Patent Assignment
Reel/Frame 074501/0151
Assignment of Assignor's Interest
Recorded: 2026-01-26
Pages: 29
Assignor
CELANESE SPECIALTY PRODUCTS, INC.
Executed: 2025-10-21
Assignee
MICROMAX (US) HOLDINGS LLC
222 W LAS COLINAS BLVD, SUITE 900N, IRVING, TEXAS, 75039
Covered Properties
(87)
Method of Forming Low Temperature Cofired Composite Ceramic Devices for High Frequency Applications and Compositions Used Therein
Application:
11/824,116 →
Publication:
US 2008/0023216
Lead Free Ltcc Tape Composition
Application:
12/347,076 →
Publication:
US 2009/0110939
Conductive Paste
Application:
18/815,900 →
Publication:
US 2025/0074813
Semiconductor Device and Methods of Manufacturing a Semiconductor Device
Application:
18/957,958 →
Publication:
US 2025/0210447
Sintering Methods
Application:
18/957,956 →
Publication:
US 2025/0203784
Thick Film Compositions for Use in Electroluminescent Applications
Lead Free Glass(Es), Thick Film Paste(S), Tape Composition(S) and Low Temperature Cofired Ceramic Devices Made Therefrom
Thick Film Conductor Compositions for Use in Membrane Switch Applications
Composition of Conductive Paste
Aqueous Developable Photoimageable Compositions for Use in Photo-Patterning Methods
High Conductivity Polymer Thick Film Silver Conductor Composition for Use in Rfid and Other Applications
Thick Film Conductor Compositions and the Use Thereof in Ltcc Circuits and Devices
Thick Film Paste via Fill Composition for Use in Ltcc Applications
Process for Making Highly Dispersible Spherical Silver Powder Particles and Silver Particles Formed Therefrom
Thick Film Conductor Paste Composition for Ltcc Tape in Microwave Applications
Thick Film Conductor Paste Compositions for Ltcc Tape in Microwave Applications
Thick Film Conductor Composition(S) and Processing Technology Thereof for Use in Multilayer Electronic Circuits and Devices
Device Chip Carriers, Modules, and Methods of Forming Thereof
Conductor Paste for Ceramic Substrate and Electric Circuit
Silver-Palladium Alloy Containing Conductor Paste for Ceramic Substrate and Electric Circuit
Conductor Paste for Ceramic Substrate and Electric Circuit
Conductive Paste for Solid Electorlytic Capacitor Electrode and Process for Producing Solid Electolytic Capacitor Electrode Using the Same
Conductive Composition for Black Bus Electrode, and Front Panel of Plasma Display Panel
Elecrically Conductive Adhesive
Resistor Compositions Using a Cu-Containing Glass Frit
Lead-Free Resistive Composition
Co-Processable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices
Mixed-Metal System Conductors for Use in Low-Temperature Co-Fired Ceramic Circuits and Devices
Mixed-Metal System Conductors for Ltcc (Low-Temperature Co-Fired Ceramic)
Preparation of Silver Spheres by the Reduction of Silver Polyamine Complexes
Nickel-Gold Plateable Thick Film Silver Paste
Photosensitive Paste and Process for Production of Pattern Using the Same
Method for Producing Dispersed, Crystalline, Stable to Oxidation Copper Particles
Electrode and Method for Manufacturing the Same
Uv-Curable Polymer Thick Film Dielectric Compositions with Excellent Adhesion to Ito
Ink Jettable Silver/Silver Chloride Compositions
Method of Manufacturing High Frequency Receiving and/or Transmitting Devices from Low Temperature Co Fired Ceramic Materials and Devices Made Therefrom
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Method of Making Non-Hollow, Non-Fragmented Spherical Metal or Metal Alloy Particles
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Electrode and Method for Manufacturing the Same
Low Temperature Co-Fired Ceramic Structure for High Frequency Applications and Process for Making Same
Electrode and Method for Manufacturing the Same
Low Temperature Fireable Thick Film Silver Paste
Method of Manufacturing a Resistor Paste
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Electrically Conductive Paste Composition
Low Temperature Co-Fired Ceramic (Ltcc) System in a Package (Sip) Configurations for Microwave/Millimeter Wave Packaging Applications
Polymer Thick Film Solder Alloy/Metal Conductor Compositions
Method of Manufacturing Non-Firing Type Electrode
Photonic Sintering of Polymer Thick Film Conductor Compositions
Conductive Metal Composition
Lamination of Polymer Thick Film Conductor Compositions
Lamination of Polymer Thick Film Conductor Compositions
