IP Library › Assignment 023826/0725
Patent Assignment
Reel/Frame 023826/0725

Security Agreement

Recorded: 2010-01-19 Received: 2010-01-19 Pages: 22
Assignor
Assignee
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
270 PARK AVENUE, NEW YORK, NY, 10017, UNITED STATES
Covered Properties (97)
Charge Pump Controller and Method Therefor
Application: 11/815,843 →
Charge Pump Controller and Method Therefor
Application: 12/090,825 →
Ground Fault Circuit Interrupter and Method
Application: 12/572,870 →
High Voltage Sensor Device and Method Therefor
Application: 12/570,300 →
Method for Manufacturing a Semiconductor Component
Application: 12/569,732 →
Electronic Package Having Down-Set Leads and Method
Application: 11/575,204 →
Alignment of Trench for Mos
Application: 12/560,025 →
Method of Forming a Power Supply Controller and System Therefor
Method for Detecting a Current and Compensating for an Offset Voltage and Circuit
Application: 12/557,206 →
Method of Forming a Molded Array Package Device Having an Exposed Tab and Structure
Application: 12/553,706 →
Semiconductor Component and Method of Manufacture
Application: 12/549,100 →
Transistor Diagnostic Circuit
Application: 12/548,293 →
Method of Forming a Leaded Molded Array Package
Application: 12/535,475 →
Edge Seal for a Semiconductor Device and Method Therefor
Application: 12/499,241 →
Edge Seal for a Semiconductor Device
Application: 12/499,429 →
Method of Forming an Mos Transistor
Application: 12/236,718 →
Power Semiconductor Device Having Improved Performance and Method
Application: 12/236,947 →
Method of Forming an Integrated Semiconductor Device and Structure Therefor
Application: 12/208,537 →
Semiconductor Trench Structure Having a Sealing Plug and Method
Application: 12/206,541 →
Thinned Semiconductor Wafer and Method of Thinning a Semiconductor Wafer
Application: 12/206,043 →
Semiconductor Component and Method of Manufacture
Application: 12/206,570 →
Semiconductor Device Having Vertical Charge-Compensated Structure and Sub-Surface Connecting Layer and Method
Application: 12/206,516 →
Current Limited Voltage Supply
Application: 12/196,983 →
Low Side Driver
Application: 12/188,962 →
Charge Pump Converter and Method Therefor
Application: 12/161,387 →
Method of Thinning a Semiconductor Wafer Using a Film Frame
Application: 12/172,075 →
Low Clamp Voltage Esd Device and Method Therefor
Application: 12/170,630 →
Method of Forming a Shielded Semiconductor Device and Structure Therefor
Application: 12/170,202 →
Method of Forming a Bi-Directional Diode and Structure Therefor
Application: 12/134,401 →
Semiconductor Device Having Enhanced Performance and Method
Application: 12/131,295 →
Method of Forming an Oscillator Circuit and Structure Therefor
Application: 12/126,122 →
Transient Voltage Suppressor and Method
Application: 12/116,745 →
Method for Manufacturing an Energy Storage Device and Structure Therefor
Application: 12/108,361 →
Encapsulated Chip Scale Package Having Flip-Chip on Lead Frame Structure
Application: 12/107,568 →
Amplifier Circuit and Method Therefor
Application: 12/091,152 →
Method for Adjusting Threshold Voltage and Circuit Therefor
Application: 12/098,847 →
Method of Forming a Semiconductor Package and Structure Therefor
Application: 12/098,813 →
System Unit Element Selection
Application: 12/098,357 →
Transient Voltage Suppressor and Methods
Application: 12/098,369 →
Method of Forming a Power Supply Controller and Structure Therefor
Application: 12/056,531 →
Amplification Circuit and Method Therefor
Application: 11/817,392 →
Method of Manufacturing a Semiconductor Component with a Low Cost Leadframe Using a Non-Metallic Base Structure
Application: 12/049,909 →
Programmable Crystal Oscillator
Application: 12/045,224 →
Semiconductor Package Structure for Vertical Mount and Method
Application: 12/017,856 →
Method of Forming a Charge Pump Controller and Structure Therefor
Application: 11/996,475 →
Multi-Phase Power Supply Controller and Method Therefor
Application: 11/970,326 →
Monolithically Integrated Multiplexer-Translator-Demultiplexer Circuit and Method
Application: 11/966,723 →
Method of Forming a Power Supply Controller and Structure Therefor
Application: 11/917,327 →
Method of Forming a Pwm Controller and Structure Therefor
Application: 11/954,546 →
Power Supply Controller and Method Therefor
Application: 11/917,315 →
Pwm Controller Having Drive Control with Input Voltage Sensing and Method Therefor
Application: 11/954,506 →
Regulated Charge Pump and Method Therefor
Application: 11/916,508 →
Method for Manufacturing a Semiconductor Component That Includes a Field Plate
Application: 11/931,606 →
Semiconductor Component and Method of Manufacture
Application: 11/931,994 →
Power Supply Controller and Method Therefor
Application: 11/930,933 →
High Voltage Sensor Device
Application: 11/925,017 →
Single Input Dual Output Voltage Power Supply and Method Therefor
Application: 11/912,795 →
Self-Aligned Transistor
Application: 11/864,327 →
Multi-Chip Semiconductor Connector Assemblies
Application: 11/860,379 →
Method of Forming Low Capacitance Esd Device and Structure Therefor
Application: 11/859,570 →
Multi-Channel Esd Device and Method Therefor
Application: 11/859,624 →
Method of Forming a High Capacitance Diode and Structure Therefor
Application: 11/859,638 →
Flip Chip Structure and Method of Manufacture
Application: 11/858,289 →
Low-IF Transceiver Architecture and Antenna
Application: 60/972,341 →
Semiconductor Component and Method of Manufacture
Application: 11/850,153 →
Dc-Dc Converter Controller Having Optimized Load Transient Response and Method
Application: 11/817,766 →
Method of Forming an Esd Detector and Structure Therefor
Application: 11/843,822 →
Method of Forming a Buck-Boost Mode Power Supply Controller and Structure Therefor
Application: 11/816,699 →
Method of Forming an Mos Transistor and Structure Therefor
Application: 11/840,826 →
Low Power Voltage Detection Circuit and Method Therefor
Application: 11/815,835 →
Semiconductor Die Singulation Method
Application: 11/834,924 →
Amplification Circuit and Method Therefor
Application: 11/815,431 →
Power Supply Control Method and Structure Therefor
Application: 11/814,656 →
Current Controller and Method Therefor
Application: 11/814,660 →
Pwm Controller and Method Therefor
Application: 11/780,611 →
Vertical Mos Transistor and Method Therefor
Application: 11/777,893 →
Led Current Controller and Method Therefor
Application: 11/813,985 →
Power Supply Controller and Method Therefor
Application: 11/776,843 →
Communication Circuit and Method Therefor
Application: 11/720,860 →
Method of Forming a Current Sense Circuit and Structure Therefor
Application: 11/719,998 →
Method of Forming a Charge Pump Controller and Structure Therefor
Digital Compensation Tuning for Switching Power Supply Control
Application: 11/735,615 →
Dc-To-Dc Converter and Method Therefor
Application: 11/576,030 →
Switching Power Supply Controller with High Frequency Current Balance
Application: 11/685,091 →
Switching Power Supply Controller with Unidirectional Transient Gain Change
Application: 11/555,460 →
Diagnostic and Maintenance Systems and Methods for Led Power Management Integrated Circuits
Application: 11/535,047 →
Circuit and Mathod for Regulating Voltage
Application: 11/424,222 →
Semiconductor Device Having Trench Charge Compensation Regions and Method
Application: 11/442,733 →
Power Supply Output Monitor
Application: 11/367,003 →
Switching Power Supply Control
Application: 11/109,466 →
Antenna integrated with retrieval component of hearing aid
Application: 10/975,914 →
Boosted Switch Drive with Charge Transfer
Application: 10/976,196 →
Power Conversion Integrated Circuit and Method for Programming
Application: 10/946,611 →
Switched Noise Filter Circuit for a Dc-Dc Converter
Application: 10/762,650 →
Fan Speed Control System
Application: 10/178,436 →
Hiccup-Mode Short Circuit Protection Circuit and Method for Linear Voltage Regulators
Application: 09/882,998 →
Four Current Transistor Temperature Sensor and Method
Application: 09/837,816 →