Integrated circuit margin measurement and failure prediction device
A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.
1 . A computer-readable medium having stored thereon a computer-readable encoding of an integrated circuit (IC), the computer-readable encoding of the IC comprising:
(i) a signal path combiner comprising: (a) a plurality of input paths, each connected to an input of a flip-flop of multiple flip-flops that are comprised in parallel bit paths of a data source in the IC, wherein each of the parallel bit paths terminates with a different one of the multiple flip-flops, and (b) an output;
(ii) a delay circuit comprising: (a) an output, and (b) an input connected to the signal path combiner output; and
(iii) a comparison circuit connected to: (a) the output of the delay circuit, and (b) the output of the signal path combiner,
wherein, when the IC is fabricated according to the computer-readable encoding:
each signal received on a different one of the flip-flops of the data source is also received by a respective one of the plurality of input paths of the signal path combiner,
the delay circuit applies, at different times, different respective delays to a signal received at the input of the delay circuit, to provide, at the output of the delay circuit, different delayed signals respective of the different delays, and
the comparison circuit provides comparison outputs each based on a comparison of the output of the signal path combiner with a different one of the delayed signals.
2 . The computer-readable medium of claim 1 , wherein:
the applying of the different respective delays at different times comprises changing an applied delay in small steps.
3 . The computer-readable medium of claim 1 , wherein:
the signal path combiner, the delay circuit, and the comparison circuit are part of a margin measurement and failure prediction circuit that is comprised in the computer-readable encoding of the IC; and
in the fabricated IC, the margin measurement and failure prediction circuit determines, based on the comparison outputs, a delay timing and/or a margin of at least one of the parallel bit paths.
4 . The computer-readable medium of claim 3 , wherein the determining of the delay timing and/or margin comprises:
determining a minimal delay timing and/or a minimal margin among delay timings and/or margins, respectively, of the parallel bit paths.
5 . The computer-readable medium of claim 4 , wherein, in the fabricated IC, the margin measurement and failure prediction circuit further predicts future failure of the fabricated IC based on analyzing a change in the minimal margin over time.
6 . The computer-readable medium of claim 5 , wherein the computer-readable encoding of the IC further comprises a circuit configured to perform at least one of the following actions to prolong a lifetime of the fabricated IC before the predicted future failure of the fabricated IC: clock modification, logic modification, or voltage modification.
7 . The computer-readable medium of claim 1 , wherein said signal path combiner comprises a logical XOR combiner, a Hamming parity combiner, or a multiplexer.
8 . The computer-readable medium of claim 7 , wherein said signal path combiner is the logical XOR combiner, and wherein the computer-readable encoding of the IC further comprises:
a first flip-flop connected to receive: (a) input from the output of the logical XOR combiner, in parallel to said delay circuit, and (b) a clock signal;
a second flip-flop connected to receive: (a) the output of said delay circuit, and (b) the clock signal; and
a XOR component connected to receive: (a) an output of said first flip-flop, and (b) an output of said second flip-flop.
9 . The computer-readable medium of claim 8 , wherein, in the fabricated IC, said XOR component outputs a logical 1 when only one of
the output of said logical XOR combiner, and
one of the delayed signals,
is a logical 1 during the clock signal.
10 . The computer-readable medium of claim 9 , wherein said signal path combiner is the Hamming parity combiner, and wherein, in the fabricated IC, the Hamming parity combiner compresses the signals received on the input paths into a Hamming space.
11 . The computer-readable medium of claim 9 , wherein said signal path combiner is the multiplexer, and wherein, in the fabricated IC, the multiplexer selects one or more of the signals of the input paths to be input into said delay circuit.
12 . The computer-readable medium of claim 1 , wherein the computer-readable encoding of the IC further comprises:
a first internal storage circuit, connected to the signal path combiner output and arranged to store the signal path combiner output, such that, in the fabricated IC, the comparison circuit uses the stored signal path combiner output as said output of the signal path combiner; and
a second internal storage circuit, connected to receive each of the delayed signals and arranged to store each of the delayed signals, such that, in the fabricated IC, the comparison circuit uses each of the stored delayed signals as the different one of the delayed signals.
