IP Library › Assignment 010078/0150
Patent Assignment
Reel/Frame 010078/0150

Merger

Recorded: 1999-07-16 Pages: 23
Assignor
SPEEDFAM CORPORATION
Executed: 1999-05-26
Assignee
SPEEDFAM-IPEC CORPORATION
305 N. 54TH STREET, CHANDLER, ARIZONA, 85226
Covered Properties (97)
Polishing Apparatus
Patent: 4,141,180 →
Application: 05/835,295 →
Polishing Apparatus
Patent: 4,193,226 →
Application: 05/938,036 →
Rectilinear Work Finishing Apparatus
Patent: 4,240,231 →
Application: 05/939,361 →
Bearing Mount for Lapping Machine Pressure Plate
Patent: 4,270,314 →
Application: 06/076,306 →
Inner Gear Drive for Abrading Machines
Patent: 4,315,383 →
Application: 06/149,347 →
Polishing Fixture
Patent: 4,319,432 →
Application: 06/149,348 →
Control Valve Assembly for Abrasive Slurry
Patent: 4,593,716 →
Application: 06/182,125 →
Removable Polishing Pad Assembly
Patent: 4,527,358 →
Application: 06/527,255 →
Liquid Waxless Fixturing of Microsize Wafers
Patent: 4,519,168 →
Application: 06/557,904 →
Measuring Bar for Free Abrasive Machines
Patent: 4,693,012 →
Application: 06/755,685 →
Flat Lapping Machine
Patent: 4,805,348 →
Application: 06/891,241 →
Dressing Fixture
Patent: 4,720,938 →
Application: 06/891,376 →
Mask and Pressure Block for Ultra Thin Work Pieces
Patent: 4,780,991 →
Application: 06/899,151 →
Multilevel Grinding Apparatus
Patent: 5,134,807 →
Application: 06/923,669 →
Multilevel Grinding Apparatus and Method
Patent: 4,821,459 →
Application: 07/167,295 →
Automatic Workpiece Thickness Control for Dual Lapping Machines
Patent: 4,860,498 →
Application: 07/231,969 →
Lapping and Polishing Machine
Patent: 4,974,370 →
Application: 07/280,932 →
Circumferential Pattern Finishing Machine
Patent: 5,187,901 →
Application: 07/473,894 →
Uniform Velocity Double Sided Finishing Machine
Patent: 5,274,960 →
Application: 07/601,384 →
Lapping Plate for a Lapping and Polishing Machine
Patent: 5,036,625 →
Application: 07/606,807 →
Circumferential Pattern Finishing Method
Patent: 5,123,218 →
Application: 07/734,511 →
Automated Free Abrasive Machine for One Side Piece Part Machining
Patent: 5,224,304 →
Application: 07/788,862 →
Wafer Polishing Method and Apparatus
Patent: 5,329,732 →
Application: 07/898,876 →
Low Abrasion Friction Material Comprising a Fibrous Matrix Impregnated with a Polyurethane Resin Wherein Fiber Ends Are Exposed on at Least One Surface of the Material
Patent: 5,436,045 →
Application: 08/147,909 →
Device for Conditioning Polishing Pads
Patent: 5,486,131 →
Application: 08/177,156 →
Dual Column Abrading Machine
Patent: 5,595,529 →
Application: 08/218,611 →
Wafer Polishing Method and Apparatus
Patent: 5,498,196 →
Application: 08/245,458 →
Wafer Polishing Method and Apparatus
Patent: 5,498,199 →
Application: 08/276,158 →
In-Situ Polishing Pad Flatness Control
Patent: 5,868,605 →
Application: 08/460,501 →
Polishing Pad Conditioning
Patent: 5,569,062 →
Application: 08/497,530 →
Backing Pad
Patent: 5,791,975 →
Application: 08/513,080 →
Polishing Control Method
Patent: 5,685,766 →
Application: 08/564,967 →
Polishing Apparatus with Improved Product Unloading
Patent: 5,762,543 →
Application: 08/564,968 →
Polishing Device with Improved Handling of Fluid Polishing Media
Patent: 5,695,392 →
Application: 08/635,020 →
Dual Column Abrading Machine
Patent: 5,782,678 →
Application: 08/638,678 →
Abrasive Foam Grinding Composition
Patent: 5,713,968 →
Application: 08/655,297 →
Methods and Apparatus for the Chemical Mechanical Planarization of Electronic Devices
Patent: 5,769,691 →
Application: 08/662,678 →
Adjustable Wafer Cassette Stand
Patent: 5,779,203 →
Application: 08/671,155 →
Method and Apparatus for Cleaning and Drying Wafers
Patent: 5,950,327 →
Application: 08/676,546 →
