IP Library › Assignment 046180/0604
Patent Assignment
Reel/Frame 046180/0604

Release of Security Interest

Recorded: 2018-06-22 Pages: 8
Assignor
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CALIFORNIA, 95134
Covered Properties (27)
Method for Forming Wordlines Having Irregular Spacing in a Memory Array
Patent: 7,052,961 →
Application: 11/003,574 →
Memory Elements Using Organic Active Layer
Patent: 7,102,156 →
Application: 11/021,681 →
Use of Ta-Capped Metal Line to Improve Formation of Memory Element Films
Patent: 7,084,062 →
Application: 11/033,653 →
Aluminum Oxide as Liner or Cover Layer to Spacers in Memory Device
Patent: 7,196,008 →
Application: 11/087,793 →
Ordered Porosity to Direct Memory Element Formation
Patent: 7,776,682 →
Application: 11/110,165 →
System and Method for Improving Oxide-Nitride-Oxide (Ono) Coupling in a Semiconductor Device
Patent: 7,679,129 →
Application: 11/128,389 →
Method of Forming a Memory Device Having Improved Erase Speed
Patent: 7,202,128 →
Application: 11/165,330 →
Use of Supercritical Fluid to Dry Wafer and Clean Lens in Immersion Lithography
Patent: 7,262,422 →
Application: 11/173,257 →
Publication: US 2007/0026345
System and method for reducing cross-coupling noise between charge storage elements in a semiconductor device
Patent: 8,759,894 →
Application: 11/189,765 →
Contact Spacer Formation Using Atomic Layer Deposition
Patent: 7,704,878 →
Application: 11/240,468 →
Publication: US 2007/0077754
Use of Ta-Capped Metal Line to Improve Formation of Memory Element Films
Patent: 7,288,782 →
Application: 11/251,291 →
Thin Film Germanium Diode with Low Reverse Breakdown
Patent: 7,468,296 →
Application: 11/290,787 →
Determining Scheduling Priority Using Queue Time Optimization
Patent: 7,623,936 →
Application: 11/356,267 →
Methods for Fabricating Dual Bit Flash Memory Devices
Patent: 7,732,281 →
Application: 11/410,695 →
Selective Contact Formation Using Masking and Resist Patterning Techniques
Patent: 7,622,389 →
Application: 11/411,353 →
Memory Cell System with Multiple Nitride Layers
Patent: 8,809,936 →
Application: 11/461,428 →
Publication: US 2008/0023750
Metal-Insulator-Metal-Insulator-Metal (Mimim) Memory Device
Patent: 8,093,680 →
Application: 11/521,219 →
Dual Storage Node Memory Devices and Methods for Fabricating the Same
Patent: 7,785,965 →
Application: 11/530,145 →
Publication: US 2008/0064165
Planarization Method Using Hybrid Oxide and Polysilicon Cmp
Patent: 7,829,464 →
Application: 11/551,390 →
Publication: US 2008/0096388
Method of depositing copper using physical vapor deposition
Patent: 8,791,018 →
Application: 11/641,647 →
Publication: US 2008/0146028
Integrated Circuit System with Memory System
Patent: 8,114,736 →
Application: 11/958,254 →
Publication: US 2008/0150042
Methods for Fabricating Dual Bit Flash Memory Devices
Patent: 7,867,848 →
Application: 12/765,646 →
Publication: US 2010/0203694
Planarization Method Using Hybrid Oxide and Polysilicon Cmp
Patent: 7,972,962 →
Application: 12/887,182 →
Publication: US 2011/0008966
Metal-Insulator-Metal-Insulator-Metal (Mimim) Memory Device
Patent: 8,717,803 →
Application: 13/316,172 →
Publication: US 2012/0081947
Method of Depositing Copper Using Physical Vapor Deposition
Patent: 9,728,414 →
Application: 14/313,751 →
Publication: US 2014/0377948
Method of Depositing Copper Using Physical Vapor Deposition
Application: 14/315,003 →
Publication: US 2014/0377949
Integrated Circuit System with Memory System
Application: 60/871,434 →
Related Assignments (22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 17, 2007
From: CHAN, SIMON SIU-SING; SHIRAIWA, HIDEHIKO; CHANG, KUO-TUNG
To: SPANSION LLC
Reel/Frame 020410/0374 →
Assignment of Assignor's Interest Dec 17, 2007
From: HUI, ANGELA T.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 020410/0284 →
Assignment of Assignor's Interest Jan 17, 2008
From: HUI, ANGELA T.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 020379/0715 →
Assignment of Assignor's Interest Jan 18, 2008
From: CHAN, SIMON SIU-SING; SHIRAIWA, HIDEHIKO; CHANG, KUO-TUNG
To: SPANSION LLC
Reel/Frame 020386/0035 →
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023120/0426 →
Security Agreement Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Security Agreement Aug 23, 2012
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 028840/0001 →
Release of Security Interest Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Release of Security Interest Dec 17, 2015
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC; SPANSION TECHNOLOGY INC.
Reel/Frame 037315/0700 →
Security Interest Aug 15, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039676/0237 →
Assignment of Assignor's Interest Sep 22, 2017
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 043956/0756 →
Corrective Assignment to Correct the Following Numbers 6272046,7277824,7282374,7286384,7299106,7337032,7460920,7519447 Previously Recorded on Reel 039676 Frame 0237. Assignor(S) Hereby Confirms the Security Interest. Oct 16, 2018
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING
Reel/Frame 047797/0854 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest Jul 10, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049709/0871 →
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst. Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054479/0842 →
Assignment of Assignor's Interest Nov 19, 2020
From: GLOBALFOUNDRIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 054482/0862 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →