IP Library › Assignment 008829/0760
Patent Assignment
Reel/Frame 008829/0760

Assignment of Assignor's Interest

Recorded: 1997-11-06 Pages: 11
Assignor
HOECHST CELANESE CORPORATION
Executed: 1997-07-01
Assignee
CLARIANT FINANCE (BVI) LIMITED
CITCO BUILDING, WICKHAMS CAY, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Properties (121)
Positive Photoresist Compositions with O-Quinone Diazide, Novolak, and Ptlopylene Glycol Alkyl Ether Acetate
Patent: 4,550,069 →
Application: 06/619,468 →
Positive Photoresist Processing with Mid U-V Range Exposure
Patent: 4,596,763 →
Application: 06/655,824 →
Light-Sensitive Tris Ester of O-Quinone Diazide Comtaining Composition for the Preparation of a Positive-Acting Photoresist
Patent: 4,588,670 →
Application: 06/706,817 →
Process of Using Photoresist Treating Composition Containing a Mixture of a Hexa-Alkyl Distilazane, Propylene Glycol Alkyl Ether and Propy- Lene Glycol Alkyl Ether Acetate
Patent: 4,692,398 →
Application: 06/791,876 →
Stepper for Vlsi Circuit Manufacture Utilizing Radiation Absorbing Dyestuff for Registration of Alignment Markers and Reticle
Patent: 4,677,043 →
Application: 06/795,549 →
Thermally Stabilized Photoresist Images
Patent: 4,701,390 →
Application: 06/802,514 →
Deep Uv Photoresist Composition with 1,3-Disubstituted -5-Diazo Barbituric Acids
Patent: 4,735,885 →
Application: 06/805,641 →
Copolymers from Maleimide and Aliphatic Vinyl Ethers and Esters Used in Positive Photoresist
Patent: 4,720,445 →
Application: 06/829,874 →
High Resolution Photoresist of Imide Containing Polymers
Patent: 4,837,124 →
Application: 06/832,116 →
Novel Mixed Ester O-Quinone Photosensitizers
Patent: 4,732,837 →
Application: 06/858,631 →
Novel Mixed Ester O-Quinone Photosensitizers
Patent: 4,732,836 →
Application: 06/859,284 →
High Temperature Post Exposure Baking Treatment for Positive Photoresist Compositions
Patent: 4,885,232 →
Application: 06/921,879 →
Positive Photoresist Thermally Stable Compositions and Elements Having Deep Uv Response with Maleimide Copolymer
Patent: 4,857,435 →
Application: 07/024,875 →
Method of Developing a High Contrast,Positive Photoresist Using a Developer Containing Alkanolamine
Patent: 4,808,513 →
Application: 07/035,413 →
Blocked Monomer and Polymers Therefrom for Use as Photoresists
Patent: 4,810,613 →
Application: 07/052,950 →
High Resolution Photoresist Based on Imide Containing Polymers
Patent: 4,912,018 →
Application: 07/064,437 →
Composition Containing a Mixture of Hexa-Alkyl Disilazane and Propylene Glycol Alkyl Ether and/or Propylene Glycol Alkyl Ether Acetate
Patent: 4,806,458 →
Application: 07/064,969 →
Hydroxy Polyimides and High Temperature Positive Photoresists Therefrom
Patent: 4,927,736 →
Application: 07/076,098 →
Photosensitive Polyimide Polymer Compositions
Patent: 4,803,147 →
Application: 07/124,742 →
1,3 Disubstituted-5-Diazobarbituric Acids
Patent: 4,902,784 →
Application: 07/140,447 →
Positive-Working Photoresist Compositions
Patent: 5,104,770 →
Application: 07/167,068 →
Mixed Ester O-Quinone Diazide Photosensitizers Process of Preparation
Patent: 4,892,801 →
Application: 07/170,534 →
Phenilic Photosensitizers Containing Quinone Diazide and Acidic Halide Substitutents
Patent: 4,902,785 →
Application: 07/170,538 →
Process for the Production of 3-Mono or 3,5, Disubstituted-4- Acetoxystyrene Its Polymerization, and Hydrolysis
Patent: 4,868,256 →
Application: 07/226,258 →
High Contrast High Thermal Stability Positive Photoresists with Mixed Cresol and Hydroxybenzaldehyde Prepared Novolak and Photosensitive Diazoquinone
Patent: 4,920,028 →
Application: 07/227,404 →
Image Reversal Negative Working O-Naphthoquinone Diazide and Cross- Linking Compound Containing Photoresist Process with Thermal Curing
Patent: 4,929,536 →
Application: 07/268,639 →
Image Reversal Negative Working O-Quinone Diazide and Cross-Linking Compound Containing Photoresist Process with Thermal Curing Treatment
Patent: 4,931,381 →
Application: 07/268,640 →
Blocked Monomer and Polymers Therefrom for Use as Photoresists
Patent: 4,962,171 →
Application: 07/289,592 →
Process for the Production of 3-Mono or 3,5 Disubstituted-4- Acetoxystyrene, Its Polymerization
Patent: 4,868,257 →
Application: 07/312,170 →
Photoresist Treating Composition Consisting of a Mixture of Propylene Glycol Alkyl Ether and Propylene Gylcol Alkyl Ether Acetate
Patent: 4,983,490 →
Application: 07/352,618 →
High Resolution Photoresist of Imide Containing Polymers
Patent: 4,968,581 →
Application: 07/361,985 →
Hydroxlated Aromatic Polyamide Polymer Containing Bound Naphthoquinone Diazide Photosensitizer,Method of Making and Use
Patent: 5,037,720 →
Application: 07/363,245 →
Photochemical Image Process of Positive Photoresist Element with Maleimide Copolymer
Patent: 5,059,513 →
Application: 07/366,088 →
Deep U.V. Photoresist Compositions Containing Polycyclic Cyclopentane -2- Diazo-1,3-Dione
Patent: 5,039,596 →
Application: 07/373,358 →
Positive O-Quinone Diazide Photoresist with a Solvent Mixture of Propylene Glycol Alkyl Ether and Propylene Glycol Alkyl Ether Acetate
Patent: 4,948,697 →
Application: 07/376,147 →
High Sensitivity Mid and Deep Uv Resist
Patent: 4,943,511 →
Application: 07/376,971 →
Photoresist Article Having a Portable, Conformable, Built-on Mask
Patent: 5,240,807 →
Application: 07/388,769 →
Base Developable Negative Acting Photoresists
Patent: 5,106,720 →
Application: 07/405,493 →
Photosensitive Article Having Phenolic Photosensitizers Containing Quinone Diazide and Acid Halide Substituents
Patent: 5,035,976 →
Application: 07/431,342 →
Method of Forming a Thermally Stable Mixed Aldehyde Novolak Resin Containing Resist Pattern and That Pattern on a Substrate
Patent: 4,997,734 →
Application: 07/454,409 →
Novolak Resins of Lowered Hydroxyl Content and High Contrast High Thermal Stability Positive Photoresists Prepared Therefrom
Patent: 5,182,184 →
Application: 07/475,402 →
Method of Forming Resist Pattern and Thermally Stable and Highly Resolved Resist Pattern
Patent: 4,996,122 →
Application: 07/496,240 →
Method for Producing and Using a Positive Photoresist with O-Quinone Diazide, Novolak, and Propylene Glycol Alkyl Ether Acetate
Patent: 5,066,561 →
Application: 07/501,970 →
Biz-Diazotized Diaryl Diamine Coupled Dyes Having Improved Solubility in Organic Solvent
Patent: 5,068,319 →
Application: 07/502,075 →
Method of Producing an Image Reversal Negative Photoresist Having a Photo-Labile Blocked Imide
Patent: 5,019,488 →
Application: 07/517,530 →
Image Reversal Negative Working O-Quinone Diazide and Cross-Linking Compound Containing Photoresist Process with Thermal Curing Treat- Ment and Element Produced Therefrom
Patent: 5,217,840 →
Application: 07/530,545 →
Positive Photoresist Containing a Mixture of Propylene Glycol Alkyl Ethers and Propylene Glycol Alkyl Ether Acetate
Patent: 5,039,594 →
Application: 07/533,966 →
Blocked Monomer and Polymers Therefrom for Use as Photoresists
Patent: 5,081,001 →
Application: 07/543,321 →
Positive-Working Photoresist Composition Containing Purified Broadband Dye and Process of Using
Patent: 5,108,870 →
Application: 07/561,798 →
