Patent Assignment
Reel/Frame 075843/0247
Security Interest
Recorded: 2026-06-02
Pages: 19
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Assignors
TTM TECHNOLOGIES, INC.
Executed: 2026-06-01
TTM TECHNOLOGIES NORTH AMERICA, LLC
Executed: 2026-06-01
TELEPHONICS CORPORATION
Executed: 2026-06-01
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
WLS – DOCUMENT WORKFLOW MANAGEMENT 10 SOUTH DEARBORN STREET – FLOOR L2, MAIL CODE IL1-1190, CHICAGO, ILLINOIS, 60603
Covered Properties
(86)
Systems and Methods for Forming Stubless Plated Through Holes Having Wrapping Structures in Printed Circuit Boards
Application:
18/439,530 →
Publication:
US US20240188217A1
System and Methods for Passive Alignments of Light Transmitting or Receiving Devices to Planar Waveguides
Application:
18/593,317 →
Publication:
US US20240295705A1
Folded Circulator Device with Coupling Elements and Flex Connections for Interconnects and Methods of Fabricating the Circulator Device
Design of Stacked Double Junction Circulator Device and Methods for Fabrication
Fast Switching and Ultra-Low Power Compact Varactor Driver
Application:
18/641,063 →
Publication:
US US20240356509A1
Systems and Methods for Removing Undesired Metal Within Vias from Printed Circuit Boards
Methods for Precision Alignment of Micro-Electro-Mechanical System (Mems) Micro-Mirrors of Optical Printed Circuit Board (Pcb)
Application:
18/785,880 →
Publication:
US US20260029597A1
Systems and Methods for Baluns Optimized for Wideband Balanced Properties
Application:
19/142,627 →
X-Cross Non-Circular Micro Vias for Layer Interconnect in Printed Wiring Board
Application:
19/366,265 →
Publication:
US US20260113843A1
Radio Frequency Front-End Module with Embedded Circulators
Application:
19/424,743 →
Publication:
US US20260173253A1
Systems and Methods for Removing Undesired Metal Within Vias from Printed Circuit Boards
Application:
17/511,333 →
Publication:
US US20220053641A1
Bidirectional Integrated Cmos Switch
Bidirectional Integrated Cmos Switch
System and Method for Providing Accurate Position Location Information to Military Forces in a Disadvantaged Signal Environment
Patent:
10,591,609 →
Application:
15/866,849 →
Air-Cooled Heat Exchanger and Thermal Arrangement for Stacked Electronics
Patent:
10,757,809 →
Application:
16/203,999 →
Air-Cooled Heat Exchanger and Thermal Arrangement for Stacked Electronics
System and Method for Providing Accurate Position Location Information to Military Forces in a Disadvantaged Signal Environment
Monopulse Secondary Surveillance Radar System
Patent:
11,320,528 →
Application:
17/088,768 →
Compact Radar with X Band Long-Distance Weather Monitoring & W Band High-Resolution Obstacle Imaging for Landing in a Degraded Visual Environment
Patent:
11,493,622 →
Application:
16/270,046 →
Gps Denial Detection and Reporting and Mitigation
Patent:
11,698,461 →
Application:
17/121,853 →
AESA True Dual Beam Full Range, Full Doppler Spectrum Imaging While Scanning Radar System
Patent:
12,523,756 →
Application:
17/543,891 →
High-Density Optical Waveguide Structure and Printed Circuit Board and Preparation Method Thereof
Circuitized Substrate with Soler-Coated Microparticle Paste Connections, Multilayered Substrate Assembly, Electrical Assembly and Information Handling System Utilizing Same and Method of Making Said Substrate
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method of Making Circuitized Substrate with Internal Optical Pathway
Method of Making Circuitized Substrate with Solder Paste Connections
Method of Making a Circuitized Substrate with Enhanced Circuitry and Electrical Assembly Utilizing Said Substrate
Method of Providing a Printed Circuit Board with an Edge Connection Portion and/or a Plurality of Cavities Therein
Circuitized Substrate with Shielded Signal Lines and Plated-Thru-Holes and Method of Making Same, and Electrical Assembly and Information Handling System Utilizing Same
Halogen-Free Circuitized Substrate with Reduced Thermal Expansion, Method of Making Same, Multilayered Substrate Structure Utilizing Same, and Information Handling System Utilizing
Method of Providing a Printed Circuit Board with an Edge Connection Portion
