IP Library Granted Patent US 12,644,924
Granted Patent B2
US 12,644,924 · App. 18/796,452 · Granted Jun 2, 2026

Die-to-die connectivity monitoring

Inventors: Eyal Fayneh (Givatayim, IL); Guy Redler (Haifa, IL); Evelyn Landman (Haifa, IL); Ishai Zeev Cohen (Haifa, IL); Shaked Rahamim (Geva Carmel, IL); Alex Khazin (Nesher, IL)
Assignee: PROTEANTECS LTD.
G01R31/3016G01R31/3173H03K19/00323H10W70/611H10W70/65
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,644,924
App. No.
18/796,452
Granted
Jun 2, 2026
Kind
B2
Abstract

An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.

Claims (80)

1 . A multi-IC (Integrated Circuit) module comprising:

a first IC comprising a transmitter configured to transmit data signals; and

a second IC interconnected to said first IC over an interconnect lane, wherein said second IC comprises:

a receiver configured to receive the data signals, and

a sensor comprising:

an adjustable delay line configured to receive a clock signal associated with the data signals, and to gradually delay the clock signal by applying a plurality of different time durations to the clock signal,

a first state-element clocked by the gradually delayed clock signal and configured to sample the data signals according to the different time durations applied to the clock signal,

a second state-element clocked by the clock signal and configured to sample the data signals according to the clock signal,

a comparison circuit configured to compare an output of the first state-element with an output of the second state-element, and

processing logic configured to:

set said adjustable delay line to the plurality of time durations, and

determine reliability of connectivity between the first and second ICs, based at least on a minimal one of the different time durations for which said comparison circuit indicates a difference between the outputs of the first and second state-elements.

2 . The multi-IC module of claim 1 , wherein:

said adjustable delay line is further configured to receive the data signals and to gradually delay the data signals by applying a plurality of different time durations to the data signals; and

said sensor further comprises a multiplexing arrangement, configured to select between:

(a) said adjustable delay line receiving the clock signal so as to gradually delay the clock signal, said first state-element being clocked by the gradually delayed clock signal and sampling the data signals according to the different time durations applied to the clock signal, and said second state-element being clocked by the clock signal and sampling the data signals according to the clock signal, and

(b) said adjustable delay line receiving the data signals so as to gradually delay the data signals, said first state-element being clocked by the clock signal and sampling the delayed data signals according to the clock signal, and said second state-element being clocked by the clock signal and sampling the data signals according to the clock signal.

3 . The multi-IC module of claim 2 , wherein:

the clock signal is a positive clock signal; and

when said multiplexing arrangement selects (a), the determining of the reliability of connectivity comprises measuring a hold time of the data signals relative to a rising edge of the clock signal.

4 . The multi-IC module of claim 2 , wherein:

the clock signal is a negative clock signal; and

when said multiplexing arrangement selects (a), the determining of the reliability of connectivity comprises measuring a hold time of the data signals relative to a falling edge of the clock signal.

5 . The multi-IC module of claim 2 , wherein:

the clock signal is a positive clock signal; and

when said multiplexing arrangement selects (b), the determining of the reliability of connectivity comprises measuring a setup time of the data signals relative to a rising edge of the clock signal.

6 . The multi-IC module of claim 2 , wherein:

the clock signal is a negative clock signal; and

when said multiplexing arrangement selects (b), the determining of the reliability of connectivity comprises measuring a setup time of the data signals relative to a falling edge of the clock signal.

7 . The multi-IC module of claim 1 , wherein the sensor further comprises:

a further state-element having a data input and a data output, and being configured to be clocked by the clock signal; and

an OR gate comprising:

a first input coupled to the output of said comparison circuit,

a second input coupled to an output of said further state-element, and

an output configured to provide the data input to said further state-element,

such that, following said comparison circuit indicating a difference between the outputs of the first and second state-elements, the output of said further state-element remains at a logical high level until said further state-element is reset.

8 . The multi-IC module of claim 7 , wherein said second IC further comprises a controller, said controller comprising:

a logic and a memory, said logic being configured to store, in said memory, a value corresponding to the minimal one of the different time durations,

wherein said logic is further configured to perform the storing only if the minimal one of the different time durations is lower than a value already stored in said memory and associated with a previous comparison by the comparison circuit.

9 . The multi-IC module of claim 7 , wherein said sensor further comprises:

a synchronizer configured to reset said further state-element, said synchronizer comprising two serially-connected state-elements so as to avoid metastability.

10 . The multi-IC module of claim 1 , wherein the data signals are received by the receiver during mission mode of the multi-IC module.

11 . A non-transitory computer-readable storage medium having stored thereon a computer-readable encoding of a sensor for a multi-IC module, wherein the multi-IC module comprises: a first IC comprising a transmitter configured to transmit data signals, and a second IC interconnected to said first IC over an interconnect lane, wherein the sensor is comprised in the second IC, and wherein the sensor comprises:

an adjustable delay line configured to receive a clock signal associated with the data signals, and to gradually delay the clock signal by applying a plurality of different time durations to the clock signal;

a first state-element clocked by the gradually delayed clock signal and configured to sample the data signals according to the different time durations applied to the clock signal;

a second state-element clocked by the clock signal and configured to sample the data signals according to the clock signal;

a comparison circuit configured to compare an output of the first state-element with an output of the second state-element; and

processing logic configured to:

set said adjustable delay line to the plurality of time durations, and

determine reliability of connectivity between the first and second ICs, based at least on a minimal one of the different time durations for which said comparison circuit indicates a difference between the outputs of the first and second state-elements.