Method of Developing a High Contrast, Positive Photoresist Using a Developer Containing a Alkanolamine
Patent: 5,094,934 →
Application: 07/564,665 →
High Contrast, Positive Photoresist Developer Containing Alkanolamine
Patent: 5,126,230 →
Application: 07/587,320 →
Mixed Aldehyde Novolak Resins Useful as High Contrast Thermal Stability Positive Photoresists
Patent: 5,130,409 →
Application: 07/614,636 →
Process of Making Naphthoquinone Diazide Esters Using Lactone Solvents
Patent: 5,300,396 →
Application: 07/619,154 →
Photosensitizer Compositions Containing Diazo Fluorinated Esters of Hexafluoro-Bis-Phenols or Bis-Hexafluoroethers
Patent: 5,260,162 →
Application: 07/628,549 →
Deep U.V. Photoresist Compositions Containing 4-Tert-Butylstyrene/ Maleimide Copolymer and Cyclopentane -2-Diazo-1,3-Dione and Elements Utilizing the Compositions
Patent: 5,182,185 →
Application: 07/693,513 →
Process for the Preparation of Photosensitive Compositions Containing a Mixed Ester O- Quinone Photosensitizer
Patent: 5,162,510 →
Application: 07/697,832 →
Positive Photoresist Containing Dyes
Patent: 5,225,312 →
Application: 07/739,646 →
Positive Photoresist Compositions with O-Quinone Diazide, Novolak and Propylene Glycol Alkyl Ether Acetate
Patent: 5,143,814 →
Application: 07/772,976 →
Blocked Monomer and Polymers Therefrom for Use as Photoresists
Patent: 5,200,529 →
Application: 07/782,699 →
Copolymers of 4-Hydroxystyrene and Alkyl Substituted-4-Hydroxystyrene in Admixture with a Photosensitizer to Form a Photosensitive Composition
Patent: 5,342,727 →
Application: 07/812,878 →
Image Reversal Negative Working O-Naphthoquinone Diazide and Cross- Linking Compound Containing Photoresist Process with Thermal Curing
Patent: 5,256,522 →
Application: 07/815,645 →
Diazo Ester of a Benzolactone Ring Compound and Positive Photoresist Composition and Element Utilizing the Diazo Ester
Patent: 5,221,592 →
Application: 07/847,527 →
Deep Uv Sensitive Photoresist Resistant to Latent Image Decay
Patent: 5,342,734 →
Application: 07/882,207 →
High Contrast High Thermal Stability Positive Photoresists Having Novolak Resins of Lowered Hydroxyl Content
Patent: 5,208,138 →
Application: 07/886,976 →
Hexahydroxybenzophenone Sulfonate Esters of Diazonaphthoquinone Sensitizers and Positive Photoresists Employing Same
Patent: 5,206,348 →
Application: 07/919,357 →
Novolak Resin Mixtures
Patent: 5,371,169 →
Application: 07/953,031 →
Image Reversal Negative Working Photoresist Containing O-Quinone Diazide and Cross-Linking Compound
Patent: 5,399,456 →
Application: 07/978,099 →
Novolak Resin Blends for Photoresist Applications
Patent: 5,374,693 →
Application: 07/996,924 →
Process for Producing a Developer Having a Low Metal Ion Level
Patent: 5,286,606 →
Application: 07/996,925 →
Using a Lewis Base to Control Molecular Weight of Novolak Resins
Patent: 5,614,349 →
Application: 07/997,942 →
Metal Ion Reduction in the Raw Materials and Using a Lewis Base to Control Molecular Weight of Novolak Resin to Be Used in Positive Photoresists
Patent: 5,476,750 →
Application: 07/999,500 →
Positive Photoresists Employing an Isomeric Mixture of Two Hexahydroxy -Benzophenone Esters of Diazonaphthoquinone Sensitizers
Patent: 5,294,521 →
Application: 08/003,206 →
Composition and Method for Removing Photoresist Composition from Substrates Surfaces
Patent: 5,426,017 →
Application: 08/033,076 →
Method for Producing Positive Photoresist Image Utilizing Diazo Ester of Benzolactone Ring Compound and Diazo Sulfonyl Chloride
Patent: 5,348,842 →
Application: 08/042,362 →
Separating Metals Using a Modified Deionizing Resin
