Patent Assignment
Reel/Frame 074483/0598
Assignment of Assignor's Interest
Recorded: 2026-01-27
Pages: 11
Assignor
EPISTAR CORPORATION
Executed: 2025-10-21
Assignee
TAU CETI VENTURES LLC
17330 PRESTON ROAD STE200D, PLANO, TEXAS, 75252
Covered Properties
(71)
Lighting Apparatuses and Led Modules for Both Illumination and Optical Communication
Application:
14/735,572 →
Publication:
US 2015/0280824
Lighting Apparatuses and Led Modules for Both Illumation and Optical Communication
Application:
13/089,946 →
Publication:
US 2012/0269520
Light Emitting Device with Reflective Electrode
Application:
15/810,585 →
Publication:
US 2018/0069155
Led Module and Method of Bonding Thereof
Light-Emitting Device Having a Patterned Surface
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Illumination Apparatus
Engineered-Phosphor Led Packages and Related Methods
Patent:
8,659,043 →
Application:
13/864,801 →
Reflective Layer Between Light-Emitting Diodes
Engineered-Phosphor Led Packages and Related Methods
Patent:
8,722,439 →
Application:
14/095,419 →
Engineered-Phosphor Led Package and Related Methods
Patent:
8,754,435 →
Application:
13/770,432 →
Omnidirectional Reflector
Integrated Lighting Apparatus Having a Control Device and Method of Manufacturing the Same
Light-Emitting Device and the Manufacturing Method Thereof
Engineered-Phosphor Led Packages and Related Methods
Led Module and Method of Bonding Thereof
Engineered-Phosphor Led Packages and Related Methods
Light Emitting Structure Having Electrodes and Manufacturing Method Thereof
Double Substrate Multi-Junction Light Emitting Diode Array Structure
Intergrated Lighting Apparatus and Method of Manufacturing the Same
Engineered-Phosphor Led Packages and Related Methods
Method of Forming Light-Generating Device Including Reflective Layer
Wafer Level Photonic Device Die Structure and Method of Making the Same
Light-Emitting Device
Light-Emitting Device Having a Patterned Surface
Light Emitting Device with Reflective Electrode
Doubled Substrate Multi-Junction Light Emitting Diode Array Structure
Engineered-Phosphor Led Packages and Related Methods
Light Emitting Structure Having Electrodes Forming a Concave Surface and Manufacturing Method Thereof
Wafer Level Photonic Device Dies Structure and Method of Making the Same
Led Lamp and Method of Making the Same
Light-Emitting Device Having a Patterned Surface
Light-Emitting Device Including Reflective Layer
Light Emitting Structure and a Manufacturing Method Thereof
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device Having a Patterned Surface
Light Emitting Device with Reflective Electrode
Led Module and Method of Bonding Thereof
Lighting Apparatuses and Led Modules for Both Illumination and Optical Communication
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device
Light-Emitting Device Having a Patterned Surface
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device Having a Patterned Surface
A Light Emitting Structure
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Illumination Package
Backlight Module Having Independent Light Source
Illumination Apparatus
Flip-Chip Packaging Structure for Light Emitting Diode and Method Thereof
Illumination Package
Device and Method for Providing Illuminating Light Using Quantum Dots
Package for a Light Emitting Element with Integrated Electrostatic Discharge Protection
Flip-Chip Packaging Method for Light Emitting Diode with Eutectic Layer Not Overlapping Insulating Layer
Light-Emitting Diode Chip
Optoelectronic Device
Light Emitting Device and Method of Forming the Same
Light Emitting Device Having a Patterned Substrate and the Method Thereof
