Patent Assignment
Reel/Frame 075862/0628
Security Interest
Recorded: 2026-06-30
Pages: 20
Assignor
MICROMAX (US) HOLDINGS LLC
Executed: 2026-06-30
Assignee
CITIBANK, N.A. AS COLLATERAL AGENT
388 GREENWICH STREET, 7TH FLOOR, NEW YORK, NEW YORK, 10013
Covered Properties
(85)
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Flexible White Reflective Dielectric for Electronic Circuits
Polymer Thick Film Positive Temperature Coefficient Carbon Composition
Heat-Curable Polymer Paste
Method of Manufacturing Non-Firing Type Electrode
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Mixed-Metal System Conductors for Use in Low-Temperature Co-Fired Ceramic Circuits and Devices
Flexible White Reflective Dielectric for Electronic Circuits
Ink Jettable Silver/Silver Chloride Compositions
Stretchable Polymer Thick Film Silver Conductor for Highly Permeable Substrates
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Conductive Metal Composition
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Photonic Sintering of Polymer Thick Film Copper Conductor Compositions
Low Temperature Co-Fired Ceramic (Ltcc) System in a Package (Sip) Configurations for Microwave/Millimeter Wave Packaging Applications
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Non-Firing Type Electrode
Photonic Sintering of Polymer Thick Film Conductor Compositions
Uv-Curable Thermoformable Dielectric for Thermoformable Circuits
Lamination of Polymer Thick Film Conductor Compositions
Method of Making Non-Hollow, Non-Fragmented Spherical Metal or Metal Alloy Particles
Method of Manufacturing a Resistor Paste
Low Temperature Fireable Thick Film Silver Paste
Electrically Conductive Paste Composition
Method for Forming Front Electrode of Pdp
Low Temperature Co-Fired Ceramic Structure for High Frequency Applications and Process for Making Same
Electrode and Method for Manufacturing the Same
Device chip carriers, modules, and methods of forming thereof
Electrode and Method for Manufacturing the Same
Mixed-Metal System Conductors for Ltcc (Low-Temperature Co-Fired Ceramic)
Lamination of Polymer Thick Film Conductor Compositions
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Method of Manufacturing Copper Electrode
Method of Manufacturing High Frequency Receiving and/or Transmitting Devices from Low Temperature Co Fired Ceramic Materials and Devices Made Therefrom
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Nickel-Gold Plateable Thick Film Silver Paste
Polymer Thick Film Solder Alloy/Metal Conductor Compositions
Uv-Curable Polymer Thick Film Dielectric Compositions with Excellent Adhesion to Ito
Preparation of Silver Spheres by the Reduction of Silver Polyamine Complexes
Lead-Free Resistive Composition
Method for Producing Dispersed, Crystalline, Stable to Oxidation Copper Particles
Resistor Compositions Using a Cu-Containing Glass Frit
Electrode and Method for Manufacturing the Same
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Elecrically Conductive Adhesive
Silver-Palladium Alloy Containing Conductor Paste for Ceramic Substrate and Electric Circuit
Co-Processable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices
Non-Lead Resistor Composition
Conductor Paste for Ceramic Substrate and Electric Circuit
Photosensitive Paste and Process for Production of Pattern Using the Same
High Conductivity Polymer Thick Film Silver Conductor Composition for Use in Rfid and Other Applications
Thick Film Conductor Paste Composition for Ltcc Tape in Microwave Applications
Thick Film Paste via Fill Composition for Use in Ltcc Applications
Conductor Paste for Ceramic Substrate and Electric Circuit
Conductive Paste for Solid Electorlytic Capacitor Electrode and Process for Producing Solid Electolytic Capacitor Electrode Using the Same
Lead Free Glass(Es), Thick Film Paste(S), Tape Composition(S) and Low Temperature Cofired Ceramic Devices Made Therefrom
Thick Film Conductor Composition(S) and Processing Technology Thereof for Use in Multilayer Electronic Circuits and Devices
Conductive Composition for Black Bus Electrode, and Front Panel of Plasma Display Panel