12 . The non-transitory computer-readable storage medium of claim 11 , wherein:

said adjustable delay line is further configured to receive the data signals and to gradually delay the data signals by applying a plurality of different time durations to the data signals; and

said sensor further comprises a multiplexing arrangement, configured to select between:

(a) said adjustable delay line receiving the clock signal so as to gradually delay the clock signal, said first state-element being clocked by the gradually delayed clock signal and sampling the data signals according to the different time durations applied to the clock signal, and said second state-element being clocked by the clock signal and sampling the data signals according to the clock signal, and

(b) said adjustable delay line receiving the data signals so as to gradually delay the data signals, said first state-element being clocked by the clock signal and sampling the delayed data signals according to the clock signal, and said second state-element being clocked by the clock signal and sampling the data signals according to the clock signal.

13 . The non-transitory computer-readable storage medium of claim 12 , wherein:

the clock signal is a positive clock signal; and

when said multiplexing arrangement selects (a), the determining of the reliability of connectivity comprises measuring a hold time of the data signals relative to a rising edge of the clock signal.

14 . The non-transitory computer-readable storage medium of claim 12 , wherein:

the clock signal is a negative clock signal; and

when said multiplexing arrangement selects (a), the determining of the reliability of connectivity comprises measuring a hold time of the data signals relative to a falling edge of the clock signal.

15 . The non-transitory computer-readable storage medium of claim 12 , wherein:

the clock signal is a positive clock signal; and

when said multiplexing arrangement selects (b), the determining of the reliability of connectivity comprises measuring a setup time of the data signals relative to a rising edge of the clock signal.

16 . The non-transitory computer-readable storage medium of claim 12 , wherein:

the clock signal is a negative clock signal; and

when said multiplexing arrangement selects (b), the determining of the reliability of connectivity comprises measuring a setup time of the data signals relative to a falling edge of the clock signal.

17 . The non-transitory computer-readable storage medium of claim 11 , wherein the sensor further comprises:

a further state-element having a data input and a data output, and being configured to be clocked by the clock signal; and

an OR gate comprising:

a first input coupled to the output of said comparison circuit,

a second input coupled to an output of said further state-element, and

an output configured to provide the data input to said further state-element,

such that, following said comparison circuit indicating a difference between the outputs of the first and second state-elements, the output of said further state-element remains at a logical high level until said further state-element is reset.

18 . The non-transitory computer-readable storage medium of claim 17 , having further stored thereon a computer-readable encoding of a controller for the second IC, the controller comprising:

a logic and a memory, said logic being configured to store, in said memory, a value corresponding to the minimal one of the different time durations,

wherein said logic is further configured to perform the storing only if the minimal one of the different time durations is lower than a value already stored in said memory and associated with a previous comparison by the comparison circuit.

19 . The non-transitory computer-readable storage medium of claim 17 , wherein said sensor further comprises:

a synchronizer configured to reset said further state-element, said synchronizer comprising two serially-connected state-elements so as to avoid metastability.

