Patent Assignment
Reel/Frame 013506/0749
Security Agreement
Recorded: 2002-11-26
Pages: 12
Assignor
TEGAL CORPORATION
Executed: 2002-06-26
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(52)
Plasma Reactor Apparatus and Method
Patent:
4,464,223 →
Application:
06/538,593 →
Vacuum Load Lock Apparatus
Patent:
4,632,624 →
Application:
06/588,027 →
Process Monitor and Method Thereof
Patent:
4,611,919 →
Application:
06/588,028 →
Modular Article Processing Machine and Method of Article Handling Therein
Patent:
4,801,241 →
Application:
06/588,029 →
Article Transport Apparatus
Patent:
4,619,573 →
Application:
06/588,030 →
Plasma Reactor Removable Insert
Patent:
4,585,920 →
Application:
06/658,468 →
Plasma Reactor Apparatus
Patent:
4,579,618 →
Application:
06/665,098 →
Variable Duty Cycle, Multiple Frequency, Plasma Reactor
Patent:
4,585,516 →
Application:
06/707,639 →
Pin Lift Plasma Processing
Patent:
4,624,728 →
Application:
06/743,341 →
Selective Plasma Etching During Formation of Integrated Circuitry
Patent:
4,687,543 →
Application:
06/832,047 →
Dual Wavelength Sensor Which Employs Object as Part of a Corner Reflector
Patent:
4,697,089 →
Application:
06/875,820 →
Optical Process for Determining the End Point of a Process via Analog Multiplication of Photocell Signals
Patent:
4,720,628 →
Application:
06/923,367 →
Electrostatic Wafer Clamp
Patent:
4,724,510 →
Application:
06/941,234 →
Wafer Cassetts Having Multi-Directional Accdss
Patent:
4,727,993 →
Application:
07/018,770 →
Magnetically Coupled Wafer Lift Pins
Patent:
4,790,258 →
Application:
07/034,121 →
Plasma Reactor with Removable Insert
Patent:
4,793,975 →
Application:
07/045,260 →
Non-Uniform Gas Inlet for Dry Etching Apparatus
Patent:
4,780,169 →
Application:
07/048,344 →
Xenon Enhanced Plasma Etch
Patent:
4,786,359 →
Application:
07/065,746 →
Spatula for Wafer Transport
Patent:
4,867,631 →
Application:
07/185,730 →
Ignitor for a Microwave Sustained Plasma
Patent:
4,888,088 →
Application:
07/319,020 →
Plasma Etch Isotropy Control
Patent:
4,889,588 →
Application:
07/345,795 →
Spatula for Wafer Transport
Patent:
4,984,954 →
Application:
07/563,742 →
Integrated Semiconductor Wafer Processing System
Patent:
5,672,239 →
Application:
08/438,261 →
Plasma Etch System
Patent:
5,985,089 →
Application:
08/450,369 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,048,435 →
Application:
08/675,093 →
Plasma Etch Reactor and Method
Patent:
6,500,314 →
Application:
08/675,559 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,127,277 →
Application:
08/742,861 →
Plasma Etch System
Patent:
5,958,139 →
Application:
08/850,224 →
A Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Patent:
6,046,116 →
Application:
08/974,089 →
Method for Using a Hard Mask for Critical Dimension Growth Containment
Patent:
6,287,975 →
Application:
09/009,369 →
Method and Apparatus for Increasing Wafer Throughput Between Cleanings in Semiconductor Processing Reactors
Application:
09/086,105 →
Publication:
US 2001/0001413
Method and Apparatus for Minimizing Semiconductor Wafer Arcing During Semiconductor Wafer Processing
Patent:
6,346,428 →
Application:
09/135,210 →
Plasma Etch Reactor Having a Plurality of Magnets (as Amended)
Patent:
6,354,240 →
Application:
09/152,238 →
Plasma Reactor with a Deposition Shield
Patent:
6,006,694 →
Application:
09/204,020 →
Plasma Reactor with a Deposition Shield
Patent:
6,360,686 →
Application:
09/382,050 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,190,496 →
Application:
09/384,614 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,410,448 →
Application:
09/384,858 →
Plasma Etch System
Patent:
6,120,610 →
Application:
09/412,873 →
Plasma Reactor with a Deposition Shield
Patent:
6,173,674 →
Application:
09/434,092 →
Plasma Reactor with a Deposition Shield
Patent:
6,170,431 →
Application:
09/434,990 →
Reactor with Heated and Textured Electrodes and Surfaces
Application:
09/453,842 →
Cobalt Silicide Etch Process and Apparatus
Patent:
6,486,069 →
Application:
09/454,814 →
Plasma Etch Reactor and Method
Patent:
6,620,335 →
Application:
09/455,641 →
Method for minimizing the critical dimension growth of a feature on a semiconductor wafer
Application:
09/505,420 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,492,280 →
Application:
09/517,387 →
Method for Using a Hard Mask for Critical Dimension Growth Containment
Patent:
6,958,295 →
Application:
09/692,007 →
Method and Apparatus for Minimizing Semiconductor Wafer Arcing During Semiconductor Wafer Processing
Patent:
6,406,925 →
Application:
09/712,707 →
Cobalt Silicide Etch Process and Apparatus
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Deposition Shield for a Plasma Reactor
Reactor with Heated and Textured Electrodes and Surfaces
Method for Using a Hard Mask for Critical Dimension Growth Containment
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Oct 3, 1983
From: GORIN, GEORGES J.
To: TEGAL CORPORATION, A CA CORP.
Reel/Frame 004182/0885 →
Assignment of Assignors Interest.
Mar 9, 1984
From: BROOKS, EDWARD A. JR.; BITHELL, ROGER M.
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004310/0502 →
Assignment of Assignors Interest.
Mar 9, 1984
From: MIRKOVICH, NINKO T.; ZAJAC, JOHN
To: TEGAL CORPORATION, NOVATO, CA A CORP OF CA
Reel/Frame 004238/0625 →
Assignment of Assignors Interest.
May 18, 1984
From: RATHMANN, THOMAS M.; DRAKE, HERBERT G.; MIRKOVICH, NINKO T.; LACHENBRUCH, ROGER B.
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004293/0403 →
Assignment of Assignors Interest.
May 18, 1984
From: ZAJAC, JOHN; MIRKOVICH, NINKO T.; RATHMANN, THOMAS M.; LACHENBRUCH, ROGER B.
To: TEGAL CORPORATION A CORP. OF CA
Reel/Frame 004306/0645 →
Assignment of Assignors Interest.
Mar 4, 1985
From: CORN, GLENN R.; HEGEDUS, ANDREAS G.
To: TEGAL CORPORATION
Reel/Frame 004381/0899 →
Assignment of Assignors Interest.
Jun 11, 1985
From: BITHELL, ROGER M.; SLOMOWITZ, HARRY
To: TEGAL CORPORATION A CORP OF CA
Reel/Frame 004414/0420 →
Assignment of Assignors Interest.
Apr 21, 1986
From: BOWKER, CHRISTOPHER D.
To: ZYMOS CORORATION
Reel/Frame 004556/0042 →
Assignment of Assignors Interest.
Jun 18, 1986
From: DRAGE, DAVID J.
To: TEGAL CORPORATION
Reel/Frame 004567/0036 →
Assignment of Assignors Interest.
Apr 25, 1988
From: WARENBACK, DOUGLAS H.; HOOG, JOSEF T.
To: TEGAL CORPORATION
Reel/Frame 004870/0580 →
Assignment of Assignors Interest.
Jun 20, 1988
From: DRAGE, DAVID J.
To: TEGAL CORPORATION
Reel/Frame 004905/0388 →
Assignment of Assignors Interest.
Mar 6, 1989
From: SLOMOWITZ, HARRY
To: TEGAL CORPORATION
Reel/Frame 005052/0394 →
Assignment of Assignors Interest.
May 1, 1989
From: FIOR, GIANNI O.
To: TEGAL CORPORATION, A CORP. OF CA.
Reel/Frame 005078/0420 →
Assignment of Assignors Interest.
Mar 23, 1990
From: STARK, MARK M.; NAKAJIMA, SHU
To: TEGAL CORPORATION, A CORP. OF CA
Reel/Frame 005268/0733 →
Assignment of Assignors Interest.
Aug 9, 1990
From: TEGAL CORPORATION, A CORP. OF DE
To: MOTOROLA, INC., A DE CORP.
Reel/Frame 005439/0781 →
Assignment of Assignor's Interest
May 10, 1995
From: DEORNELLAS, STEPHEN P.
To: TEGAL CORPORATION, A CORPORATION OF DELAWARE
Reel/Frame 007538/0356 →
Assignment of Assignor's Interest
May 25, 1995
From: LEIBOVICH, VLADIMIR E.; ZUCKER, MARTIN L.
To: TEGAL CORPORATION, A CORP. OF DE.
Reel/Frame 007499/0610 →
Assignment of Assignor's Interest
Oct 16, 1996
From: DEORNELLAS, STEPHEN P.; COFER, ALFERD; VAIL, ROBERT C.
To: TEGAL CORPORATION
Reel/Frame 008227/0577 →
Security Agreement
Jun 14, 1999
From: TEGAL CORPORATION
To: IMPERIAL BANK
Reel/Frame 010018/0169 →
Security Agreement
May 10, 2000
From: TEGAL CORPORATION; TEGAL JAPAN, INC.
To: COAST BUSINESS CREDIT, A DIVISION OF SOUTHERN PACIFIC BANK
Reel/Frame 010785/0795 →
Security Interest
Jul 21, 2003
From: TEGAL CORPORATION
To: HIRSCHMAN, ORIN
Reel/Frame 014242/0813 →
Security Interest
Jul 21, 2003
From: SPUTTERED FILMS, INC.
To: HIRSCHMAN, ORIN
Reel/Frame 014357/0382 →
Assignment of Assignor's Interest
Jun 17, 2010
From: TEGAL CORPORATION
To: OEG-TEG, LLC
Reel/Frame 024547/0285 →
Assignment of Assignor's Interest
Jun 17, 2010
From: OEG-TEG, LLC
To: OEM GROUP INC.
Reel/Frame 024547/0404 →
Security Agreement
Oct 8, 2010
From: OEM GROUP, INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION
Reel/Frame 025105/0799 →