Circuitized Substrate with Internal Cooling Structure and Electrical Assembly Utilizing Same
Circuitized Substrate with Internal Stacked Semiconductor Chips, Method of Making Same, Electrical Assembly Utilizing Same and Information Handling System Utilizing Same
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Circuitized Substrate with Conductive Paste, Electrical Assembly Including Said Circuitized Substrate and Method of Making Said Substrate
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Methods of Manufacturing a Printed Wiring Board Having Copper Wrap Plated Hole
Methods of Manufacturing Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Printed Circuit Board with Embedded Heater
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method for Anchoring a Conductive Cap on a Filled via in a Printed Circuit Board and Printed Circuit Board with an Anchored Conductive Cap
Near-Hermetic Package with Flexible Signal Input and Output
Multi-Layer Embedded Capacitance and Resistance Substrate Core
Circuit Board Multi-Functional Hole System and Method
Systems and Methods of Manufacturing Printed Circuit Boards Using Blind and Internal Micro Vias to Couple Subassemblies
Inverted Style Balun with Dc Isolated Differential Ports
Vertical Inter-Digital Coupler
Surface Mount Stripline Devices Having Ceramic and Soft Board Hybrid Materials
Coupler Device
Patent:
8,044,749 →
Application:
12/392,649 →
Magnetic Instrument Pickup
Compact Balun
Impedance Transforming Coupler
Wideband Doherty Amplifier Network
High Power RF Circuit
Patent:
8,969,733 →
Application:
14/041,155 →
Compact Broadband Impedance Transformer
First and Second Microstrip Networks Stacked in an Inverted Arrangement to Each Other Using an Integrated Support and Shielding Structure
Doherty Power Amplifier Network
Hybrid Coupler Device Having Plural Transmission Line Structures with Unwound-Rewound Geometry
Stress Relieved High Power Rf Circuit
Self-Cascadable Phase Shifter
Method of Fabricating a Printed Circuit Board Interconnect Assembly
Wideband Rf Device
Rf Attenuator Device and System
Rf Termination
Circulator with Modified Bias to Prevent Higher Order Modes
Wideband Gysel Power Divider
Impedance Matching Component
Wideband Termination for High Power Applications
Patent:
10,772,193 →
Application:
16/705,703 →
Methods for Fabricating Printed Circuit Board Assemblies with High Density via Array
High Powered Rf Part for Improved Manufacturability
Three-Dimensional Circuit Assembly with Composite Bonded Encapsulation
Directional Couplers with Dc Insulated Input and Output Ports
Wideband Termination for High Power Applications
Method of Manufacturing Printed Circuit Board Assemblies with Engineered Thermal Paths
Systems and Methods for Removing Undesired Metal Within Vias from Printed Circuit Boards
High Powered Rf Part for Improved Manufacturability
Methods for Forming Engineered Thermal Paths of Printed Circuit Boards by Use of Removable Layers
Circulator Design and Methods of Fabricating the Circulator
Surface Mountable Circulator
Method of Manufacturing a Printed Circuit Board
Systems and Methods for Forming Stubless Plated Through-Holes Having Wrapping Structures in Printed Circuit Boards
PCT:
PCT/US2025/015643 ↗
Radio Frequency Front-End Module with Embedded Circulators
PCT:
PCT/US2025/060267 ↗
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2014
From: SIMMONDS, HAROLD
To: TELEPHONICS CORPORATION
Reel/Frame 034891/0386 →
Assignment of Assignor's Interest
Mar 12, 2018
From: SIMMONDS, HAROLD
To: TELEPHONICS CORPORATION
Reel/Frame 045174/0333 →
Assignment of Assignor's Interest
Apr 2, 2018
From: PIERRO, JOHN ANTHONY, MR.
To: TELEPHONICS CORPORATION
Reel/Frame 045409/0152 →
Assignment of Assignor's Interest
Feb 21, 2019
From: VAYSMAN, ALEKSANDER, MR.
To: TELEPHONICS CORPORATION
Reel/Frame 049910/0204 →
Security Agreement
Mar 14, 2019
From: ATT SOUTHERN LLC; TELEPHONICS CORPORATION; THE AMES COMPANIES, INC.; CLOPAY BUILDING PRODUCTS COMPANY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 048604/0092 →
Assignment of Assignor's Interest
Mar 20, 2019
From: MC PARTLAND, GEORGE, MR.
To: TELEPHONICS CORPORATION
Reel/Frame 048642/0837 →
Assignment of Assignor's Interest
May 14, 2019
From: PIERRO, JOHN; RESNICK, SETH; KRABAK, RICHARD
To: TELEPHONICS CORPORATION
Reel/Frame 049165/0551 →
Assignment of Assignor's Interest
Jul 30, 2019
From: VAYSMAN, ALEKSANDER
To: TELEPHONICS CORPORATION
Reel/Frame 049897/0699 →
Security Agreement
Jan 30, 2020
From: CLOPAY CORPORATION; THE AMES COMPANIES, INC.; ATT SOUTHERN LLC; CORNELLCOOKSON, LLC
To: BANK OF AMERICA, N.A.
Reel/Frame 051759/0652 →
Assignment of Assignor's Interest
Jun 2, 2020
From: PIERRO, JOHN ANTHONY
To: TELEPHONICS CORPORATION
Reel/Frame 052809/0225 →
Assignment of Assignor's Interest
Sep 8, 2020
From: MC PARTLAND, GEORGE; VAYSMAN, ALEKSANDER
To: TELEPHONICS CORPORATION
Reel/Frame 053710/0669 →
Assignment of Assignor's Interest
Feb 3, 2021
From: MESSINA, FRANK D.; PATEL, BHAVESH M.
To: TELEPHONICS CORPORATION
Reel/Frame 055122/0616 →
Assignment of Assignor's Interest
Feb 16, 2021
From: SHI, XINHONG; FU, HAITAO; ZHANG, JUN; ZHOU, HUAMEI
To: TTM TECHNOLOGIES INC.
Reel/Frame 055276/0703 →
Assignment of Assignor's Interest
Mar 17, 2021
From: MESSINA, FRANK D.; STEIN, MICHAEL
To: TELEPHONICS CORPORATION
Reel/Frame 055614/0078 →
Assignment of Assignor's Interest
Nov 18, 2021
From: NEELY, MATTHEW DOUGLAS; KONRAD, JOHN; LEHRER, MACE
To: TTM TECHNOLOGIES INC.
Reel/Frame 058156/0751 →
Assignment of Assignor's Interest
Jan 13, 2022
From: ONORATO, JAMES; LO MONTE, LORENZO; MALONEY-HAHN, JUSTIN
To: TELEPHONICS CORPORATION
Reel/Frame 058639/0843 →
Security Agreement
Jan 24, 2022
From: CORNELLCOOKSON, LLC; TELEPHONICS CORPORATION; THE AMES COMPANIES, INC.; HUNTER FAN COMPANY
To: BANK OF AMERICA, N.A.
Reel/Frame 058886/0438 →
Partial Release of Security Interest
Jun 27, 2022
From: BANK OF AMERICA, N.A.
To: TELEPHONICS CORPORATION
Reel/Frame 060443/0941 →
Corrective Assignment to Correct the Patent Numbers 10849228 and 11280914 Which Were Mistakenly Input as Application Numbers. Previously Recorded on Reel 060443 Frame 0941. Assignor(S) Hereby Confirms the Partial Release of Security Interest.
Aug 2, 2022
From: BANK OF AMERICA, N.A.
To: TELEPHONICS CORPORATION
Reel/Frame 061045/0214 →
Security Interest (Abl)
Aug 10, 2022
From: TELEPHONICS CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061144/0147 →
Security Interest (Term Loan)
Aug 10, 2022
From: TELEPHONICS CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061144/0162 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Corrective Assignment to Correct the Asssinee's Name Previously Recorded at Reel: Frame: . Assignor(S) Hereby Confirms the Assignment.
Aug 17, 2023
From: SHI, XINHONG; FU, HAITAO; ZHANG, JUN; ZHOU, HUAMEI
To: TTM TECHNOLOGIES, INC.
Reel/Frame 064622/0725 →
Assignment of Assignor's Interest
Apr 9, 2024
From: NEELY, MATTHEW DOUGLAS; KONRAD, JOHN JOSEPH; MCKAY, JAMES GILBERT; GRIFFIE, CALEB LATHAN
To: TTM TECHNOLOGIES, INC.
Reel/Frame 067051/0001 →