Two-sided liquid cooling
Embodiments herein provide for an integrated cooling assembly and methods of forming the same. The integrated cooling assembly comprises an interposer, a plurality of semiconductor devices, a first cold plate, and at least one second cold plate. The interposer has a first side and a second side opposite the first side. The plurality of semiconductor devices are attached to the first side of the interposer. A first cold plate is attached to at least one of the plurality of first semiconductor devices. At least one second cold plate is attached to the second side of the interposer.
1 . An integrated cooling assembly comprising:
an interposer having a first side and a second side opposite the first side;
a plurality of semiconductor devices attached to the first side of the interposer;
a first cold plate attached to at least one semiconductor device of the plurality of semiconductor devices; and
at least one second cold plate attached to the second side of the interposer,
wherein each of the first and second cold plates comprises one or more coolant channels.
2 . The integrated cooling assembly of claim 1 , wherein:
at least one coolant channel of the first cold plate is fluidly coupled to at least one coolant channel of a second cold plate by a spacer; and
a first adhesive layer is between the spacer and the first cold plate; and
a second adhesive layer is between the spacer and the second cold plate.
3 . The integrated cooling assembly of claim 1 , wherein:
at least one coolant channel of the first cold plate is fluidly coupled to at least one coolant channel of a second cold plate through the interposer; and
the interposer is physically coupled to the first cold plate and the at least one second cold plate by spacers.
4 . The integrated cooling assembly of claim 1 , wherein:
the at least one semiconductor device of the plurality of semiconductor devices comprises one or more pass-through power TSVs; and
the first cold plate comprises one or more electrical connections.
5 . The integrated cooling assembly of claim 1 , wherein the at least one second cold plate is directly bonded to the interposer.
6 . The integrated cooling assembly of claim 1 , further comprising:
a substrate having at least one opening on a first side of the substrate, wherein:
the interposer is attached to the first side of the substrate; and
the at least one second cold plate is disposed in the at least one opening of the substrate.
7 . The integrated cooling assembly of claim 6 , wherein:
the interposer is attached to the substrate in a central portion of the second side of the interposer.
8 . The integrated cooling assembly of claim 6 , wherein:
the plurality of semiconductor devices are disposed on a central portion of a first side of the interposer; and
the interposer is attached to the substrate in a peripheral portion of the second side of the interposer.
9 . The integrated cooling assembly of claim 1 , wherein:
the plurality of semiconductor devices are a plurality of first semiconductor devices;
the plurality of first semiconductor devices are attached to the first side of the interposer;
the first cold plate is attached to at least one first semiconductor device of the plurality of first semiconductor devices; and
the integrated cooling assembly further comprises:
a plurality of second semiconductor devices attached to the second side of the interposer; and
the at least one second cold plate is attached to at least one second semiconductor device of the plurality of second semiconductor devices.
10 . The integrated cooling assembly of claim 9 , wherein the at least one second semiconductor device of the plurality of the second semiconductor devices is an XPU, a dummy chip, or an HBM.
11 . The integrated cooling assembly of claim 9 , wherein:
the first semiconductor devices are disposed on a central portion of the first side of the interposer;
the interposer is attached to a substrate in a peripheral portion of a second side of the interposer;
at least one coolant channel of the first cold plate is fluidly coupled to at least one coolant channel of the at least one second cold plate through the interposer;
the at least one coolant channel of the first cold plate is disposed over at least a portion of a backside of each first semiconductor device of the plurality of first semiconductor devices; and
the at least one coolant channel of the at least one second cold plate is disposed over at least a portion of a backside of each second semiconductor device of the plurality of second semiconductor devices.
12 . The integrated cooling assembly of claim 9 , wherein:
the first cold plate is directly bonded to the at least one first semiconductor device; and
the at least one second cold plate is directly bonded to the at least one second semiconductor device.
13 . The integrated cooling assembly of claim 9 , wherein at least one coolant channel of the first cold plate or the second cold plate is exposed to a portion of a backside of at least one first semiconductor device or a portion of a backside of the at least one second semiconductor device.
14 . The integrated cooling assembly of claim 9 , wherein at least one coolant channel of the first cold plate or the at least one second cold plate is positioned across a first semiconductor device or a second semiconductor device and the at least one coolant channel is not exposed to at least a portion of a backside of the first semiconductor device or at least a portion of a backside of the second semiconductor device.
15 . A method comprising:
providing an interposer having a first side and a second side opposite the first side, wherein a plurality of semiconductor devices are attached to the first side of the interposer;
directly bonding a first cold plate to at least one semiconductor device of the plurality of semiconductor devices; and
attaching at least one second cold plate to the second side of the interposer, wherein each of the first and second cold plates comprises one or more coolant channels.
16 . The method of claim 15 , wherein the attaching the at least one second cold plate comprises directly bonding the at least one second cold plate to the interposer.
17 . The method of claim 15 , wherein:
the plurality of semiconductor devices are a plurality of first semiconductor devices;
the plurality of first semiconductor devices are attached to the first side of the interposer;
the first cold plate is directly bonded to at least one first semiconductor device of the plurality of first semiconductor devices;
a plurality of second semiconductor devices are attached to the second side of the interposer; and
attaching the at least one second cold plate to the second side of the interposer comprises:
directly bonding the at least one second cold plate to at least one second semiconductor device of the plurality of second semiconductor devices.
18 . The method of claim 15 , wherein:
the providing the interposer comprises forming an opening through the interposer; and
the method further comprises coupling at least one coolant channel of the first cold plate to at least one coolant channel of a second cold plate using a first spacer between the interposer and the first cold plate and using a second spacer between the interposer and the second cold plate.
19 . The method of claim 15 , further comprising:
providing a spacer material; and
attaching the first cold plate to the second cold plate using adhesive between the spacer material and portions of the first cold plate and the second cold plate.
20 . The method of claim 15 , further comprising attaching the interposer to a substrate.
21 . An integrated cooling assembly comprising:
an interposer having a first side and a second side opposite the first side;
a plurality of semiconductor devices attached to the first side of the interposer;
a first cold plate attached to at least one semiconductor device of the plurality of semiconductor devices; and
at least one second cold plate attached to the second side of the interposer, wherein:
the at least one semiconductor device of the plurality of semiconductor devices comprises one or more pass-through power TSVs; and
the first cold plate comprises one or more electrical connections.
22 . The integrated cooling assembly of claim 21 , wherein the first cold plate is attached to the at least one semiconductor device of the plurality of semiconductor devices using hybrid bonding.