Offset pads over TSV
Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad may be disposed at a bonding surface of at least one of the microelectronic substrates, where the contact pad is positioned offset relative to a TSV in the substrate and electrically coupled to the TSV.
1. A microelectronic assembly, comprising:
a first substrate including a first bonding surface;
a first through substrate via (TSV) embedded in the first substrate and extending at least partially through the first substrate, the first TSV having a first TSV width, the first TSV extending in a direction non-parallel to the first bonding surface without being exposed at the first bonding surface;
a second TSV embedded in the first substrate and extending at least partially through the first substrate, the second TSV having a second TSV width different from the first TSV width, the second TSV extending in a direction non-parallel to the first bonding surface, the second TSV being in electrical connection with the first bonding surface;
a first metal contact pad disposed at the first bonding surface and electrically coupled to the first TSV, the first metal contact pad disposed offset relative to the first TSV and not overlapping the first TSV;
one or more embedded conductive traces electrically coupling the first TSV to the first metal contact pad; and
a second substrate direct bonded to the first substrate using a direct dielectric-to-dielectric, non-adhesive bonding technique.
2. The microelectronic assembly of claim 1 , further comprising a redistribution layer, wherein at least a portion of the redistribution layer is disposed between the first TSV and the recess.
3. The microelectronic assembly of claim 2 , wherein the redistribution layer includes the one or more embedded conductive traces.
4. The microelectronic assembly of claim 1 , further comprising one or more dielectric stress-relief layers on a second surface of the first substrate, the one or more stress-relief layers planarized to form a second bonding surface having a second predetermined maximum surface variance.
5. The microelectronic assembly of claim 4 , the one or more stress-relief layers comprising a first low temperature insulating layer at the second surf ace of the first substrate, a second low temperature insulating layer over the first low temperature insulating layer, and a third insulating layer over the second low temperature insulating layer to form the second bonding surface.
6. The microelectronic assembly of claim 1 , wherein the first bonding surface has a planarized topography with a first predetermined maximum surface variance.
7. The microelectronic assembly of claim 1 , wherein the second substrate is direct bonded to the first substrate at the first bonding surface of the first substrate or at a second bonding surface of the first substrate.
8. The microelectronic assembly of claim 1 , wherein the first substrate includes a second surface opposite the first bonding surface, and wherein the first TSV is exposed at the second surface.
9. The microelectronic assembly of claim 1 , further comprising one or more inorganic dielectric layers disposed on a second surface of the first substrate opposite the insulating layer, the one or more inorganic dielectric layers comprising a second bonding surface having a second predetermined maximum surface variance.
10. The microelectronic assembly of claim 9 , wherein the one or more inorganic dielectric layers comprises a first low temperature insulating layer at the second surface of the first substrate, a second low temperature insulating layer over the first low temperature insulating layer, and a third insulating layer over the second low temperature insulating layer to form the second bonding surface.
11. The microelectronic assembly of claim 9 , further comprising a conductive pad embedded in the second bonding surface and electrically coupled to the first TSV.
12. The microelectronic assembly of claim 11 , wherein the conductive pad is disposed over and contacts the first TSV.
13. The microelectronic assembly of claim 11 , wherein the conductive pad is not exposed at the second bonding surface, and further comprising one or more conductive interconnects coupled to the conductive pad and exposed at the second bonding surface.
14. A microelectronic assembly, comprising:
a first substrate including a base layer and an insulating layer over the base layer, the insulating layer having a first bonding surface;
a first through substrate via (TSV) embedded in the base layer and extending at least partially through the base layer, the first TSV having a first TSV width, the first TSV extending in a direction non-parallel to the first bonding surface without being exposed at the first bonding surface;
a second TSV embedded in the base layer and extending at least partially through the base layer, the second TSV having a second TSV width different from the first TSV width, the second TSV extending in a direction non-parallel to the first bonding surface, the second TSV being in electrical connection with the first bonding surface;
a first metal contact pad disposed at the first bonding surface and electrically coupled to the first TSV, the first metal contact pad disposed offset relative to the first TSV and not overlapping the first TSV;
one or more embedded conductive traces electrically coupling the first TSV to the first metal contact pad; and
a second substrate direct bonded to the first substrate using a direct dielectric-to-dielectric, non-adhesive bonding technique.
15. The microelectronic assembly of claim 14 , wherein the first bonding surface has a predetermined maximum surface variance.
16. A bonded structure comprising:
a first microelectronic structure comprising:
a substrate including a first bonding surface; and
a through-substrate via (TSV) with a first width embedded in the substrate and extending at least partially through the substrate;
a second microelectronic structure comprising:
a substrate including a second bonding surface; and
a through-substrate via (TSV) with a second width different from the first width embedded in the substrate and extending at least partially through the substrate;
wherein the second bonding surface is direct bonded to the first bonding surface using a direct dielectric-to-dielectric, non-adhesive bonding technique, and conductive contact features of the second microelectronic structure are direct bonded to conductive contact features of the first microelectronic structure using a direct metal-to-metal, non-adhesive bonding technique.
17. The bonded structure of claim 16 , wherein at least one of the conductive contact features of the first microelectronic structure is in electrical communication with the TSV of the first microelectronic structure, and wherein at least one of the conductive contact features of the second microelectronic structure is in electrical communication with the TSV of the second microelectronic structure.
18. The bonded structure of claim 16 , wherein the substrate of the first microelectronic structure includes a base layer and an insulating layer over the base layer, wherein the insulating layer comprises the first bonding surface.
19. The bonded structure of claim 18 , wherein the TSV of the first microelectronic structure is embedded in the base layer and extends at least partially through the base layer.
20. The bonded structure of claim 18 , wherein the conductive contact features of the first microelectronic structure are at least partially embedded in the insulating layer.