IP Library Assignment 055187/0164
Patent Assignment
Reel/Frame 055187/0164

Assignment of Assignor's Interest

Recorded: 2021-02-08 Pages: 9
Assignor
CYPRESS SEMICONDUCTOR CORPORATION
Executed: 2020-04-14
Assignee
MONTEREY RESEARCH, LLC
3945 FREEDOM CIRCLE, SUITE 900, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (16)
On-Chip Erase Pulse Counter for Efficient Erase Verify Bist (Built-in-Self-Test) Mode
Patent: 6,665,214 →
Application: 10/200,330 →
Generation of Margining Voltage on-Chip During Testing Cam Portion of Flash Memory Device
Patent: 6,707,718 →
Application: 10/200,539 →
On-Chip Repair of Defective Address of Core Flash Memory Cells
Patent: 6,631,086 →
Application: 10/200,544 →
Semicondutor Device Having Conductive Structures Formed Near a Gate Electrode
Patent: 6,917,068 →
Application: 10/454,517 →
A Usb Peripheral Device Storing an Indication of an Operating Power Mode When a Host Went into Hibernate and Restarting at the Power Mode Accordingly
Patent: 7,072,989 →
Application: 10/850,286 →
Multivariable Transfer Functions
Patent: 8,176,468 →
Application: 11/518,002 →
Publication: US 2007/0168935
Buried Word Line Memory Integrated Circuit System
Patent: 8,508,047 →
Application: 11/550,406 →
Publication: US 2007/0091684
Self-Aligned Sti with Single Poly for Manufacturing a Flash Memory Device
Patent: 8,642,441 →
Application: 11/639,667 →
Non-Volatile Sonos-Type Memory Device
Patent: 7,888,209 →
Application: 12/574,884 →
Publication: US 2010/0022081
Precision Trench Formation Through Oxide Region Formation for a Semiconductor Device
Patent: 8,354,326 →
Application: 12/961,352 →
Publication: US 2011/0081767
Semiconductor Device with Void Detection Monitor
Patent: 8,344,510 →
Application: 13/043,383 →
Publication: US 2011/0156036
Semiconductor Device and Method for Manufacturing Thereof
Patent: 8,669,606 →
Application: 13/156,766 →
Publication: US 2011/0233638
Multivariable Transfer Functions
Patent: 9,459,842 →
Application: 13/328,881 →
System and Method for Manufacturing Self-Aligned Sti with Single Poly
Patent: 9,276,007 →
Application: 14/167,845 →
Publication: US 2014/0312409
System and Method for Manufacturing Self-Aligned Sti with Single Poly
Application: 14/865,563 →
Touch Sensor Pattern
Application: 15/219,608 →
Publication: US 2017/0017347
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Security Agreement Aug 23, 2012
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 028837/0076 →
Assignment of Assignor's Interest Feb 3, 2014
From: OGAMI, KENNETH Y.; ANDERSON, DOUG; BEST, ANDREW J.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 032117/0565 →
Release of Security Interest Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest Jun 29, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036034/0415 →
Assignment of Assignor's Interest Jun 29, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036032/0001 →
Assignment of Assignor's Interest Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036037/0495 →
Assignment of Assignor's Interest Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036050/0001 →
Assignment of Assignor's Interest Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036051/0786 →
Assignment of Assignor's Interest Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036052/0016 →
Assignment of Assignor's Interest Sep 22, 2015
From: THURGATE, TIM; FANG, SHENQING; CHANG, KUO-TUNG; SUK, YOUSEOK
To: SPANSION, LLC
Reel/Frame 036625/0001 →
Assignment of Assignor's Interest Sep 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036724/0592 →
Security Interest Aug 15, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039676/0237 →
Assignment of Assignor's Interest Mar 21, 2017
From: WILSON, COLE; PRENDERGAST, PATRICK; PETERSON, JON
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 041666/0160 →
Patent Security Agreement Apr 25, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 042326/0396 →
Assignment of Assignor's Interest May 1, 2017
From: THURGATE, TIM; FANG, SHENQING; CHANG, KUO-TUNG; SUH, YOUSEOK
To: SPANSION LLC
Reel/Frame 042197/0911 →
Assignment of Assignor's Interest May 3, 2017
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042261/0400 →
Assignment of Assignor's Interest Jun 22, 2018
From: GLOBALFOUNDRIES INC
To: SPANSION LLC
Reel/Frame 046181/0465 →
Corrective Assignment to Correct the Following Numbers 6272046,7277824,7282374,7286384,7299106,7337032,7460920,7519447 Previously Recorded on Reel 039676 Frame 0237. Assignor(S) Hereby Confirms the Security Interest. Oct 16, 2018
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING
Reel/Frame 047797/0854 →
Security Interest Jul 31, 2019
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MUFG UNION BANK, N.A.
Reel/Frame 049917/0093 →
Assignment and Assumption of Security Interest in Intellectual Property Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
Assignment and Assumption of Security Interest Dec 5, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 051209/0721 →
Assignment of Assignor's Interest Jun 11, 2020
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 052905/0031 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst. Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →