IP Library Assignment 014242/0813
Patent Assignment
Reel/Frame 014242/0813

Security Interest

Recorded: 2003-07-21 Pages: 17
Assignor
TEGAL CORPORATION
Executed: 2003-06-30
Assignee
HIRSCHMAN, ORIN
1231 EAST 10TH STREET, BROOKLYN, NEW YORK, 11230
Covered Properties (43)
Method for Process Control of a Plasma Reaction
Patent: 4,263,088 →
Application: 06/051,661 →
Plasma Reactor Apparatus and Method
Patent: 4,464,223 →
Application: 06/538,593 →
Vacuum Load Lock Apparatus
Patent: 4,632,624 →
Application: 06/588,027 →
Process Monitor and Method Thereof
Patent: 4,611,919 →
Application: 06/588,028 →
Modular Article Processing Machine and Method of Article Handling Therein
Patent: 4,801,241 →
Application: 06/588,029 →
Article Transport Apparatus
Patent: 4,619,573 →
Application: 06/588,030 →
Plasma Reactor Removable Insert
Patent: 4,585,920 →
Application: 06/658,468 →
Plasma Reactor Apparatus
Patent: 4,579,618 →
Application: 06/665,098 →
Variable Duty Cycle, Multiple Frequency, Plasma Reactor
Patent: 4,585,516 →
Application: 06/707,639 →
Pin Lift Plasma Processing
Patent: 4,624,728 →
Application: 06/743,341 →
Selective Plasma Etching During Formation of Integrated Circuitry
Patent: 4,687,543 →
Application: 06/832,047 →
Dual Wavelength Sensor Which Employs Object as Part of a Corner Reflector
Patent: 4,697,089 →
Application: 06/875,820 →
Optical Process for Determining the End Point of a Process via Analog Multiplication of Photocell Signals
Patent: 4,720,628 →
Application: 06/923,367 →
Electrostatic Wafer Clamp
Patent: 4,724,510 →
Application: 06/941,234 →
Wafer Cassetts Having Multi-Directional Accdss
Patent: 4,727,993 →
Application: 07/018,770 →
Magnetically Coupled Wafer Lift Pins
Patent: 4,790,258 →
Application: 07/034,121 →
Plasma Reactor with Removable Insert
Patent: 4,793,975 →
Application: 07/045,260 →
Non-Uniform Gas Inlet for Dry Etching Apparatus
Patent: 4,780,169 →
Application: 07/048,344 →
Xenon Enhanced Plasma Etch
Patent: 4,786,359 →
Application: 07/065,746 →
Spatula for Wafer Transport
Patent: 4,867,631 →
Application: 07/185,730 →
Ignitor for a Microwave Sustained Plasma
Patent: 4,888,088 →
Application: 07/319,020 →
Plasma Etch Isotropy Control
Patent: 4,889,588 →
Application: 07/345,795 →
Spatula for Wafer Transport
Patent: 4,984,954 →
Application: 07/563,742 →
Integrated Semiconductor Wafer Processing System
Patent: 5,672,239 →
Application: 08/438,261 →
Plasma Etch System
Patent: 5,985,089 →
Application: 08/450,369 →
Plasma Etch Reactor and Method for Emerging Films
Patent: 6,048,435 →
Application: 08/675,093 →
Plasma Etch Reactor and Method
Patent: 6,500,314 →
Application: 08/675,559 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent: 6,127,277 →
Application: 08/742,861 →
Plasma Etch System
Patent: 5,958,139 →
Application: 08/850,224 →
A Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Patent: 6,046,116 →
Application: 08/974,089 →
Plasma Etch Reactor Having a Plurality of Magnets (as Amended)
Patent: 6,354,240 →
Application: 09/152,238 →
Plasma Reactor with a Deposition Shield
Patent: 6,006,694 →
Application: 09/204,020 →
Plasma Reactor with a Deposition Shield
Patent: 6,360,686 →
Application: 09/382,050 →
Plasma Etch Reactor and Method for Emerging Films
Patent: 6,190,496 →
Application: 09/384,614 →
Plasma Etch Reactor and Method for Emerging Films
Patent: 6,410,448 →
Application: 09/384,858 →
Plasma Etch System
Patent: 6,120,610 →
Application: 09/412,873 →
Plasma Reactor with a Deposition Shield
Patent: 6,173,674 →
Application: 09/434,092 →
Plasma Reactor with a Deposition Shield
Patent: 6,170,431 →
Application: 09/434,990 →
Plasma Etch Reactor and Method
Patent: 6,620,335 →
Application: 09/455,641 →
Method for minimizing the critical dimension growth of a feature on a semiconductor wafer
Application: 09/505,420 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent: 6,492,280 →
Application: 09/517,387 →
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Patent: 6,774,046 →
Application: 09/880,584 →
Publication: US 2001/0031561
Plasma Etch Reactor and Method
Patent: 6,905,969 →
Application: 10/156,478 →
Publication: US 2002/0139665
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Oct 3, 1983
From: GORIN, GEORGES J.
To: TEGAL CORPORATION, A CA CORP.
Reel/Frame 004182/0885 →
Assignment of Assignors Interest. Mar 9, 1984
From: BROOKS, EDWARD A. JR.; BITHELL, ROGER M.
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004310/0502 →
Assignment of Assignors Interest. Mar 9, 1984
From: MIRKOVICH, NINKO T.; ZAJAC, JOHN
To: TEGAL CORPORATION, NOVATO, CA A CORP OF CA
Reel/Frame 004238/0625 →
Assignment of Assignors Interest. May 18, 1984
From: RATHMANN, THOMAS M.; DRAKE, HERBERT G.; MIRKOVICH, NINKO T.; LACHENBRUCH, ROGER B.
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004293/0403 →
Assignment of Assignors Interest. May 18, 1984
From: ZAJAC, JOHN; MIRKOVICH, NINKO T.; RATHMANN, THOMAS M.; LACHENBRUCH, ROGER B.
To: TEGAL CORPORATION A CORP. OF CA
Reel/Frame 004306/0645 →
Assignment of Assignors Interest. Mar 4, 1985
From: CORN, GLENN R.; HEGEDUS, ANDREAS G.
To: TEGAL CORPORATION
Reel/Frame 004381/0899 →
Assignment of Assignors Interest. Jun 11, 1985
From: BITHELL, ROGER M.; SLOMOWITZ, HARRY
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004414/0420 →
Assignment of Assignors Interest. Apr 21, 1986
From: BOWKER, CHRISTOPHER D.
To: ZYMOS CORORATION
Reel/Frame 004556/0042 →
Assignment of Assignors Interest. Jun 18, 1986
From: DRAGE, DAVID J.
To: TEGAL CORPORATION
Reel/Frame 004567/0036 →
Assignment of Assignors Interest. Apr 25, 1988
From: WARENBACK, DOUGLAS H.; HOOG, JOSEF T.
To: TEGAL CORPORATION
Reel/Frame 004870/0580 →
Assignment of Assignors Interest. Jun 20, 1988
From: DRAGE, DAVID J.
To: TEGAL CORPORATION
Reel/Frame 004905/0388 →
Assignment of Assignors Interest. Mar 6, 1989
From: SLOMOWITZ, HARRY
To: TEGAL CORPORATION
Reel/Frame 005052/0394 →
Assignment of Assignors Interest. May 1, 1989
From: FIOR, GIANNI O.
To: TEGAL CORPORATION, A CORP. OF CA.
Reel/Frame 005078/0420 →
Assignment of Assignors Interest. Mar 23, 1990
From: STARK, MARK M.; NAKAJIMA, SHU
To: TEGAL CORPORATION, A CORP. OF CA
Reel/Frame 005268/0733 →
Assignment of Assignors Interest. Aug 9, 1990
From: TEGAL CORPORATION, A CORP. OF DE
To: MOTOROLA, INC., A DE CORP.
Reel/Frame 005439/0781 →
Assignment of Assignor's Interest May 10, 1995
From: DEORNELLAS, STEPHEN P.
To: TEGAL CORPORATION, A CORPORATION OF DELAWARE
Reel/Frame 007538/0356 →
Assignment of Assignor's Interest May 25, 1995
From: LEIBOVICH, VLADIMIR E.; ZUCKER, MARTIN L.
To: TEGAL CORPORATION, A CORP. OF DE.
Reel/Frame 007499/0610 →
Security Agreement Jun 14, 1999
From: TEGAL CORPORATION
To: IMPERIAL BANK
Reel/Frame 010018/0169 →
Security Agreement May 10, 2000
From: TEGAL CORPORATION; TEGAL JAPAN, INC.
To: COAST BUSINESS CREDIT, A DIVISION OF SOUTHERN PACIFIC BANK
Reel/Frame 010785/0795 →
Security Agreement Nov 26, 2002
From: TEGAL CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 013506/0749 →
Security Interest Jul 21, 2003
From: SPUTTERED FILMS, INC.
To: HIRSCHMAN, ORIN
Reel/Frame 014357/0382 →
Assignment of Assignor's Interest Jun 17, 2010
From: OEG-TEG, LLC
To: OEM GROUP INC.
Reel/Frame 024547/0404 →
Assignment of Assignor's Interest Jun 17, 2010
From: TEGAL CORPORATION
To: OEG-TEG, LLC
Reel/Frame 024547/0285 →
Security Agreement Oct 8, 2010
From: OEM GROUP, INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION
Reel/Frame 025105/0799 →
Security Agreement Oct 15, 2010
From: OEM GROUP, INC.
To: THL CORPORATE FINANCE, INC.
Reel/Frame 025137/0859 →