Patent: 5,565,496 →
Application: 08/156,182 →
Hexahydroxybenzophenone Sulfonate Esters of Diazonaphthoquinone Sensitizers and Positive Photoresists Employing Same
Patent: 5,395,728 →
Application: 08/168,724 →
Process of Making a Stable Solution of Poly(Hydroxystyrene) Functionalized with T-Butyloxycarbonyl Groups
Patent: 5,395,871 →
Application: 08/239,096 →
Metal Ion Reduction in Top Anti-Reflective Coatings for Photoresists
Patent: 5,516,886 →
Application: 08/258,898 →
Photoresist Having a Low Level of Metal Ions
Patent: 5,543,263 →
Application: 08/261,646 →
Metal Ion Reduction in Novolak Resins and Photoresists
Patent: 5,594,098 →
Application: 08/272,962 →
Copolymers of 4-Hydroxystyrene and Alkyl Substituted-4-Hydroxystyrene
Patent: 5,807,947 →
Application: 08/277,687 →
Metal Ion Reduction in Novolak Resin Solution Using an Anion Exchange Resin
Patent: 5,686,561 →
Application: 08/294,453 →
Novel Matrix Resin for High-Temperature Stable Photoimageable Compositions
Patent: 5,510,420 →
Application: 08/353,000 →
Metal Ion Reduction in Novolak Resin Using an Ion Exchange Catalyst in a Polar Solvent and Photoresists Compositions Therefrom
Patent: 5,521,052 →
Application: 08/365,659 →
Metal Ion Reduction in Novolak Resins Solution in Pgmea by Chelating Ion Exchange Resin
Patent: 5,614,352 →
Application: 08/366,614 →
Isolation of Novolak Resin by Low Temperature Sub Surface Forced Steam Distillation
Patent: 5,750,632 →
Application: 08/366,634 →
Quinone Diazide Compositions Containing Low Metals P-Cresol Oligomers and Process of Producing the Composition
Patent: 5,837,417 →
Application: 08/366,635 →
Method of Developing Positive Photoresist and Compositions Thereor
Application: 08/376,172 →
Positive Photoresist Composition Comprising a Mixed Ester of Tris- Hydroxyphenyl Ethane and a Mixed Ester of Trihydroxybenzophenone
Patent: 5,612,164 →
Application: 08/385,857 →
Method for Removing Photoresist Composition from Substrate Surfaces
Patent: 5,637,436 →
Application: 08/416,234 →
Positive Photosensitive Composition
Application: 08/446,261 →
Metal Ion Reduction in Novolak Resins and Photoresists
Patent: 5,580,949 →
Application: 08/458,588 →
Metal Ion Reduction in Top Anti-Reflective Coatings for Photoresisis
Patent: 5,624,789 →
Application: 08/460,392 →
Metal Ion Reduction in Bottom Anti-Reflective Coatings for Use in Semiconductor Device Formation
Patent: 5,580,700 →
Application: 08/460,611 →
Fractionation of Phenol Formaldehyde Condensate and Photoresist Compositions Produced Therefrom
Patent: 5,693,749 →
Application: 08/530,648 →
Fractionation of Phenol Formaldehyde Condensate and Photoresist Compositions Produced Therefrom
Patent: 5,739,265 →
Application: 08/530,847 →
Process for Producing Surfactant Having a Low Metal Ion Level and Developer Produced Therefrom
Patent: 5,750,031 →
Application: 08/533,828 →
Low Metal Ion Containing 4,4'-[1-[4-[1-(4-Hydroxyphenyl)-1-Methylethyl]Phenyl]Ethylidene]Bisphe Nol and Photoresist Compositions Therefrom
Patent: 5,656,413 →
Application: 08/535,701 →
Low Metals Perfluorooctanoic Acid and Top Anti-Reflective Coatings for Photoresists
Patent: 5,830,990 →
Application: 08/537,199 →
Metal Ion Reduction in Photoresist Compositions by Chelating Ion Exchange Resin
Patent: 5,962,183 →
Application: 08/562,867 →
Isolation of Novolak Resin Without High Temperature Distillation and Photoresist Composition Therefrom
Application: 08/568,916 →
Positive Photoresist Utilizing Mixed Solvent Consistiing Essentially of 3-Methyl-3-Methoxy Butanol and Propylene Glycol Alkyl Ether Acetate