20 . The non-transitory computer-readable storage medium of claim 11 , wherein the data signals are received by the receiver during mission mode of the multi-IC module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2024
From: FAYNEH, EYAL; REDLER, GUY; LANDMAN, EVELYN; COHEN, ISHAI ZEEV; RAHAMIM, SHAKED; KHAZIN, ALEX
To: PROTEANTECS LTD.
Reel/Frame 068205/0953 →
Continuity (5)
Continuation 17712698 · Apr 4, 2022
Continuation 17205780 · Mar 18, 2021
Continuation PCTIB2021051725 · Mar 2, 2021
Provisional Application 63012457 · Apr 20, 2020
Related Publication 20240393390A1 · Nov 28, 2024
References Cited (343)
US 4555663A · Shimizu · 1985 [cited by applicant]
US 5548539A · Vlach et al. · 1996 [cited by applicant]
US 5748509A · Fewster · 1998 [cited by applicant]
US 5774403A · Clark, II et al. · 1998 [cited by applicant]
US 5818251A · Intrater · 1998 [cited by applicant]
US 5895629A · Russell et al. · 1999 [cited by applicant]
US 5956497A · Ratzel et al. · 1999 [cited by applicant]
US 5966527A · Krivokapic et al. · 1999 [cited by applicant]
US 6172546B1 · Liu et al. · 2001 [cited by applicant]
US 6182253B1 · Lawrence et al. · 2001 [cited by applicant]
US 6486716B1 · Minami et al. · 2002 [cited by applicant]
US 6555872B1 · Dennen · 2003 [cited by applicant]
US 6586921B1 · Sunter · 2003 [cited by applicant]
US 6683484B1 · Kueng et al. · 2004 [cited by applicant]
US 6807503B2 · Ye et al. · 2004 [cited by applicant]
US 6873926B1 · Diab · 2005 [cited by applicant]
US 6882172B1 · Suzuki et al. · 2005 [cited by applicant]
US 6948388B1 · Clayton et al. · 2005 [cited by applicant]
US 7038483B1 · Suzuki et al. · 2006 [cited by applicant]
US 7067335B2 · Weiner et al. · 2006 [cited by applicant]
US 7069458B1 · Sardi et al. · 2006 [cited by applicant]
US 7254507B2 · Dosho et al. · 2007 [cited by applicant]
US 7288958B2 · Takagi · 2007 [cited by applicant]
US 7369893B2 · Gunderson · 2008 [cited by applicant]
US 7443189B2 · Ramappa · 2008 [cited by applicant]
US 7455450B2 · Liu et al. · 2008 [cited by applicant]
US 7501832B2 · Spuhler et al. · 2009 [cited by applicant]
US 7612603B1 · Petricek et al. · 2009 [cited by applicant]
US 7649373B2 · Tokunaga · 2010 [cited by applicant]
US 7701246B1 · Plants et al. · 2010 [cited by applicant]
US 7818601B2 · LaBerge · 2010 [cited by applicant]
US 7877657B1 · Miller et al. · 2011 [cited by applicant]
US 7940862B2 · Tanaka et al. · 2011 [cited by applicant]
US 8001512B1 · White · 2011 [cited by applicant]
US 8086978B2 · Zhang et al. · 2011 [cited by applicant]
US 8170067B2 · Zerbe et al. · 2012 [cited by applicant]
US 8279976B2 · Lin et al. · 2012 [cited by applicant]
US 8310265B2 · Zjajo et al. · 2012 [cited by applicant]
US 8365115B2 · Liu et al. · 2013 [cited by applicant]
US 8418103B2 · Wang et al. · 2013 [cited by applicant]
US 8479130B1 · Zhang et al. · 2013 [cited by applicant]
US 8633722B1 · Lai · 2014 [cited by applicant]
US 8825158B2 · Swerdlow · 2014 [cited by applicant]
US 8996937B2 · Jain et al. · 2015 [cited by applicant]
US 9275706B2 · Tam · 2016 [cited by applicant]
US 9424952B1 · Seok et al. · 2016 [cited by applicant]
US 9483098B2 · Bridges et al. · 2016 [cited by applicant]
US 9490787B1 · Kho et al. · 2016 [cited by applicant]
US 9536038B1 · Quinton et al. · 2017 [cited by applicant]
US 9564883B1 · Quinton et al. · 2017 [cited by applicant]
US 9564884B1 · Quinton et al. · 2017 [cited by applicant]
US 9568546B2 · Franzon · 2017 [cited by applicant]
US 9632126B2 · Yoon et al. · 2017 [cited by applicant]
US 9714966B2 · Chen et al. · 2017 [cited by applicant]
US 9760672B1 · Taneja et al. · 2017 [cited by applicant]
US 9791834B1 · Nassar et al. · 2017 [cited by applicant]
US 9954455B2 · Lin et al. · 2018 [cited by applicant]
US 9977078B2 · Loke et al. · 2018 [cited by applicant]
US 9991879B2 · Huang · 2018 [cited by applicant]
US 10452793B2 · Joshi et al. · 2019 [cited by applicant]
US 10490547B1 · Ali et al. · 2019 [cited by applicant]
US 10509104B1 · Dato · 2019 [cited by applicant]
US 10530347B2 · Tang et al. · 2020 [cited by applicant]
US 10740262B2 · Fayneh et al. · 2020 [cited by applicant]
US 11036266B2 · Srivastava et al. · 2021 [cited by applicant]
US 11081193B1 · Tang · 2021 [cited by applicant]
US 11293977B2 · Fayneh · 2022 [cited by examiner]
US 11409323B2 · Herberholz et al. · 2022 [cited by applicant]
US 11754604B2 · Medina Garcia et al. · 2023 [cited by applicant]
US 11929772B2 · Seol et al. · 2024 [cited by applicant]
US 12013800B1 · Fayneh et al. · 2024 [cited by applicant]
US 12072376B2 · Fayneh · 2024 [cited by examiner]
US 12470223B2 · Fayneh · 2025 [cited by examiner]
US 20010013111A1 · Bishop et al. · 2001 [cited by applicant]
US 20020036328A1 · Richards, Jr. et al. · 2002 [cited by applicant]
US 20040009616A1 · Huisman et al. · 2004 [cited by applicant]
US 20040015793A1 · Saxena et al. · 2004 [cited by applicant]
US 20040017234A1 · Tam et al. · 2004 [cited by applicant]
US 20040230385A1 · Bechhoefer et al. · 2004 [cited by applicant]
US 20040230396A1 · Ye et al. · 2004 [cited by applicant]
