Gate-all-around integrated circuit structures having epitaxial source or drain region lateral isolation
Gate-all-around integrated circuit structures having epitaxial source or drain region lateral isolation are described. For example, an integrated circuit structure includes a first vertical arrangement of nanowires and a second vertical arrangement of nanowires. A gate stack is over the first and second vertical arrangements of nanowires. First epitaxial source or drain structures are at ends of the first vertical arrangement of nanowires. Second epitaxial source or drain structures are at ends of the second vertical arrangement of nanowires. An intervening dielectric structure is between neighboring ones of the first epitaxial source or drain structures and the second epitaxial source or drain structures. The intervening dielectric structure has a top surface co-planar with a top surface of the gate structure.
1 . An integrated circuit structure, comprising:
a first vertical arrangement of nanowires and a second vertical arrangement of nanowires;
a gate stack over the first and second vertical arrangements of nanowires;
first epitaxial source or drain structures at ends of the first vertical arrangement of nanowires;
second epitaxial source or drain structures at ends of the second vertical arrangement of nanowires; and
an intervening dielectric structure between and in direct contact with neighboring ones of the first epitaxial source or drain structures and the second epitaxial source or drain structures, the intervening dielectric structure having a top surface co-planar with a top surface of the gate structure.
2 . The integrated circuit structure of claim 1 , wherein the intervening dielectric structure is on a top surface of a shallow trench isolation (STI) structure.
3 . The integrated circuit structure of claim 1 , wherein the intervening dielectric structure comprises a dielectric material having a lower dielectric constant than the STI structure.
4 . The integrated circuit structure of claim 1 , wherein the first epitaxial source or drain structures and the second epitaxial source or drain structures are each non-discrete epitaxial source or drain structures.
5 . The integrated circuit structure of claim 1 , wherein the first vertical arrangement of nanowires is over a first sub-fin, and the second vertical arrangement of nanowires is over a second sub-fin.
6 . A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a first vertical arrangement of nanowires and a second vertical arrangement of nanowires;
a gate stack over the first and second vertical arrangements of nanowires;
first epitaxial source or drain structures at ends of the first vertical arrangement of nanowires;
second epitaxial source or drain structures at ends of the second vertical arrangement of nanowires; and
an intervening dielectric structure between and in direct contact with neighboring ones of the first epitaxial source or drain structures and the second epitaxial source or drain structures, the intervening dielectric structure having a top surface co-planar with a top surface of the gate structure.
7 . The computing device of claim 6 , further comprising:
a memory coupled to the board.
8 . The computing device of claim 6 , further comprising:
a communication chip coupled to the board.
9 . The computing device of claim 6 , further comprising:
a battery coupled to the board.
10 . The computing device of claim 6 , wherein the component is a packaged integrated circuit die.