Apparatus for the in-Process Detection of Workpieces in a Cmp Environment
Patent: 5,733,171 →
Application: 08/683,150 →
Apparatus for Conditioning Polishing Pads Utilizing Brazed Diamond Technology
Patent: 5,842,912 →
Application: 08/683,571 →
Methods and Apparatus for Measuring and Dispensing Processing Solutions to a Cmp Machine
Patent: 5,857,893 →
Application: 08/720,744 →
Bearing Assembly for Wafer Planarization Carrier
Patent: 5,791,978 →
Application: 08/751,014 →
Apparatus for the in-Process Detection of Workpieces with a Monochromatic Light Source
Patent: 5,823,853 →
Application: 08/781,132 →
Wafer Polishing Method and Apparatus
Patent: 37,622 →
Application: 08/792,936 →
Methods and Apparatus for Detecting Removal of Thin Film Layers During Planarization
Patent: 5,872,633 →
Application: 08/798,803 →
Apparatus for Cleaning Wafers and Discs
Patent: 5,870,792 →
Application: 08/829,056 →
Apparatus for Rinsing Wafers in the Context of a Combined Rinsing, and Drying System
Patent: 5,899,216 →
Application: 08/855,208 →
Chemical Mechanical Planarization Tool Having a Linear Polishing Roller
Patent: 5,967,881 →
Application: 08/865,606 →
Methods and Apparatus for Conditioning Grinding Stones
Patent: 5,938,506 →
Application: 08/868,110 →
Apparatus for Handling Polishing Carriers
Patent: 5,938,513 →
Application: 08/868,491 →
Method and Apparatus for Distributing a Polishing Agent Onto a Polishing Element
Patent: 5,921,849 →
Application: 08/868,878 →
Tilt Mechanism for Wafer Cassette
Patent: 6,033,521 →
Application: 08/869,112 →
Grinding Composition Using Abrasive Particles on Bubbles
Patent: 5,885,312 →
Application: 08/877,154 →
Methods and Apparatus for Chemical Mechanical Planarization Using a Microreplicated Surface
Patent: 6,224,465 →
Application: 08/883,404 →
Methods and Apparatus for the in-Process Detection of Workpieces with a Physical Contact Probe
Patent: 5,834,645 →
Application: 08/889,999 →
Method for Cleaning Workpiece Surfaces and Monitoring Probes During Workpiece Processing
Patent: 5,958,148 →
Application: 08/895,284 →
Apparatus for Holding Workpieces During Lapping, Honing, and Polishing
Patent: 6,030,280 →
Application: 08/899,180 →
Wafer Carrier for Semiconductor Wafer Polishing Machine
Patent: 5,916,015 →
Application: 08/900,479 →
Index Table and Drive Mechanism for a Chemical Mechanical Planarization Machine
Patent: 5,975,986 →
Application: 08/908,902 →
Combined Cmp and Wafer Cleaning Apparatus and Associated Methods
Patent: 6,213,853 →
Application: 08/926,700 →
Apparatus for Spin Drying a Workpiece
Patent: 5,974,681 →
Application: 08/927,661 →
Method and Apparatus for Monitoring and Controlling the Flatness of a Polishing Pad
Patent: 5,951,370 →
Application: 08/944,937 →
Dual Column Abrading Machine
Patent: 5,803,798 →
Application: 08/962,979 →
Method and Apparatus for Improved Gear Cleaning Assembly in Polishing Machine
Patent: 6,102,784 →
Application: 08/964,975 →
Workpiece Cleaning Element with Improved Rib Configuration
Patent: 6,006,391 →
Application: 08/967,162 →
Method and Apparatus for Modeling a Chemical Mechanical Polishing Process
Application: 08/972,551 →
Method and Apparatus for Processing Workpieces with Multiple Polishing Elements
Patent: 5,975,991 →
Application: 08/978,809 →
Method and Apparatus for Enhanced Cleaning of a Workpiece with Mechanical Energy
Patent: 5,975,094 →
Application: 08/979,098 →
Segmented Polishing Pad
Application: 08/984,239 →
Method and Apparatus for Conditioning Polishing Pads Utilizing Brazed Diamond Technology and Titanium Nitride
Patent: 6,371,838 →
Application: 08/984,243 →
Methods and Apparatus for Polishing Using an Improved Plate Stabilizer
Patent: 5,980,366 →
Application: 08/986,898 →