US 20040267479A1 · Querbach et al. · 2004 [cited by applicant]
US 20050053162A1 · Goishi · 2005 [cited by applicant]
US 20050104175A1 · Itano et al. · 2005 [cited by applicant]
US 20050114056A1 · Patel et al. · 2005 [cited by applicant]
US 20050134350A1 · Huang et al. · 2005 [cited by applicant]
US 20050134394A1 · Liu · 2005 [cited by applicant]
US 20050154552A1 · Stroud et al. · 2005 [cited by applicant]
US 20050193302A1 · Arguelles et al. · 2005 [cited by applicant]
US 20050285646A1 · Rashid · 2005 [cited by applicant]
US 20060049886A1 · Agostinelli, Jr. et al. · 2006 [cited by applicant]
US 20060184815A1 · Ha et al. · 2006 [cited by applicant]
US 20060224374A1 · Kwon et al. · 2006 [cited by applicant]
US 20070022397A1 · Darsow et al. · 2007 [cited by applicant]
US 20070110199A1 · Momtaz et al. · 2007 [cited by applicant]
US 20070182456A1 · Agarwal et al. · 2007 [cited by applicant]
US 20070288183A1 · Bulkes et al. · 2007 [cited by applicant]
US 20080071489A1 · Wissel · 2008 [cited by applicant]
US 20080074521A1 · Olsen · 2008 [cited by applicant]
US 20080144243A1 · Mariani et al. · 2008 [cited by applicant]
US 20080147355A1 · Fields et al. · 2008 [cited by applicant]
US 20080183409A1 · Roberts et al. · 2008 [cited by applicant]
US 20080186001A1 · Singh et al. · 2008 [cited by applicant]
US 20080186044A1 · Singh · 2008 [cited by applicant]
US 20080216033A1 · Bucossi et al. · 2008 [cited by applicant]
US 20080231310A1 · Vijayaraghavan et al. · 2008 [cited by applicant]
US 20080262769A1 · Kadosh et al. · 2008 [cited by applicant]
US 20090006914A1 · Ko · 2009 [cited by applicant]
US 20090027077A1 · Vijayaraghavan et al. · 2009 [cited by applicant]
US 20090044160A1 · Bueti et al. · 2009 [cited by applicant]
US 20090076753A1 · Vijayaraghavan et al. · 2009 [cited by applicant]
US 20090096495A1 · Keigo · 2009 [cited by applicant]
US 20090105978A1 · Schuttert et al. · 2009 [cited by applicant]
US 20090183043A1 · Niwa · 2009 [cited by applicant]
US 20090222775A1 · Idgunji et al. · 2009 [cited by applicant]
US 20090230947A1 · Sumita · 2009 [cited by applicant]
US 20090244998A1 · Kim · 2009 [cited by applicant]
US 20090273550A1 · Vieri et al. · 2009 [cited by applicant]
US 20090278576A1 · Chakravarty · 2009 [cited by applicant]
US 20090306953A1 · Liu et al. · 2009 [cited by applicant]
US 20100122104A1 · Defazio et al. · 2010 [cited by applicant]
US 20100153896A1 · Sewall et al. · 2010 [cited by applicant]
US 20100251046A1 · Mizuno et al. · 2010 [cited by applicant]
US 20100253382A1 · Wang et al. · 2010 [cited by applicant]
US 20100262942A1 · Nakamura · 2010 [cited by applicant]
US 20110093830A1 · Chen et al. · 2011 [cited by applicant]
US 20110102091A1 · Yeric · 2011 [cited by applicant]
US 20110109377A1 · Fujibe et al. · 2011 [cited by applicant]
US 20110113298A1 · Van Den Eijnden · 2011 [cited by applicant]
US 20110169537A1 · Ma · 2011 [cited by applicant]
US 20110175658A1 · Nomura · 2011 [cited by applicant]
US 20110187433A1 · Baumann et al. · 2011 [cited by applicant]
US 20110267096A1 · Chlipala et al. · 2011 [cited by applicant]
US 20110295403A1 · Higuchi et al. · 2011 [cited by applicant]
US 20110315986A1 · Kaneda et al. · 2011 [cited by applicant]
US 20120025846A1 · Minas et al. · 2012 [cited by applicant]
US 20120038388A1 · Tseng et al. · 2012 [cited by applicant]
US 20120051395A1 · Chen et al. · 2012 [cited by applicant]
US 20120063524A1 · Stott et al. · 2012 [cited by applicant]
US 20120074973A1 · Baldwin et al. · 2012 [cited by applicant]
US 20120163074A1 · Franca-Neto et al. · 2012 [cited by applicant]
US 20120170616A1 · Tsai et al. · 2012 [cited by applicant]
US 20120187991A1 · Sathe et al. · 2012 [cited by applicant]
US 20120212246A1 · Benjamin et al. · 2012 [cited by applicant]
US 20120217976A1 · Clarkson · 2012 [cited by applicant]
US 20120221906A1 · Shetty et al. · 2012 [cited by applicant]
US 20120242490A1 · Ramaswami · 2012 [cited by applicant]
US 20130088256A1 · Chlipala et al. · 2013 [cited by applicant]
US 20130226491A1 · Miguelanez, II et al. · 2013 [cited by applicant]
US 20130241690A1 · Wallace et al. · 2013 [cited by applicant]
US 20130293270A1 · Lee et al. · 2013 [cited by applicant]
US 20130335875A1 · Baumann · 2013 [cited by applicant]
US 20140132293A1 · Abadir et al. · 2014 [cited by applicant]
US 20140132315A1 · Sharma et al. · 2014 [cited by applicant]
US 20140143586A1 · Dalumi et al. · 2014 [cited by applicant]
US 20140184243A1 · Lyer et al. · 2014 [cited by applicant]
US 20140254734A1 · Abdelmoneum et al. · 2014 [cited by applicant]
US 20150061707A1 · Balasubramanian et al. · 2015 [cited by applicant]
US 20150061721A1 · Jeong · 2015 [cited by applicant]
US 20150077136A1 · Li · 2015 [cited by applicant]
US 20150100815A1 · Xanthopoulos et al. · 2015 [cited by applicant]
US 20150121158A1 · Wang et al. · 2015 [cited by applicant]
US 20150199223A1 · Banerjee et al. · 2015 [cited by applicant]
US 20150332451A1 · Amzaleg et al. · 2015 [cited by applicant]
US 20150355033A1 · Zhang et al. · 2015 [cited by applicant]