Process for Making Highly Dispersible Spherical Silver Powder Particles and Silver Particles Formed Therefrom
Non-Lead Resistor Composition
Conductive Paste And Sintering Methods
Application:
19/039,816 →
Publication:
US US20250266386A1
Semiconductor Device and Methods of Manufacturing a Semiconductor Device
Application:
18/957,958 →
Publication:
US US20250210447A1
Sintering Methods
Application:
18/957,956 →
Publication:
US US20250203784A1
Conductive Paste
Application:
18/815,900 →
Publication:
US US20250074813A1
Stretchable Conductive Fluoroelastomer Paste Composition
Stretchable Polymer Thick Film Carbon Black Composition for Wearable Heaters
Fine Silver Particle Dispersion
Method of Manufacturing an Electronic Device
Dielectric Filter and Method for Manufacturing the Same
Polymer Thick Film Dielectric Paste Composition
Flexible Electrically Conductive Pastes and Devices Made Therewith
Polyimide-Based Polymer Thick Film Resistor Composition
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Chip Resistor
Articles and Substrates Providing Improved Performance of Printable Electronics
Conductive Paste For Bonding
Conductive Paste for Bonding
Electronic Component
Copper-Containing Conductive Pastes and Electrodes Made Therefrom
Polyimide-Based Polymer Thick Film Resistor Composition
Polyimide-Based Polymer Thick Film Compositions
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Polymer Thick Film Positive Temperature Coefficient Carbon Resistor Composition
Application:
19/189,336 →
Publication:
US US20250368836A1
Acid Resistant Conductive Paste Composition
Application:
19/465,992 →
Publication:
US US20260250523A1
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 18, 2013
From: NAIR, DEEPUKUMAR M.; SMITH, MICHAEL ARNETT; THRASHER, BRADLEY; PARISI, JAMES M.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029823/0704 →
Assignment of Assignor's Interest
Mar 19, 2013
From: LABRANCHE, MARC H.
To: E.I. DUPONT DE NEMOURS AND COMPANY
Reel/Frame 030040/0526 →
Assignment of Assignor's Interest
Apr 4, 2013
From: INABA, AKIRA; LEE, JI-YEON
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 030150/0908 →
Assignment of Assignor's Interest
May 29, 2013
From: DORFMAN, JAY ROBERT; ARANCIO, VINCENZO
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 030504/0811 →
Assignment of Assignor's Interest
Jul 20, 2013
From: SUMMERS, JOHN D.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 030843/0871 →
Assignment of Assignor's Interest
Dec 18, 2013
From: CRITZER, MARK STEVEN; DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 031804/0349 →
Assignment of Assignor's Interest
Mar 7, 2014
From: HUI, DAVE; SUMMERS, JOHN D
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 032373/0897 →
Assignment of Assignor's Interest
Mar 7, 2014
From: DORFMAN, JAY ROBERT; ARANCIO, VINCENZO
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 032374/0120 →
Assignment of Assignor's Interest
Apr 23, 2014
From: INABA, AKIRA; YAMASHITA, SATOMI
To: E. I. DUPONT DE NEMOURS AND COMPANY
Reel/Frame 032736/0157 →
Assignment of Assignor's Interest
Jul 29, 2014
From: DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 033406/0612 →
Assignment of Assignor's Interest
Sep 16, 2014
From: KONNO, TAKUYA; NAKAJIMA, NAOTO
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 033750/0413 →
Assignment of Assignor's Interest
Mar 24, 2017
From: SUH, SEIGI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 042087/0372 →
Assignment of Assignor's Interest
Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062157/0390 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062201/0889 →
Change of Name
Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
Assignment of Assignor's Interest
Jan 24, 2026
From: CELANESE MERCURY HOLDINGS INC.
To: CELANESE POLYMERS HOLDING, INC.
Reel/Frame 074491/0515 →
Assignment of Assignor's Interest
Jan 25, 2026
From: CELANESE POLYMERS HOLDING, INC.
To: CELANESE SPECIALTY PRODUCTS, INC.
Reel/Frame 074491/0555 →
Assignment of Assignor's Interest
Jan 26, 2026
From: CELANESE SPECIALTY PRODUCTS, INC.
To: MICROMAX (US) HOLDINGS LLC
Reel/Frame 074501/0151 →