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Photonic Sintering of Polymer Thick Film Copper Conductor Compositions
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Non-Firing Type Electrode
Heat-Curable Polymer Paste
Polymer Thick Film Positive Temperature Coefficient Carbon Composition
Uv-Curable Thermoformable Dielectric for Thermoformable Circuits
Flexible White Reflective Dielectric for Electronic Circuits
Flexible White Reflective Dielectric for Electronic Circuits
Stretchable Polymer Thick Film Silver Conductor for Highly Permeable Substrates
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Electronic Component
Chip Resistor
Method of Manufacturing an Electronic Device
Conductive Paste for Bonding
Conductive Paste for Bonding
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Polyimide-Based Polymer Thick Film Compositions
Polyimide-Based Polymer Thick Film Resistor Composition
Polyimide-Based Polymer Thick Film Resistor Composition
Articles and Substrates Providing Improved Performance of Printable Electronics
Dielectric Filter and Method for Manufacturing the Same
Polymer Thick Film Dielectric Paste Composition
Stretchable Conductive Fluoroelastomer Paste Composition
Flexible Electrically Conductive Pastes and Devices Made Therewith
Fine Silver Particle Dispersion
Stretchable Polymer Thick Film Carbon Black Composition for Wearable Heaters
Non-Lead Resistor Composition
Non-Lead Resistor Composition
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 20, 2004
From: DORFMAN, JAY ROBERT
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014651/0977 →
Assignment of Assignor's Interest
May 25, 2004
From: DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014665/0822 →
Assignment of Assignor's Interest
Jun 14, 2004
From: OGIWARA, TOSHIAKI
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014727/0894 →
Assignment of Assignor's Interest
Dec 1, 2004
From: YANG, HAIXIN; MCKEEVER, MARK ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015403/0487 →
Assignment of Assignor's Interest
May 26, 2006
From: NAIR, KUMARAN MANIKANTAN; MCCOMBS, MARK FREDERICK
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 017685/0038 →
Assignment of Assignor's Interest
Jun 23, 2006
From: OLLIVIER, PATRICIA J.; HANG, KENNETH WARREN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 017832/0055 →
Assignment of Assignor's Interest
Nov 30, 2006
From: HANG, KENNETH WARREN; MCCOMBS, MARK FREDERICK; NAIR, KUMARAN MANIKANTAN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 018567/0511 →
Assignment of Assignor's Interest
Jan 25, 2007
From: NAIR, KUMARAN MANIKANTAN; MCCOMBS, MARK FREDERICK
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 018807/0096 →
Assignment of Assignor's Interest
Jan 21, 2008
From: HANG, KENNETH WARREN; MCCOMBS, MARK FREDERICK; MOBLEY, TIMOTHY PAUL; NAIRA, KUMARAN MANIKANTAN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 020392/0121 →
Assignment of Assignor's Interest
Feb 16, 2008
From: IRIZARRY-RIVERA, ROBERTO; GLICKSMAN, HOWARD DAVID; ALVARADO, VICTOR M. RIVERA
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 020520/0519 →
Assignment of Assignor's Interest
Feb 16, 2008
From: SLUTSKY, JOEL; VEEDER, BRIAN D.; LIN, THOMAS
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 020520/0492 →
Assignment of Assignor's Interest
Dec 1, 2008
From: DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 021905/0074 →
Assignment of Assignor's Interest
Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →
Assignment of Assignor's Interest
Sep 6, 2024
From: TACHIBANA, YUSUKE; VERNOOY, PAUL
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 068513/0458 →
Assignment of Assignor's Interest
Feb 26, 2025
From: YU, SHUFANG; ROSENFELD, HENRY; LEE, HSIN-CHENG; YANG, CHIH-LIANG
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070329/0128 →
Change of Name
Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
Assignment of Assignor's Interest
Nov 3, 2025
From: OZAWA, KAZUTAKA; ROSENFELD, HENRY; NAKAMOTO, AYA; FUKUI, YUSHI
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 072762/0409 →
Assignment of Assignor's Interest
Jan 24, 2026
From: CELANESE MERCURY HOLDINGS INC.
To: CELANESE POLYMERS HOLDING, INC.
Reel/Frame 074491/0515 →
Assignment of Assignor's Interest
Jan 25, 2026
From: CELANESE POLYMERS HOLDING, INC.
To: CELANESE SPECIALTY PRODUCTS, INC.
Reel/Frame 074491/0555 →