US 20150365049A1 · Ozawa et al. · 2015 [cited by applicant]
US 20160033574A1 · Serrer et al. · 2016 [cited by applicant]
US 20160042784A1 · Rim et al. · 2016 [cited by applicant]
US 20160072511A1 · Maekawa · 2016 [cited by applicant]
US 20160087643A1 · Nozaki · 2016 [cited by applicant]
US 20160125434A1 · Kohn et al. · 2016 [cited by applicant]
US 20160131708A1 · Huang et al. · 2016 [cited by applicant]
US 20160153840A1 · Huang et al. · 2016 [cited by applicant]
US 20160156176A1 · Kunz, Jr. et al. · 2016 [cited by applicant]
US 20160164503A1 · Kim et al. · 2016 [cited by applicant]
US 20160203036A1 · Mezic et al. · 2016 [cited by applicant]
US 20160254804A1 · Meng · 2016 [cited by applicant]
US 20160373098A1 · Prasad et al. · 2016 [cited by applicant]
US 20170038265A1 · Abdelmoneum et al. · 2017 [cited by applicant]
US 20170093399A1 · Atkinson et al. · 2017 [cited by applicant]
US 20170160339A1 · Jenkins · 2017 [cited by applicant]
US 20170179173A1 · Mandai et al. · 2017 [cited by applicant]
US 20170199089A1 · Fritchman et al. · 2017 [cited by applicant]
US 20170199228A1 · Hsieh et al. · 2017 [cited by applicant]
US 20170214516A1 · Rivaud et al. · 2017 [cited by applicant]
US 20170323222A1 · Rao et al. · 2017 [cited by applicant]
US 20170329391A1 · Jaffari et al. · 2017 [cited by applicant]
US 20170344102A1 · Kolla et al. · 2017 [cited by applicant]
US 20170345490A1 · Yoshimoto et al. · 2017 [cited by applicant]
US 20170364818A1 · Wu et al. · 2017 [cited by applicant]
US 20180034549A1 · Kikuchi · 2018 [cited by applicant]
US 20180109245A1 · Takagi · 2018 [cited by applicant]
US 20180122666A1 · Kim et al. · 2018 [cited by applicant]
US 20180183413A1 · Wong et al. · 2018 [cited by applicant]
US 20180365974A1 · Haas et al. · 2018 [cited by applicant]
US 20190019096A1 · Yoshida et al. · 2019 [cited by applicant]
US 20190095564A1 · Atsatt · 2019 [cited by applicant]
US 20190117122A1 · Kurachi et al. · 2019 [cited by applicant]
US 20190128961A1 · Heron et al. · 2019 [cited by applicant]
US 20190162783A1 · Huang · 2019 [cited by applicant]
US 20190187204A1 · Doescher et al. · 2019 [cited by applicant]
US 20190196564A1 · Murtagh et al. · 2019 [cited by applicant]
US 20190265767A1 · Mehra et al. · 2019 [cited by applicant]
US 20190302830A1 · Chen et al. · 2019 [cited by applicant]
US 20190305074A1 · Kande et al. · 2019 [cited by applicant]
US 20200028514A1 · Hanke et al. · 2020 [cited by applicant]
US 20200203333A1 · Chen et al. · 2020 [cited by applicant]
US 20200209070A1 · Tang et al. · 2020 [cited by applicant]
US 20200210354A1 · Fayneh et al. · 2020 [cited by applicant]
US 20200309850A1 · Bismuth · 2020 [cited by applicant]
US 20200313664A1 · Azam et al. · 2020 [cited by applicant]
US 20210181251A1 · Hsieh et al. · 2021 [cited by applicant]
US 20210325455A1 · Fayneh et al. · 2021 [cited by applicant]
US 20210341535A1 · Hsieh et al. · 2021 [cited by applicant]
US 20220260630A1 · Fayneh et al. · 2022 [cited by applicant]
US 20220349935A1 · Fayneh et al. · 2022 [cited by applicant]
US 20220349938A1 · Vezyrtzis et al. · 2022 [cited by applicant]
US 20230098071A1 · Chonnad et al. · 2023 [cited by applicant]
CN 1886668A · 2006 [cited by applicant]
CN 101014991A · 2007 [cited by applicant]
CN 101241429A · 2008 [cited by applicant]
CN 101344898A · 2009 [cited by applicant]
CN 102422169A · 2012 [cited by applicant]
CN 101915625B · 2012 [cited by applicant]
CN 102273077B · 2014 [cited by applicant]
CN 105210188A · 2015 [cited by applicant]
CN 106959400A · 2017 [cited by applicant]
CN 108534866A · 2018 [cited by applicant]
CN 113466670A · 2021 [cited by applicant]
DE 102007002253A1 · 2007 [cited by applicant]
DE 102014216786B3 · 2015 [cited by applicant]
DE 102012219971B4 · 2016 [cited by applicant]
EP 962991A1 · 1999 [cited by applicant]
EP 1262755A1 · 2002 [cited by applicant]
EP 2006784A1 · 2008 [cited by applicant]
EP 2060924A1 · 2009 [cited by applicant]
EP 2413150A1 · 2012 [cited by applicant]
EP 2770313A1 · 2014 [cited by applicant]
JP S57116228A · 1982 [cited by applicant]
JP 2000215693A · 2000 [cited by applicant]
JP 2002243800A · 2002 [cited by applicant]
JP 2008147245A · 2008 [cited by applicant]
JP 2009021348A · 2009 [cited by applicant]
JP 2009065533A · 2009 [cited by applicant]
JP 2009074921A · 2009 [cited by applicant]
JP 2009276301A · 2009 [cited by applicant]
JP 2011204328A · 2011 [cited by applicant]
JP 2012037238A · 2012 [cited by applicant]
JP 2012088322A · 2012 [cited by applicant]
JP 2014085348A · 2014 [cited by applicant]
JP 2016111563A · 2016 [cited by applicant]
KR 101232207B1 · 2013 [cited by applicant]
KR 20130110989A · 2013 [cited by applicant]
KR 20150073199A · 2015 [cited by applicant]
TW 200914841A · 2009 [cited by applicant]
TW 201614256A · 2016 [cited by applicant]
TW 201709669A · 2017 [cited by applicant]
WO 2005080099A1 · 2005 [cited by applicant]
WO 2013070218A1 · 2013 [cited by applicant]
WO 2013027739A1 · 2015 [cited by applicant]
WO 2019097516A1 · 2019 [cited by applicant]
WO 2019102467A1 · 2019 [cited by applicant]