Patent: 5,853,947 →
Application: 08/576,748 →
Acidic Ion Exchange Resin as a Catalyst to Synthesize a Novolak Resin and Photoresist Composition Therefrom
Patent: 5,665,517 →
Application: 08/587,874 →
Metal Ion Reduction of Aminochromatic Chromophores and Their Use in the Synthesis of Low Metal Bottom Anti-Reflective Coatings for Photoresists
Application: 08/660,030 →
Novolak Resin Blends for Photoresist Applications
Patent: 5,646,218 →
Application: 08/692,306 →
Positive Photoresist Composition Containing a 2,4-Dinitro-1-Naphthol
Patent: 5,719,004 →
Application: 08/695,157 →
Antireflective Coatings for Photoresist Compositions
Patent: 5,652,317 →
Application: 08/698,742 →
Aqueous Antireflective Coatings for Photoresist Compositions
Patent: 5,652,297 →
Application: 08/699,001 →
Light Sensitive Composition Containing an Arylhydrazo Dye
Patent: 5,763,135 →
Application: 08/722,711 →
Antireflective Coating for Photoresist Compositions
Patent: 5,733,714 →
Application: 08/724,109 →
Fractionated Novolak Resin and Photoresist Composition Therefrom
Patent: 5,853,954 →
Application: 08/768,539 →
Fractionated Novolak Resin from Cresol-Formaldehyde Reaction Mixture and Photoresist Composition Therefrom
Patent: 5,910,559 →
Application: 08/768,541 →
Method of Using a Lewis Base to Control Molecular Weight of Novolak Resins
Patent: 5,688,893 →
Application: 08/771,715 →
Process for Obtaining a Lift-Off Imaging Profile
Patent: 5,922,503 →
Application: 08/802,807 →
Bottom Antireflective Coatings Through Refractive Index Modification by Anomalous Dispersion
Patent: 6,042,992 →
Application: 08/811,806 →
Light-Absorbing Antireflective Layers with Improved Performance Due to Refractive Index Optimization
Application: 08/811,807 →
Positive Photoresists Containing Novel Photoactive Compounds
Patent: 5,876,897 →
Application: 08/812,542 →
Photosensitive Quinolone Compounds and a Process of Preparation
Patent: 5,866,295 →
Application: 08/813,167 →
Use of Mixtures of Ethyl Lactate and N-Methyl Pyrollidone as an Edge Bead Remover for Photoresists
Patent: 5,814,433 →
Application: 08/833,170 →
Antireflective Coating Compositions for Photoresist Compositions and Use Thereof
Patent: 5,994,430 →
Application: 08/841,750 →
Light Absorbing Polymers
Patent: 5,981,145 →
Application: 08/846,986 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Aug 12, 1985
From: PAMPALONE, THOMAS R.
To: AMERICAN HOECHST CORPORATION, SOMERVILLE, NJ., A CORP. OF DE.
Reel/Frame 004440/0227 →
Assignment of Assignors Interest. Nov 27, 1985
From: GRUNWALD, JOHN J.; SPENCER, ALLEN C.
To: MACDERMID, INCORPORATED, 50 BROOKSIDE ROAD, WATERBURY, CT., A CORP. OF CT.
Reel/Frame 004488/0987 →
Assignment of Assignors Interest. Dec 6, 1985
From: HOPF, FREDERICK R.; MC FARLAND, MICHAEL J.
To: ALLIED CORPORATION, COLUMBIA ROAD AND PARK AVENUE, MORRIS TOWNSHIP, NEW JERSEY, A CORP. OF NEW YORK
Reel/Frame 004492/0448 →
Assignment of Assignors Interest. Jan 9, 1986
From: CORDES, WILLIAM F. III
To: MACDERMIND, INCORPORATED, A CORP. OF CT.
Reel/Frame 004510/0298 →
Assignment of Assignors Interest. Jan 21, 1986
From: DURHAM, DANA
To: AMERICAN HOECHST CORPORATION, A CORP OF DELAWARE
Reel/Frame 004506/0667 →
Assignment of Assignors Interest. Jan 21, 1986
From: KELLY, MICHAEL; MAMMATO, DONALD C.
To: AMERICAN HOECHST CORPORATION, A CORP OF DELAWARE
Reel/Frame 004506/0668 →
Assignment of Assignors Interest. Jan 21, 1986
From: CRANE, LAWRENCE
To: AMERICAN HOECHST CORPORATION, A CORP OF DELAWARE
Reel/Frame 004506/0666 →
Assignment of Assignors Interest. Feb 18, 1986
From: BRAHIM, KARIME; MC FARLAND, MICHAEL J.