Workpiece Carrier with Monopiece Pressure Plate and Low Gimbal Point
Patent: 5,989,104 →
Application: 09/005,889 →
Methods and Apparatus for the Chemical Mechanical Planarization of Electronic Devices
Patent: 7,083,501 →
Application: 09/008,148 →
Apparatus for Polishing Using Improved Plate Supports
Patent: 6,168,506 →
Application: 09/010,008 →
Post-Cmp Wet-Hf Cleaning Station
Patent: 5,954,888 →
Application: 09/020,979 →
Methods and Apparatus for the in-Process Measurement of Thin Film Layers
Application: 09/024,723 →
Publication: US 2001/0012108
Methods for the in-Process Detection of Workpieces in a Cmp Environment
Patent: 5,993,289 →
Application: 09/035,319 →
Backing Pad for Workpiece Carrier
Application: 09/046,325 →
Post-Cmp Wet-Hf Cleaning Station
Patent: 6,125,861 →
Application: 09/058,647 →
Methods and Apparatus for the in-Process Detection of Workpieces with a Monochromatic Light Source
Patent: 5,961,369 →
Application: 09/090,666 →
Distributed Control System for a Semiconductor Wafer Processing Machine
Patent: 6,292,708 →
Application: 09/096,066 →
Method and Apparatus for Improving Die Planarity and Global Uniformity of Semiconductor Wafers in a Chemical Mechanical Polishing Context
Patent: 6,113,465 →
Application: 09/097,914 →
Catastrophic Error Recovery Apparatus and Associated Methods
Application: 09/175,152 →
Automatic Wafer Mapping in a Wet Environment on a Wafer Cleaner
Patent: 6,356,091 →
Application: 09/196,261 →
Methods and Apparatus for an Equipment Virtual Controller
Application: 09/213,054 →
Pad Conditioning for Copper-Based Semiconductor Wafers
Patent: 6,387,188 →
Application: 09/261,868 →
Dual Purpose Handoff Station for Workpiece Polishing Machine
Patent: 6,227,950 →
Application: 09/264,066 →
Non-Abrasive Conditioning for Polishing Pads
Patent: 6,283,836 →
Application: 09/264,067 →
Method for Manufacturing a Workpiece Carrier Backing Pad and Pressure Plate for Polishing Semiconductor Wafers
Patent: 6,095,900 →
Application: 09/276,983 →
Method for Obtaining a Desired Film Thickness Using Chemical Mechanical Polishing
Patent: 6,213,844 →
Application: 09/277,261 →
Two-Step Chemical-Mechanical Planarization for Damascene Structures on Semiconductor Wafers
Patent: 6,555,466 →
Application: 09/280,767 →
Method and Apparatus for Pad Removal and Replacement
Patent: 6,244,941 →
Application: 09/281,202 →
Wafer Planarization Carrier Having Floating Pad Load Ring
Patent: 6,113,468 →
Application: 09/286,702 →
Method and Apparatus for Conditioning Polishing Pads Utilizing Brazed Diamond Technology and Titanium Nitride
Patent: 6,347,981 →
Application: 09/303,463 →
Method for Making a Polishing Apparatus Utilizing Brazed Diamond Technology and Titanium Nitride
Patent: 6,347,982 →
Application: 09/303,483 →
Wafer Cleaning Apparatus and Associated Methods
Application: 60/118,361 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Sep 18, 1980
From: CESNA JOSEPH V.
To: SPEEDFAM CORPORATION
Reel/Frame 003802/0659 →
Assignment of Assignors Interest. Jun 19, 1981
From: KAYEX CORPORATION
To: GENERAL SIGNAL CORPORATION, A CORP. OF N.Y.
Reel/Frame 003863/0240 →
Assignment of Assignors Interest. Jan 9, 1984
From: DAY, LAWRENCE
To: GENERAL SIGNAL CORPORATION
Reel/Frame 004206/0664 →
Assignment of Assignors Interest. Aug 16, 1985
From: CESNA, JOSEPH V.
To: SPEEDFAM CORPORATION, A CORP. OF IL.
Reel/Frame 004441/0253 →
Assignment of Assignors Interest. Aug 15, 1988
From: GOSIS, ANATOLY
To: GENERAL SIGNAL CORPORATION, A NY CORP.
Reel/Frame 004998/0186 →
Assignment of Assignors Interest. Dec 7, 1988
From: GOSIS, ANATOLY
To: GENERAL SIGNAL CORPORATION, A CORP. OF NEW YORK
Reel/Frame 004980/0195 →
Assignment of Assignors Interest. Mar 5, 1990
From: KARLSRUD, CHRIS E.
To: FAMTEC INTERNATIONAL INC.
Reel/Frame 005243/0169 →
Assignment of Assignors Interest. Apr 9, 1990
From: DAY, LAWRENCE
To: GENERAL SIGNAL CORPORATION
Reel/Frame 005267/0841 →
Assignment of Assignors Interest. Feb 22, 1991
From: KARLSRUD, CHRIS E.
To: SPEEDFAM CORPORATION, A CORP. OF IL
Reel/Frame 005610/0253 →
Assignment of Assignors Interest. Feb 25, 1991
From: GENERAL SIGNAL CORPORATION, A CORP. OF NY
To: SPEEDFAM CORPORATION, 509 NORTH THIRD AVE., DES PLAINES, IL 60016 A CORP. OF IL
Reel/Frame 005610/0747 →
Assignment of Assignors Interest. Feb 25, 1991
From: GENERAL SIGNAL CORPORATION, A CORP. OF NY
To: SPEEDFAM CORPORATION, 509 NORTH THIRD AVE., DES PLAINES, IL 60016 A CORP. OF IL
Reel/Frame 005610/0752 →
Assignment of Assignors Interest. Mar 4, 1991
From: FAMTEC INTERNATIONAL, INC.
To: SPEEDFAM CORPORATION, A CORP. OF ILLINOIS
Reel/Frame 005622/0185 →
Merger 5/1/91 Delaware Mar 7, 1991
From: SPITFIRE TOOL & MACHINE CO., INC., A CORP. OF IL (MERGED INTO); GENERAL SIGNAL CORPORATION, A CORP. OF NY (CHANGED INTO)
To: NEW SPITFIRE, INC., A CORP. OF DE
Reel/Frame 005642/0052 →
Security Interest 12/21/83 Mar 7, 1991
From: SPITFIRE TOOL & MACHINE CO., INC., A CORP. OF DE (MERGED INTO)
To: GENERAL SIGNAL CORPORATION, A CORP. OF NY
Reel/Frame 005642/0064 →
Assignment of Assignors Interest. Mar 20, 1991
From: GENERAL SIGNAL CORPORATION, A CORP. OF NY
To: SPEEDFAM CORPORATION
Reel/Frame 005639/0303 →
Assignment of Assignors Interest. Nov 7, 1991
From: CESNA, JOSEPH V.
To: SPEEDFAM CORPORATION, AN IL CORP.
Reel/Frame 005910/0561 →
Assignment of Assignors Interest. May 4, 1992
From: GOSIS, ANATOLY
To: GENERAL SIGNAL CORPORATION A CORP. OF NEW YORK
Reel/Frame 006107/0471 →
Assignment of Assignors Interest. Aug 5, 1992
From: KARLSRUD, CHRIS E.; VAN WOERKOM, ANTHONY G.; ODAGIRI, SHIGERU; NAGAHASHI, ISAO
To: SPEEDFAM CORPORATION
Reel/Frame 006234/0860 →
Assignment of Assignor's Interest Sep 7, 1993
From: SPEEDFAM CORPORATION
To: WESTECH SYSTEMS INC.
Reel/Frame 006689/0845 →
Assignment of Assignor's Interest Aug 9, 1995
From: CESNA, JOSEPH V.; KARLSRUD, CHRIS E.; PRESTON, SPENCER
To: SPEEDFAM CORPORATION
Reel/Frame 007622/0876 →
Assignment of Assignor's Interest Mar 25, 1996
From: ARAI, HATSUYUKI
To: SPEEDFAM CORPORATION
Reel/Frame 007857/0780 →
Assignment of Assignor's Interest Mar 25, 1996
From: MATTINGLY, WAYNE
To: SPEEDFAM CORPORATION
Reel/Frame 007857/0804 →
Security Agreement Jun 21, 1996
From: IPEC PLANAR PHOENIX, INC.
To: FIRST INTERSTATE BANK OF ARIZONA, N.A., AS AGENT UNDER LOAN AGREEMENT DATED 4/24/96
Reel/Frame 008000/0343 →
Release of Security Agreement Feb 4, 1999
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT, FORMERLY FIRST INTERSTATE BANK OF ARIZONA, N.A.
To: IPEC PLANAR, INC.
Reel/Frame 009737/0563 →
Assignment of Assignor's Interest Sep 27, 1999
From: SPEEDFAM CORPORATION
To: SPEEDFAM-IPEC CORPORATION
Reel/Frame 010272/0472 →