WO 2019135247A1 · 2019 [cited by applicant]
WO 2019202595A1 · 2019 [cited by applicant]
WO 2019244154A1 · 2019 [cited by applicant]
WO 2020141516A1 · 2020 [cited by applicant]
WO 2020230130A1 · 2020 [cited by applicant]
WO 2021019539A1 · 2021 [cited by applicant]
WO 2021111444A1 · 2021 [cited by applicant]
WO 2021214562A1 · 2021 [cited by applicant]
WO 2022009199A1 · 2022 [cited by applicant]
WO 2022215076A1 · 2022 [cited by applicant]
WO 2023084528A1 · 2023 [cited by applicant]
WO 2023084529A1 · 2023 [cited by applicant]
WO 2023238128A1 · 2023 [cited by applicant]
WO 2024166103A1 · 2024 [cited by applicant]
WO 2025146691A1 · 2025 [cited by applicant]
Borivoje Nikolic et al, “Technology Variability From A design Perspective”; IEEE Transactions on Circuits and Systems I: Regular Papers; vol. 58, Issue: 9, pp. 1996-2009, Sep. 8, 2011—14 Pages. [cited by applicant]
Tamas Virosztek, “Maximum likelihood estimation of ADC parameters”; pp. 1-67, Dec. 19, 2013—67 Pages. [cited by applicant]
Zhang L, Marron JS, Shen H, Zhu Z., “Singular value decomposition and its visualization”, Journal of Computational and Graphical Statistics, Dec. 2007, vol. 6 Issue 4, pp. 833-854. https://doi.org/10.1198/106186007X2560… [cited by applicant]
Kan Takeuchi et al.; “FEOL/BEOL wear-out estimator using stress-to-frequency conversion of voltage/temperature-sensitive ring oscillators for 28nm automotive MCUs”; IEEE, pp. 265-268, Oct. 20, 2016.doi: 10.1109/ESSCIRC.… [cited by applicant]
Kan Takeuchi et al; “Wear-out stress monitor utilising temperature and voltage sensitive ring oscillators” IET Circuits, Devices & Systems. vol. 12 No. 2, pp. 182-188, Jan. 15, 2018. https://doi.org/10.1049/iet-cds.2017… [cited by applicant]
Kan Takeuchi et al; “Experimental Implementation of 8.9Kgate Stress Monitor in 28nm MCU along with Safety Software Library for IoT Device Maintenance”; IEEE International Reliability Physics Symposium (IRPS). Mar. 31, 2… [cited by applicant]
Dan Ernst et al; “Razor: circuit-level correction of timing errors for low-power operation,” in IEEE Micro, vol. 24, No. 6, pp. 10-20, Nov.-Dec. 2004, doi: 10.1109/MM.2004.85. [cited by applicant]
Dan Ernst et al; “Razor: A Low-Power Pipeline Based on Circuit-Level Timing Speculation”; Appears in the 36th Annual International Symposium on Microarchitecture (Micro-36). Dec. 1, 2003. doi: 10.1109/MICRO.2003.1253179. [cited by applicant]
James P. Hofmeister, et al, “Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST™”, IEEE Aerospace Conference Proceedings, Apr. 2008, paper #1148, Version 1. doi: 10.1109/AERO.2008.4526624. [cited by applicant]
Paulheim H & Meusel R. “A decomposition of the outlier detection problem into a set of supervised learning problems”, Machine Learning, Sep. 2015, vol. 100 Issue 2, pp. 509-531. https://doi.org/10.1007/s10994-015-5507-y. [cited by applicant]
Charles R. Lefurgy et al., “Active Management of Timing Guardband to Save Energy in POWER7”; 2011 44th Annual IEEE/ACM International Symposium on Microarchitecture (Micro); pp. 1-11; Dec. 3-7, 2011. [cited by applicant]
Shinkai, Ken-ichi et al. “Device-parameter estimation with on-chip variation sensors considering random variability.”; In 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011), pp. 683-688. IEEE, Jan. … [cited by applicant]
Weiwei Shan et al. “An improved timing error prediction monitor for wide adaptive frequency scaling”; IEICE Electronics Express, vol. 14, No. 21, pp. 1-6, Oct. 20, 2017. DOI: 10.1587/elex.14.20170808. [cited by applicant]
Agilent Technologies; “Clock Jitter Analysis with femto-second resolution”; Jan. 1, 2008. [cited by applicant]
Yousuke Miyake et al; “Temperature and voltage estimation using ring-oscillator-based monitor for field test”; IEEE 23rd Asian Test Symposium; pp. 156-161, Nov. 16, 2014. doi: 10.1109/ATS.2014.38. [cited by applicant]
Basab Datta at al; “Analysis of a ring oscillator based on chip thermal sensor in 65nm technology”; Online at: https://web.archive.org/web/20140328234617/http://www-unix.ecs.umass.edu/˜dkumar/lab4_658_report/lab4_report… [cited by applicant]
Tilman Wolf et al; “Collaborative Monitors for Embedded System Security”. Jan. 1, 2006. First Workshop on Embedded Security in conjunction with EMSOFT '06, Oct. 6, 2006 Seoul, South Korea. [cited by applicant]
Sandeep Kumar Samal et al; “Machine Learning Based Variation Modeling and Optimization for 3D ICs”; J. Inf. Commun. Converg. Eng. 14(4): 258-267, Dec. 2016. http://doi.org/10.6109/jicce.2016.14.4.258. [cited by applicant]
Yin-Nien Chen et al; “Impacts of Work Function Variation and Line-Edge Roughness on TFET and FinFET Devices and 32-Bit CLA Circuits”; J. Low Power Electron. Appl. 2015, 5, 101-115. May 21, 2015. doi:10.3390/jlpea5020101. [cited by applicant]
Yong Zhao et al; “A Genetic Algorithm Based Remaining Lifetime Prediction for a VLIW Processor Employing Path Delay and IDDX Testing”; IEEE; Apr. 12, 2016. [cited by applicant]