13 . The computer-readable medium of claim 1 , wherein the computer-readable encoding of the IC further comprises at least one buffer, wherein, in the fabricated IC, said at least one buffer balances a delay through (a) the signal path combiner, (b) the delay circuit, and optionally (c) the comparison circuit.
14 . The computer-readable medium of claim 1 , wherein, in the computer-readable encoding of the IC, the multiple flip-flops of the parallel bit paths are grouped by a clock enable, such that in the fabricated IC, the multiple flip-flops of the parallel bit paths are clocked as a group.
15 . An integrated circuit (IC) comprising:
(i) a signal path combiner comprising: (a) a plurality of input paths, each connected to an input of a flip-flop of multiple flip-flops that are comprised in parallel bit paths of a data source in the IC, wherein each of the parallel bit paths terminates with a different one of the multiple flip-flops, and (b) an output,
wherein the signal path combiner is configured such that each signal received on a different one of the flip-flops of the data source is also received by a respective one of the plurality of input paths of the signal path combiner;
(ii) a delay circuit comprising: (a) an output, and (b) an input connected to the signal path combiner output,
wherein the delay circuit is configured to apply, at different times, different respective delays to a signal received at the input of the delay circuit, to provide, at the output of the delay circuit, different delayed signals respective of the different delays; and
(iii) a comparison circuit connected to: (a) the output of the delay circuit, and (b) the output of the signal path combiner,
wherein the comparison circuit is configured to provide comparison outputs each based on a comparison of the output of the signal path combiner with a different one of the delayed signals.
16 . The IC of claim 15 , wherein:
the signal path combiner, the delay circuit, and the comparison circuit are part of a margin measurement and failure prediction circuit that is comprised in the IC, the margin measurement and failure prediction circuit configured to determine, based on the comparison outputs, a delay timing and/or a margin of at least one of the parallel bit paths.
17 . The IC of claim 16 , wherein the determining of the delay timing and/or margin comprises:
determining a minimal delay timing and/or a minimal margin among delay timings and/or margins, respectively, of the parallel bit paths.
18 . The IC of claim 17 , wherein the margin measurement and failure prediction circuit is further configured to predict future failure of the fabricated IC based on analyzing a change in the minimal margin over time.
19 . The IC of claim 18 , further comprising a circuit configured to perform at least one of the following actions to prolong a lifetime of the IC before its predicted future: clock modification, logic modification, or voltage modification.
20 . The IC of claim 15 , wherein said signal path combiner comprises a logical XOR combiner, a Hamming parity combiner, or a multiplexer.
21 . The IC of claim 20 , wherein said signal path combiner is the logical XOR combiner, and wherein the IC further comprises:
a first flip-flop connected to receive: (a) input from the output of the logical XOR combiner, in parallel to said delay circuit, and (b) a clock signal;
a second flip-flop connected to receive: (a) the output of said delay circuit, and (b) the clock signal; and
a XOR component connected to receive: (a) an output of said first flip-flop, and (b) an output of said second flip-flop,
wherein said XOR component is configured to output a logical 1 when only one of
the output of said logical XOR combiner, and
one of the delayed signals,
is a logical 1 during the clock signal.
22 . The IC of claim 20 , wherein said signal path combiner is the Hamming parity combiner, which is configured to compress the signals received on the input paths into a Hamming space.
23 . The IC of claim 20 , wherein said signal path combiner is the multiplexer, which is configured to select one or more of the signals of the input paths to be input into said delay circuit.
24 . The IC of claim 15 , further comprising:
a first internal storage circuit, connected to the signal path combiner output and arranged to store the signal path combiner output, such that the comparison circuit is configured to use the stored signal path combiner output as said output of the signal path combiner; and
a second internal storage circuit, connected to receive each of the delayed signals and arranged to store each of the delayed signals, such that the comparison circuit is configured to use each of the stored delayed signals as the different one of the delayed signals.
25 . The IC of claim 15 , wherein the IC further comprises at least one buffer configured to balance a delay through (a) the signal path combiner, (b) the delay circuit, and optionally (c) the comparison circuit.
26 . The IC of claim 15 , wherein the multiple flip-flops of the parallel bit paths are grouped by a clock enable, such that in the fabricated IC, the multiple flip-flops of the parallel bit paths are clocked as a group.