction;
a second outlet opening in the top surface forming a second outlet channel, wherein the second outlet channel extends in the first direction;
a plurality of coolant channels extending in a second direction substantially perpendicular to the first direction, each of the coolant channels being exposed to the backside of the semiconductor device;
wherein each of the coolant channels comprises:
an inlet aperture between a bottom surface of the inlet channel and an upper surface of the coolant channel, the inlet aperture being positioned between first and second opposing end portions of the coolant channel;
a first outlet aperture between a bottom surface of the first outlet channel and the upper surface of the coolant channel, the first outlet aperture being positioned at the first end portion of the coolant channel;
a second outlet aperture between a bottom surface of the second outlet channel and the upper surface of the coolant channel, the second outlet aperture being positioned at the second end portion of the coolant channel, the inlet aperture and the first and second outlet apertures being the only fluid pathways between the inlet and outlet channels and the coolant channel.