Vivek S Nandakumar et al, “Statistical static timing analysis flow for transistor level macros in a microprocessor”; 2010, 11th International Symposium on Quality Electronic Design (ISQED), pp. 163-170, Mar. 22, 2010. d… [cited by applicant]
Jing Li et al, “Variation Estimation and Compensation Technique in Scaled LTPS TFT Circuits for Low-Power Low-Cost Applications”; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 28(1)… [cited by applicant]
Xie Qing et al “Variation-Aware Joint Optimization of the Supply Voltage and Sleep Transistor Size for 7nm FinFET Technology”; 2014 IEEE 32nd international conference on computer design, pp. 380-385, Oct. 19, 2014. doi:… [cited by applicant]
Rebaud B et al , “Timing slack monitoring under process and environmental variations: Application to a DSP performance optimization”; Microelectronics Journal vol. 42 Issue 5, pp. 718-732, Feb. 8, 2011. https://doi.org/… [cited by applicant]
Dierickx B et al, “Propagating variability from technology to system Level”; Physics of Semiconductor Devices, pp. 74-79, Dec. 16, 2007. doi: 10.1109/IWPSD.2007.4472457. [cited by applicant]
Zheng K., “A Comparison of Digital Droop Detection Techniques in ASAP7 FinFET”; Research Review. Sep. 2019. [cited by applicant]
Hongge Chen, “Novel Machine Learning Approaches for Modeling Variations in Semiconductor Manufacturing,” [Master's thesis, Tsinghua University] Jun. 2017. [cited by applicant]
Nidhal Selmane, Shivam Bhasin, Sylvain Guilley, Tarik Graba, Jean-Luc Danger. “WDDL is Protected Against Setup Time Violation Attacks.” CHES, Sep. 2009, Lausanne, Switzerland. pp. 73-83. 10.1109/FDTC.2009.40. hal-004101… [cited by applicant]
Nidhal Selmane, Shivam Bhasin, Sylvain Guilley, Jean-Luc Danger. “Security evaluation of application-specific integrated circuits and field programmable gate arrays against setup time violation attacks.” IET Inf. Secur.… [cited by applicant]
Jianfeng Zhang et al, “Parameter Variation Sensing and Estimation in Nanoscale Fabrics”; Journal of Parallel and Distributed Computing; vol. 74, Issue 6, pp. 2504-2511, Jun. 1, 2014. https://doi.org/10.1016/j.jpdc.2013.… [cited by applicant]
I. A. K. M. Mahfuzul et al, “Variation-sensitive monitor circuits for estimation of Die-to-Die process variation”; 2011 IEEE ICMTS International Conference on Microelectronic Test Structures; pp. 153-157, Apr. 4-7, 2011… [cited by applicant]
Ying Qiao et al, “Variability-aware compact modeling and statistical circuit validation on SRAM test array”; Proceedings vol. 9781, Design-Process-Technology Co-optimization for Manufacturability X, Mar. 16, 2016. DOI:1… [cited by applicant]
David Herres, “The Eye Diagram: What is it and why is it used?”; Online at: https://www.testandmeasurementtips.com/basics-eye-diagrams/, Aug. 16, 2016. [cited by applicant]
Yu-Chuan Lin et al., “A 10-GB/s Eye-Opening Monitor Circuit for Receiver Equalizer Adaptations in 65-nm CMOS;” in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 28, No. 1, pp. 23-34, Jan. 2020. d… [cited by applicant]
Mridul Agarwal et al, “Circuit Failure Prediction and Its Application to Transistor Aging”; 5th IEEE VLSI Test Symposium (VTS'07), pp. 277-286, May 6-10, 2007. doi: 10.1109/VTS.2007.22. [cited by applicant]
Keith A. Bowman et al, “Energy-Efficient and Metastability-Immune Resilient Circuits for Dynamic Variation Tolerance”; IEEE Journal of Solid-State Circuits vol. 44, Issue 1, pp. 49-63, Jan. 2009. doi: 10.1109/JSSC.2008.… [cited by applicant]
Shidhartha Das et al, “A Self-Tuning DVS Processor Using Delay-Error Detection and Correction”; IEEE Journal of Solid-State Circuits; vol. 41, Issue 4, pp. 792-804, Apr. 2006. doi: 10.1109/JSSC.2006.870912. [cited by applicant]
Shidhartha Das et al, “RazorII: In Situ Error Detection and Correction for PVT and SER Tolerance” 2008 IEEE International Solid-State Circuits Conference—Digest of Technical Papers, Feb. 3-7, 2008. doi: 10.1109/JSSC.200… [cited by applicant]
Ramyanshu Datta et al, “On-Chip Delay Measurement for Silicon Debug”; GLSVLSI '04: Proceedings of the 14th ACM Great Lakes symposium on VLSI; pp. 145-148, Apr. 26-28, 2004. https://doi.org/10.1145/988952.988988. [cited by applicant]
Alan Drake et al, “A Distributed Critical-Path Timing Monitor for a 65nm High-Performance Microprocessor”; 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers; Feb. 11-15, 2007. doi: 10.1… [cited by applicant]
Matthias Eireiner et al, “In-Situ Delay Characterization and Local Supply Voltage Adjustment for Compensation of Local Parametric Variations”; IEEE Journal of Solid-State Circuits; vol. 42, Issue 7, pp. 1583-1592, Jul. … [cited by applicant]
Matthew Fojtik et al, “Bubble Razor: An architecture-independent approach to timing-error detection and correction”; 2012 IEEE International Solid-State Circuits Conference; Feb. 19-23, 2012. doi: 10.1109/ISSCC.2012.617… [cited by applicant]
Matthew Fojtik et al, “Bubble Razor: Eliminating Timing Margins in an ARM Cortex-M3 Processor in 45 nm CMOS Using Architecturally Independent Error Detection and Correction”; IEEE Journal of Solid-State Circuits; vol. 4… [cited by applicant]