To: ALLIED CORPORATION, A CORP. OF NEW YORK
Reel/Frame 004518/0511 →
Assignment of Assignors Interest. Feb 24, 1986
From: WU, CHENGJIU; MOORING, ANNE M.; MC FARLAND, MICHAEL J.
To: ALLIED CORPORATION, A CORP. OF NEW YORK
Reel/Frame 004529/0343 →
Assignment of Assignors Interest. Feb 24, 1986
From: OSUCH, CHRISTOPHER E.; YARDLEY, JAMES T.
To: ALLIED CORPORATION, A CORP. OF NEW YORK
Reel/Frame 004529/0341 →
Assignment of Assignors Interest. Apr 7, 1986
From: MAMMATO, DONALD C.; STEVENS, BRUCE M.
To: AMERICAN HOECHST CORPORATION, A CORP. OF DE.
Reel/Frame 004530/0741 →
Assignment of Assignors Interest. Apr 7, 1986
From: DI CARLO, JOHN; ST. ALBAN, JONAS
To: AMERICAN HOECHST CORPORATION, A CORP. OF DE.
Reel/Frame 004530/0740 →
Assignment of Assignors Interest. Dec 9, 1987
From: FUCHS, ADOLF; EXECUTOR OF THE ESTATE OF JONAS ST. ALBAN, DEC'D.; LOWENSTEIN, DAVID; TILMAN, MENAHEM; ROSENBERG, ETAN
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 004858/0842 →
Letters of Testamentary Dec 9, 1987
From: ST. ALBAN, JONAS, O., DEC'D.
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 004858/0839 →
Assignment of Assignors Interest. Dec 9, 1987
From: POTVIN, ROBERT E.; SOBODACHA, CHESTER J.
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 004858/0843 →
Merger September 30, 1987 Delaware Dec 21, 1987
From: ALLIED CORPORATION, A CORP. OF NY; TORREA CORPORATION, THE, A CORP. OF NY; SIGNAL COMPANIES, INC., THE, A CORP. OF DE
To: ALLIED-SIGNAL INC., A CORP. OF DE
Reel/Frame 004809/0501 →
Assignment of Assignors Interest. May 3, 1988
From: ALLIED CORPORATION, A CORP. OF NY
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 004899/0406 →
Assignment of Assignors Interest. May 3, 1988
From: ALLIED CORPORATION, A CORP. OF N.Y.
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 004881/0597 →
Assignment of Assignors Interest. Aug 2, 1988
From: LAZARUS, RICHARD M.; KAUTZ, RANDALL; DIXIT, SUNIT S.
To: MORTON THIOKOL, INC., 110 NORTH WACKER DRIVE, CHICAGO, ILLINOIS 60606-1560 A DE CORP.
Reel/Frame 004916/0275 →
Assignment of Assignors Interest. Nov 4, 1988
From: MUELLER, WERNER H.; KHANNA, DINESH N.; VORA, ROHITKUMAR H.
To: HOECHST CELANESE CORPORATION, 86 MORRIS AVE., SUMMIT, NJ 07901 A CORP.OF DE
Reel/Frame 004976/0976 →
Assignment of Assignors Interest. Nov 7, 1988
From: MUELLER, WERNER H.; KHANNA, DINESH N.; VORA, ROHITKUMAR H.
To: HOECHST CELANESE CORPORATION, ROUTE 202-206 NORTH, SOMERVILLE, NJ 08876 A CORP. OF DE
Reel/Frame 004977/0174 →
Assignment of Assignors Interest. Jun 5, 1989
From: ASLAM, MOHAMMAD; VICARI, RICHARD
To: HOECHST AG; HOECHST CELANESE CORPORATION
Reel/Frame 005094/0349 →
Assignment of Assignors Interest. Jun 14, 1989
From: SPAK, MARK A.
To: AMERICAN HOECHST CORPORATION
Reel/Frame 005150/0805 →
Merger February 27, 1987 Jun 14, 1989
From: AMERICAN HOECHST CORPORATION
To: CELANESE CORPORATION, A CORP. OF DE.
Reel/Frame 005150/0797 →
Assignment of Assignors Interest. Feb 13, 1990
From: ALLIED-SIGNAL, INC.
To: HOECHST CELANESE CORPORATION, A CORP. OF DE
Reel/Frame 005271/0727 →