Patent Assignment
Reel/Frame 058769/0242
Release of Security Interest
Recorded: 2021-11-02
Pages: 13
Assignor
GLAS TRUST CORPORATION LIMITED
Executed: 2021-11-01
Assignee
H.C. STARCK INC.
NYMPHENBURGER STRABE 84, MUNICH, 80636, GERMANY
Covered Properties
(85)
Racks for High-Temperature Metal Processing
PCT:
PCT/US2016/018238 ↗
Event Sequencer for Automatic Test Equipment
Patent:
5,477,139 →
Application:
08/062,362 →
Production of Tantalum-Tungsten Alloys Production by Powder Metallurgy
Patent:
5,918,104 →
Application:
08/997,907 →
T222 Production by Powder Metallurgy
Patent:
5,940,675 →
Application:
08/998,101 →
Pickling of Refractory Metals
Patent:
2,087 →
Application:
09/081,321 →
Cutting Metallates of Refractory Metals
Patent:
2,067 →
Application:
09/177,181 →
Refining of Tantalum and Tantalum Scrap with Carbon
Patent:
6,197,082 →
Application:
09/251,567 →
Low Oxygen Refractory Metal Powder for Powder Metallurgy
Patent:
6,261,337 →
Application:
09/377,077 →
Low Oxygen Refractory Metal Powder for Powder Metallurgy
Refractory Metal and Alloy Refining by Laser Forming and Melting
Pre-Plating Surface Treatments for Enhanced Galvanic-Corrosion Resistance
Refractory Metal Pots
Fine Grain Niobium Sheet via Ingot Metallurgy
Refractory Metal Substrate with Improved Thermal Conductivity
Rejuvenation of Refractory Metal Products
Methods of Making Molybdenum Titanium Sputtering Plates and Targets
Method of Making MOO2 Powders, Products Made from MOO2 Powders, Deposition of MOO2 Thin Films, and Methods of Using Such Materials
Molybdenum Tubular Sputtering Targets with Uniform Grain Size and Texture
Tin Oxide-Based Sputtering Target, Low Resistivity, Transparent Conductive Film, Method for Producing Such Film and Composition for Use Therein
High density refractory metals & alloys sputtering targets
Methods of Forming Sputtering Targets
Tantalum Based Alloy That Is Resistant to Aqueous Corrosion
Dynamic Dehydriding of Refractory Metal Powders
Refractory metal plates with improved uniformity of texture
Methods and Apparatus for Controlling Texture of Plates and Sheets by Tilt Rolling
Low-Energy Method of Manufacturing Bulk Metallic Structures with Submicron Grain Sizes
Tin Oxide-Based Sputtering Target, Transparent Conductive Films, Method for Producing Such Films and Composition for Use Therein
Process for Producing Shaped Refractory Metal Bodies
Application:
12/305,740 →
Publication:
US 2011/0206944
Process for Preparing Metal Powders Having Low Oxygen Content, Powders So-Produced and Uses Thereof
Molybdenum Containing Targets
Liquid Cooled Glass Melt Electrode
Niobium Based Alloy That Is Resistant to Aqueous Corrosion
Methods of Making Molybdenum Titanium Sputtering Plates and Targets
Methods of Joining Protective Metal-Clad Structures
Production of Molybdenum Metal Powder
Protective Metal-Clad Structures
Refractory Metal Pots
Methods of forming molybdenum sputtering targets
Methods of Joining Metallic Protective Layers
Fine Grain Niobium Sheet via Ingot Metallurgy
Methods of Rejuvenating Sputtering Targets
Multi-Block Sputtering Target and Associated Methods and Articles
Process for Preparing Metal Powders Having Low Oxygen Content, Powders So-Produced and Uses Thereof
Dynamic Dehydriding of Refractory Metal Powders
Methods of Manufactuing Large-Area Sputtering Targets
Methods of Manufacturing Large-Area Sputtering Targets by Cold Spray
Methods of Manufacturing Large-Area Sputtering Targets Using Interlocking Joints
Methods of Manufacturing High-Strength Large-Area Sputtering Targets
Large-Area Sputtering Targets
Multi-Block Sputtering Target with Interface Portions and Associated Methods and Articles
Metallic Crucibles and Methods of Forming the Same
Methods of Joining Metallic Protective Layers
