Conformal low temperature hermetic dielectric diffusion barriers
Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
1. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a metal interconnect structure in a first dielectric layer above a substrate, the first dielectric layer comprising silicon, oxygen and carbon;
a second dielectric layer directly on the metal interconnect structure and directly on the first dielectric layer, the second dielectric layer comprising nitrogen and oxygen;
a third dielectric layer directly on the second dielectric layer, the third dielectric layer comprising silicon, oxygen and carbon;
a fourth dielectric layer directly on the third dielectric layer, the fourth dielectric layer comprising aluminum and oxygen;
a fifth dielectric layer directly on the fourth dielectric layer, the fifth dielectric layer comprising silicon, oxygen and carbon; and
a conductive via in the fifth dielectric layer and through an opening in the fourth dielectric layer, the third dielectric layer and the second dielectric layer, the conductive via directly on and electrically coupled to the metal interconnect structure.
2. The computing device of claim 1 , further comprising:
a memory coupled to the board.
3. The computing device of claim 1 , further comprising:
a communication chip coupled to the board.
4. The computing device of claim 1 , further comprising:
a camera coupled to the board.
5. The computing device of claim 1 , wherein the component is a packaged integrated circuit die.
6. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a metal interconnect structure in a first low-k dielectric layer above a substrate, the first low-k dielectric layer comprising silicon, oxygen and carbon;
a hardmask layer directly on the metal interconnect structure and directly on the first low-k dielectric layer, the hardmask layer comprising nitrogen and oxygen;
an intermediate dielectric layer directly on the hardmask layer, the intermediate dielectric layer comprising silicon, oxygen and carbon;
a metal oxide layer directly on the intermediate dielectric layer, the metal oxide layer comprising aluminum and oxygen;
a second low-k dielectric layer directly on the metal oxide layer, the second low-k dielectric layer comprising silicon, oxygen and carbon; and
a conductive via in the second low-k dielectric layer and through an opening in the metal oxide layer, the intermediate dielectric layer and the hardmask layer, the conductive via directly on and electrically coupled to the metal interconnect structure.
7. The computing device of claim 6 , further comprising:
a memory coupled to the board.
8. The computing device of claim 6 , further comprising:
a communication chip coupled to the board.
9. The computing device of claim 6 , further comprising:
a camera coupled to the board.
10. The computing device of claim 6 , wherein the component is a packaged integrated circuit die.
11. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a metal interconnect structure in a first dielectric layer, the first dielectric layer comprising silicon, oxygen and carbon;
a second dielectric layer directly on the metal interconnect structure and directly on the first dielectric layer, the second dielectric layer comprising nitrogen and oxygen;
a third dielectric layer directly on the second dielectric layer, the third dielectric layer comprising silicon, oxygen and carbon;
a fourth dielectric layer directly on the third dielectric layer, the fourth dielectric layer comprising aluminum and oxygen;
a fifth dielectric layer directly on the fourth dielectric layer, the fifth dielectric layer comprising silicon, oxygen and carbon; and
a conductive via in the fifth dielectric layer and through an opening in the fourth dielectric layer, the third dielectric layer and the second dielectric layer, the conductive via directly on and electrically coupled to the metal interconnect structure.
12. The computing device of claim 11 , further comprising:
a memory coupled to the board.
13. The computing device of claim 11 , further comprising:
a communication chip coupled to the board.
14. The computing device of claim 11 , further comprising:
a camera coupled to the board.
15. The computing device of claim 11 , wherein the component is a packaged integrated circuit die.
16. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a metal interconnect structure in a first low-k dielectric layer, the first low-k dielectric layer comprising silicon, oxygen and carbon;
a hardmask layer directly on the metal interconnect structure and directly on the first low-k dielectric layer, the hardmask layer comprising nitrogen and oxygen;
an intermediate dielectric layer directly on the hardmask layer, the intermediate dielectric layer comprising silicon, oxygen and carbon;
a metal oxide layer directly on the intermediate dielectric layer, the metal oxide layer comprising aluminum and oxygen;
a second low-k dielectric layer directly on the metal oxide layer, the second low-k dielectric layer comprising silicon, oxygen and carbon; and
a conductive via in the second low-k dielectric layer and through an opening in the metal oxide layer, the intermediate dielectric layer and the hardmask layer, the conductive via directly on and electrically coupled to the metal interconnect structure.
17. The computing device of claim 16 , further comprising:
a memory coupled to the board.
18. The computing device of claim 16 , further comprising:
a communication chip coupled to the board.
19. The computing device of claim 16 , further comprising:
a camera coupled to the board.
20. The computing device of claim 16 , wherein the component is a packaged integrated circuit die.