Piero Franco et al, “On-Line Delay Testing of Digital Circuits”; Proceedings of IEEE VLSI Test Symposium; Apr. 25-28, 1994. doi: 10.1109/VTEST.1994.292318. [cited by applicant]
V. Huard et al, “Adaptive Wearout Managment with In-Situ Aging Monitors”; 2014 IEEE International Reliability Physics Symposium; Jun. 1-5, 2014. doi: 10.1109/IRPS.2014.6861106. [cited by applicant]
Liangzhen Lai et al, “SlackProbe: A Flexible and Efficient In Situ Timing Slack Monitoring Methodology”; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems; vol. 33, Issue 8, pp. 1168-1179, Au… [cited by applicant]
M. Saliva et al, “Digital Circuits Reliability with In-Situ Monitors in 28nm Fully Depleted SOI”; 2015 Design, Automation Mar. 9-13, 2015. doi: 10.7873/DATE.2015.0238. [cited by applicant]
Martin Wirnshofer et al, “A Variation-Aware Adaptive Voltage Scaling Technique based on In-Situ Delay Monitoring”; 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems; pp. 261-… [cited by applicant]
Martin Wirnshofer et al, “An Energy-Efficient Supply Voltage Scheme using In-Situ Pre-Error Detection for on-the-fly Voltage Adaptation to PVT Variations”; 2011 International Symposium on Integrated Circuits; pp. 94-97,… [cited by applicant]
Martin Wirnshofer et al, “On-line supply voltage scaling based on in situ delay monitoring to adapt for PVTA variations”; Journal of Circuits, Systems and Computers; vol. 21, No. 08, Mar. 7, 2012. DOI: 10.1142/S02181266… [cited by applicant]
S. Mhira et al, “Dynamic Adaptive Voltage Scaling in Automotive environment”; 2017 IEEE International Reliability Physics Symposium (IRPS); pp. 3A-4.1-3A-4.7, Apr. 2-6, 2017. doi: 10.1109/IRPS.2017.7936279. [cited by applicant]
A. Benhassain et al, “Early failure prediction by using in-situ monitors: Implementation and application results”; Online at: https://ceur-ws.org/Vol-1566/Paper6.pdf, Mar. 18, 2016. [cited by applicant]
M. Cho et al., “Postsilicon Voltage Guard-Band Reduction in a 22 nm Graphics Execution Core Using Adaptive Voltage Scaling and Dynamic Power Gating”; in IEEE Journal of Solid-State Circuits, vol. 52, No. 1, pp. 50-63, J… [cited by applicant]
B. Zandian et al, “Cross-layer resilience using wearout aware design flow”; 2011 IEEE/IFIP 41st International Conference on Dependable Systems & Networks (DSN), pp. 279-290, Jun. 27-30, 2011. doi: 10.1109/ DSN.2011.5958… [cited by applicant]
W. Shan et al, “Timing error prediction based adaptive voltage scaling for dynamic variation tolerance”; 2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), pp. 739-742, Nov. 17-20, 2014. doi: 10.1109/AP… [cited by applicant]
X. Shang et al, “A 0.44V-1.1V 9-transistor transition-detector and half-path error detection technique for low power applications”; 2017 IEEE Asian Solid-State Circuits Conference (A-SSCC), pp. 205-208, Nov. 6-8, 2017. … [cited by applicant]
Youhua Shi et al, “Suspicious timing error prediction with in-cycle clock gating”; International Symposium on Quality Electronic Design (ISQED), pp. 335-340, Mar. 4-6, 2013. doi: 10.1109/ISQED.2013.6523631. [cited by applicant]
Youhua Shi et al, “In-situ timing monitoring methods for variation-resilient designs”; 2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), pp. 735-738, Nov. 17-20, 2014. doi: 10.1109/APCCAS.2014.7032886. [cited by applicant]
C. R. Lefurgy et al., “Active Guardband Management in Power7+ to Save Energy and Maintain Reliability”; in IEEE Micro, vol. 33, No. 4, pp. 35-45, Jul.-Aug. 2013. doi: 10.1109/MM.2013.52. [cited by applicant]
J. Li et al, “Robust and in-situ self-testing technique for monitoring device aging effects in pipeline circuits”; 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), pp. 1-6, Jun. 1-5, 2014. [cited by applicant]
Liangzhen Lai et al, “Accurate and inexpensive performance monitoring for variability-aware systems”; 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 467-473, Jan. 20-23, 2014. doi: 10.1109/… [cited by applicant]
Martin Wirnshofer et al., “Adaptive voltage scaling by in-situ delay monitoring for an image processing circuit”; 2012 IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)… [cited by applicant]
Jongho Kim et al., “Adaptive delay monitoring for wide voltage-range operation”; 2016 Design, Automation & Test in Europe Conference & Exhibition (Date), pp. 511-516, Mar. 14-18, 2016. [cited by applicant]
Xiaobin Yuan et al., “Design Considerations for Reconfigurable Delay Circuit to Emulate System Critical Paths”; in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 23, No. 11, pp. 2714-2718, Nov. 2… [cited by applicant]
PCT International Search Report for International Application No. PCT/IB2021/051725, mailed Jul. 12, 2021, 3pp. [cited by applicant]
PCT Written Opinion for International Application No. PCT/IB2021/051725, mailed Jul. 12, 2021, 5pp. [cited by applicant]
PCT International Preliminary Report on Patentability for International Application No. PCT/IB2021/051725, issued Oct. 25, 2022, 6pp. [cited by applicant]