Methods of Forming Molybdenum Sputtering Targets
Method of Making Molybdenum-Containing Targets Comprising Three Metal Elements
Method of Making Molybdenum Containing Targets Comprising Molybdenum, Titanium, and Tantalum or Chromium
Dynamic Dehydriding of Refractory Metal Powders
Methods of Rejuvenating Sputtering Targets
Molybdenum Metal Powder
Liquid Cooled Glass Melt Electrode
High-Density Metallic Sputtering Targets
Application:
14/269,836 →
Publication:
US 2014/0299466
Slip and Pressure Casting of Refractory Metal Bodies
Application:
14/288,719 →
Publication:
US 2014/0356216
Methods of Joining Metallic Protective Layers
Copper-Alloy Barrier Layers for Metallization in Thin-Film Transistors and Flat Panel Displays
Copper-Alloy Capping Layers for Metallization in Touch-Panel Displays
Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom
Methods of Depositing Thin Films Using Molybdenum Sputtering Targets
Etch Chemistries for Metallization in Electronic Devices
Touch Screen Device Comprising Mo-Based Film Layer and Methods Thereof
High Purity Refractory Metal Powders and Their Use in Sputtering Targets Which May Have Random Texture
Refractory Metal Plates
Methods of Manufacturing Large-Area Sputtering Targets Using Interlocking Joints
Molybdenum Containing Targets for Touch Screen Device
Partial Spray Refurbishment of Sputtering Targets
Microreactor Systems and Methods
Spray Rejuvenation of Sputtering Targets
Application:
14/950,249 →
Publication:
US 2016/0076138
SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS
Application:
14/992,266 →
Publication:
US 2016/0203960
Methods of Manufacturing Large-Area Sputtering Targets Using Interlocking Joints
Racks for High-Temperature Metal Processing
Racks for High-Temperature Metal Processing
Copper-Alloy Barrier Layers for Metallization in Thin-Film Transistors and Flat Panel Displays
Application:
15/048,335 →
Publication:
US 2016/0172386
Methods of Forming Molybdenum Sputtering Targets
Rack for High-Temperature Metal Processing
Application:
62/117,192 →
Fabrication of Reinforced Superconducting Wires
Application:
62/192,321 →
Fabrication of High-Entropy Alloy Wire for Additive Manufacturing
Application:
62/287,690 →
Fabrication of Metallic Parts by Additive Manufacturing
Application:
62/302,847 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 1, 2021
From: H.C. STARCK INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 057978/0970 →
Release of Security Interest
Nov 1, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057986/0378 →
Release of Security Interest
Nov 1, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057986/0362 →
Release of Security Interest
Nov 1, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057986/0057 →
Release of Security Interest
Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 058768/0827 →
Release of Security Interest
Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0178 →
Release of Security Interest
Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0188 →
Release of Security Interest
Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0198 →
Change of Name
Apr 5, 2022
From: H.C. STARCK INC.
To: MATERION NEWTON INC.
Reel/Frame 059596/0925 →
Assignment of Assignor's Interest
Oct 31, 2023
From: H.C. STARCK INC.
To: COLDWATER FACILITY HOLDING, LLC
Reel/Frame 065402/0530 →
Change of Name
Nov 1, 2023
From: COLDWATER FACILITY HOLDING, LLC
To: H.C. STARCK SOLUTIONS COLDWATER, LLC
Reel/Frame 065415/0744 →
Security Interest
Nov 6, 2023
From: H.C. STARCK SOLUTIONS COLDWATER, LLC; H.C. STARCK SOLUTIONS EUCLID, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 065472/0843 →
Assignment of Assignor's Interest
Feb 3, 2026
From: H.C. STARCK SOLUTIONS COLDWATER, LLC
To: ELMET TECHNOLOGIES, LLC
Reel/Frame 073679/0616 →