Package for a Light Emitting Element
Optoelectronic Device
Light-Emitting Diode Integration Scheme
Lighting Devices
Light Emitting Device
Led Lamp and Method of Making the Same
Omnidirectional Reflector
Light-Emitting Diode Integration Scheme
Package for a Light Emitting Element
Light-Emitting Device and the Manufacturing Method Thereof
Wafer Level Photonic Device Die Structure and Method of Making the Same
Omnidirectional Reflector
Light Emitting Device and Method of Forming the Same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 15, 2008
From: HSIEH, MIN-HSUN; YIN, CHOU-CHIH; CHEN, CHUN-CHANG; WANG, JEN-SHUI
To: EPISTAR CORPORATION
Reel/Frame 020406/0735 →
Assignment of Assignor's Interest
Nov 13, 2008
From: CHEN, DING-YUAN; YU, CHIA-LIN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021831/0556 →
Assignment of Assignor's Interest
Dec 23, 2009
From: OU, CHEN; YAO, CHIU-LIN
To: EPISTAR CORPORATION
Reel/Frame 023697/0561 →
Assignment of Assignor's Interest
Aug 20, 2010
From: HSU, TA-CHENG; YANG, YA-LAN; SU, YING-YONG; YEH, CHING-SHIAN
To: EPISTAR CORPORATION
Reel/Frame 024867/0563 →
Assignment of Assignor's Interest
Apr 19, 2011
From: HONG, STEVE M.; HSIEH, MIN-HSUN
To: EPISTAR CORPORATION
Reel/Frame 026152/0415 →
Assignment of Assignor's Interest
Jun 17, 2011
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026468/0263 →
Assignment of Assignor's Interest
Jul 20, 2011
From: LIU, HSIN-MAO; HSIEH, MIN-HSUN; CHEN, TZER-PERNG; HONG, MENG-YUAN
To: EPISTAR CORPORATION
Reel/Frame 026622/0129 →
Assignment of Assignor's Interest
Sep 8, 2011
From: HSU, CHIA-LIANG
To: EPISTAR CORPORATION
Reel/Frame 026872/0628 →
Assignment of Assignor's Interest
Nov 1, 2011
From: YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
Reel/Frame 027155/0531 →
Assignment of Assignor's Interest
Mar 13, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027855/0937 →
Assignment of Assignor's Interest
Mar 23, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027919/0067 →
Assignment of Assignor's Interest
Apr 2, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027974/0701 →
Assignment of Assignor's Interest
Apr 16, 2013
From: TISCHLER, MICHAEL A.; ASHDOWN, IAN
To: COOLEDGE LIGHTING INC.
Reel/Frame 030222/0736 →
Assignment of Assignor's Interest
Apr 22, 2013
From: TISCHLER, MICHAEL A.; ASHDOWN, IAN
To: COOLEDGE LIGHTING INC.
Reel/Frame 030260/0047 →
Assignment of Assignor's Interest
Oct 11, 2013
From: TISCHLER, MICHAEL A.; ASHDOWN, IAN
To: COOLEDGE LIGHTING INC.
Reel/Frame 031387/0481 →
Assignment of Assignor's Interest
Nov 7, 2013
From: CHEN, DING-YUAN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 031559/0310 →
Assignment of Assignor's Interest
Dec 4, 2013
From: TISCHLER, MICHAEL A.; ASHDOWN, IAN
To: COOLEDGE LIGHTING INC.
Reel/Frame 031710/0240 →
Assignment of Assignor's Interest
Jan 13, 2014
From: YEH, WEI-YU
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031950/0415 →
Assignment of Assignor's Interest
Mar 18, 2014
From: TISCHLER, MICHAEL A.; ASHDOWN, IAN
To: COOLEDGE LIGHTING, INC.
Reel/Frame 032460/0888 →
Assignment of Assignor's Interest
Aug 12, 2014
From: CHEN, CHAO-HSING; YAO, CHIU-LIN; LIU, HSIN-MAO; HUANG, CHIEN-FU
To: EPISTAR CORPORATION
Reel/Frame 033515/0699 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Merger
Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
Change of Name
Nov 30, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037172/0212 →
Security Interest
Nov 30, 2015
From: COOLEDGE LIGHTING INC.
To: COMERICA BANK
Reel/Frame 037171/0512 →
Change of Name
Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →